JPS6367342B2 - - Google Patents

Info

Publication number
JPS6367342B2
JPS6367342B2 JP4531183A JP4531183A JPS6367342B2 JP S6367342 B2 JPS6367342 B2 JP S6367342B2 JP 4531183 A JP4531183 A JP 4531183A JP 4531183 A JP4531183 A JP 4531183A JP S6367342 B2 JPS6367342 B2 JP S6367342B2
Authority
JP
Japan
Prior art keywords
normally
forming
semiconductor layer
type
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4531183A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172272A (ja
Inventor
Masahiro Akyama
Seiji Nishi
Yasushi Kawakami
Toshimasa Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP4531183A priority Critical patent/JPS59172272A/ja
Publication of JPS59172272A publication Critical patent/JPS59172272A/ja
Publication of JPS6367342B2 publication Critical patent/JPS6367342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8252—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
JP4531183A 1983-03-19 1983-03-19 半導体装置の製造方法 Granted JPS59172272A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4531183A JPS59172272A (ja) 1983-03-19 1983-03-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4531183A JPS59172272A (ja) 1983-03-19 1983-03-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59172272A JPS59172272A (ja) 1984-09-28
JPS6367342B2 true JPS6367342B2 (fr) 1988-12-26

Family

ID=12715760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4531183A Granted JPS59172272A (ja) 1983-03-19 1983-03-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59172272A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200149A (ja) * 2008-02-20 2009-09-03 Sanken Electric Co Ltd 半導体スイッチング装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2655594B2 (ja) * 1984-01-10 1997-09-24 日本電気株式会社 集積型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200149A (ja) * 2008-02-20 2009-09-03 Sanken Electric Co Ltd 半導体スイッチング装置

Also Published As

Publication number Publication date
JPS59172272A (ja) 1984-09-28

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