JPS6360533B2 - - Google Patents
Info
- Publication number
- JPS6360533B2 JPS6360533B2 JP56152632A JP15263281A JPS6360533B2 JP S6360533 B2 JPS6360533 B2 JP S6360533B2 JP 56152632 A JP56152632 A JP 56152632A JP 15263281 A JP15263281 A JP 15263281A JP S6360533 B2 JPS6360533 B2 JP S6360533B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor element
- supporter
- semiconductor
- convex electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/072—
-
- H10W72/07236—
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152632A JPS5853838A (ja) | 1981-09-26 | 1981-09-26 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152632A JPS5853838A (ja) | 1981-09-26 | 1981-09-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5853838A JPS5853838A (ja) | 1983-03-30 |
| JPS6360533B2 true JPS6360533B2 (index.php) | 1988-11-24 |
Family
ID=15544626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56152632A Granted JPS5853838A (ja) | 1981-09-26 | 1981-09-26 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5853838A (index.php) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122460U (ja) * | 1991-04-15 | 1992-11-04 | 三菱自動車工業株式会社 | 工作物固定装置 |
| JP2002270634A (ja) * | 2001-03-08 | 2002-09-20 | Rohm Co Ltd | 半導体装置 |
| JP2007318182A (ja) * | 2007-09-03 | 2007-12-06 | Rohm Co Ltd | 半導体装置 |
| JP2011044755A (ja) * | 2010-12-03 | 2011-03-03 | Rohm Co Ltd | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427714B2 (index.php) * | 1972-03-31 | 1979-09-11 |
-
1981
- 1981-09-26 JP JP56152632A patent/JPS5853838A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5853838A (ja) | 1983-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3219043B2 (ja) | 半導体装置のパッケージ方法および半導体装置 | |
| JP2001326236A (ja) | 半導体装置の製造方法 | |
| JPS6360533B2 (index.php) | ||
| JPS5821850A (ja) | 樹脂封止型半導体装置 | |
| JP2646989B2 (ja) | チップキャリア | |
| JPS59117250A (ja) | 半導体装置 | |
| JPH1197569A (ja) | 半導体パッケージ | |
| JPH06216194A (ja) | 半導体チップの実装構造 | |
| JP2841822B2 (ja) | 混成集積回路の製造方法 | |
| JPH0661368A (ja) | フリップチップ型半導体装置 | |
| JPH11150155A (ja) | 半導体装置の製造方法および当該方法に用いる回路基板保持具 | |
| JP2785722B2 (ja) | 樹脂封止型半導体装置 | |
| JP2712967B2 (ja) | 半導体装置 | |
| JPH0583186B2 (index.php) | ||
| JPH11150154A (ja) | 回路基板保持装置および該装置を用いた半導体装置の製造方法 | |
| JPS62195137A (ja) | 半導体装置 | |
| JPH0936119A (ja) | 半導体装置及びその製造方法並びにその半導体装置を用いた半導体ユニット | |
| JPS62265734A (ja) | 混成集積回路装置 | |
| JPH06232199A (ja) | フリップチップicの実装構造 | |
| JPH04335540A (ja) | 半導体装置の製造方法 | |
| JP2504465B2 (ja) | 半導体装置 | |
| JPH05283555A (ja) | 半導体装置 | |
| JPH0287654A (ja) | 表面実装型半導体装置 | |
| JPH09275161A (ja) | 半導体装置 | |
| JPS63150931A (ja) | 半導体装置 |