JPS635906B2 - - Google Patents
Info
- Publication number
- JPS635906B2 JPS635906B2 JP15667583A JP15667583A JPS635906B2 JP S635906 B2 JPS635906 B2 JP S635906B2 JP 15667583 A JP15667583 A JP 15667583A JP 15667583 A JP15667583 A JP 15667583A JP S635906 B2 JPS635906 B2 JP S635906B2
- Authority
- JP
- Japan
- Prior art keywords
- diode
- leadless
- magazine
- stud
- glass tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 9
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15667583A JPS6047450A (ja) | 1983-08-26 | 1983-08-26 | リ−ドレスダイオ−ドの電極の半田メツキ方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15667583A JPS6047450A (ja) | 1983-08-26 | 1983-08-26 | リ−ドレスダイオ−ドの電極の半田メツキ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6047450A JPS6047450A (ja) | 1985-03-14 |
JPS635906B2 true JPS635906B2 (US06256357-20010703-M00001.png) | 1988-02-05 |
Family
ID=15632851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15667583A Granted JPS6047450A (ja) | 1983-08-26 | 1983-08-26 | リ−ドレスダイオ−ドの電極の半田メツキ方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6047450A (US06256357-20010703-M00001.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0451702Y2 (US06256357-20010703-M00001.png) * | 1986-09-04 | 1992-12-04 | ||
JPH0510725Y2 (US06256357-20010703-M00001.png) * | 1986-09-04 | 1993-03-16 |
-
1983
- 1983-08-26 JP JP15667583A patent/JPS6047450A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0451702Y2 (US06256357-20010703-M00001.png) * | 1986-09-04 | 1992-12-04 | ||
JPH0510725Y2 (US06256357-20010703-M00001.png) * | 1986-09-04 | 1993-03-16 |
Also Published As
Publication number | Publication date |
---|---|
JPS6047450A (ja) | 1985-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6554976B1 (en) | Electroplating apparatus | |
US4554228A (en) | Negative electrode for lead accumulators | |
CN102376588A (zh) | 用于半导体芯片封装的侧可润湿电镀 | |
JPH0665731B2 (ja) | 半導体その他の電子デバイス用気密封止容器製造用の新規なニツケルーインジウム合金 | |
JPH01143209A (ja) | 電子部品チップ保持治具および電子部品チップのメタライズ面への金属コーティング方法 | |
US6127205A (en) | Process for manufacturing a molded electronic component having pre-plated lead terminals | |
JPS635906B2 (US06256357-20010703-M00001.png) | ||
JP3620531B2 (ja) | 電子部品およびめっき治具ならびにそれを用いためっき方法 | |
JP3503325B2 (ja) | 電気めっき用陰極治具 | |
JPH04341598A (ja) | 電気めっき用陽極構体 | |
JP2943334B2 (ja) | メッキ方法及び同方法に用いるメッキ用ラック | |
JP2611431B2 (ja) | 均一部分電気メッキ法 | |
US3692638A (en) | Process for supporting and nonuniformly treating articles | |
US2824027A (en) | Method of making low resistance contact with a lead dioxide electrode | |
JP3229259B2 (ja) | 小物部品メッキ装置及び方法 | |
JP2006193806A (ja) | めっき電極、めっき治具およびそれを用いた電子部品のめっき方法 | |
JPH0813198A (ja) | 接触導通用電極及びそれを用いた半導体製造装置 | |
JPH0536698A (ja) | ウエーハメツキ用治具 | |
JPS6013297B2 (ja) | 固体電解コンデンサの製造方法 | |
JP3454283B2 (ja) | 海水電池 | |
JPS57111056A (en) | Semiconductor device | |
JPH10298798A (ja) | リードフレームのメッキ装置及びその方法 | |
JPS6210316B2 (US06256357-20010703-M00001.png) | ||
JP2003321799A (ja) | 電気めっき装置 | |
JP4810456B2 (ja) | チップ形固体電解コンデンサおよびその製造方法 |