JPS635593A - プリント配線板の製造方法 - Google Patents

プリント配線板の製造方法

Info

Publication number
JPS635593A
JPS635593A JP14878786A JP14878786A JPS635593A JP S635593 A JPS635593 A JP S635593A JP 14878786 A JP14878786 A JP 14878786A JP 14878786 A JP14878786 A JP 14878786A JP S635593 A JPS635593 A JP S635593A
Authority
JP
Japan
Prior art keywords
solder resist
land
wiring board
printed wiring
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14878786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558278B2 (enrdf_load_stackoverflow
Inventor
大谷 泰章
尾留川 房雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
CMK Corp
Original Assignee
Nippon CMK Corp
CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp, CMK Corp filed Critical Nippon CMK Corp
Priority to JP14878786A priority Critical patent/JPS635593A/ja
Publication of JPS635593A publication Critical patent/JPS635593A/ja
Publication of JPH0558278B2 publication Critical patent/JPH0558278B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14878786A 1986-06-25 1986-06-25 プリント配線板の製造方法 Granted JPS635593A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14878786A JPS635593A (ja) 1986-06-25 1986-06-25 プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14878786A JPS635593A (ja) 1986-06-25 1986-06-25 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS635593A true JPS635593A (ja) 1988-01-11
JPH0558278B2 JPH0558278B2 (enrdf_load_stackoverflow) 1993-08-26

Family

ID=15460675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14878786A Granted JPS635593A (ja) 1986-06-25 1986-06-25 プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS635593A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096868U (ja) * 1983-12-07 1985-07-02 株式会社ケンウッド プリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096868U (ja) * 1983-12-07 1985-07-02 株式会社ケンウッド プリント配線板

Also Published As

Publication number Publication date
JPH0558278B2 (enrdf_load_stackoverflow) 1993-08-26

Similar Documents

Publication Publication Date Title
JPS61288493A (ja) 回路基板の部品端子番号表示方法
US20020112348A1 (en) Component mounting method
US5010448A (en) Printed circuit board
US4779339A (en) Method of producing printed circuit boards
JPS635593A (ja) プリント配線板の製造方法
US5219607A (en) Method of manufacturing printed circuit board
JP2561642B2 (ja) プリント配線板用部品位置決めマークの形成法
JPH07123180B2 (ja) 回路基板装置の製造方法
JPS61110490A (ja) プリント基板へのレジスト膜形成方法
JPH02148884A (ja) 電子部品塔載ランドとその形成方法
JPS58102597A (ja) 電子回路基板
JPH07304Y2 (ja) 半田ペ−スト印刷用マスク
JP2606304B2 (ja) クリーム半田印刷方法
JPS6141272Y2 (enrdf_load_stackoverflow)
JPS61264783A (ja) プリント配線板とその製造方法
JPH0714673U (ja) 混成集積回路基板
JPH05129767A (ja) プリント配線基板
JPS5849653Y2 (ja) プリント配線板
JPH0548257A (ja) プリント基板の製造方法
JPH0637431A (ja) 表面実装用基板のランドパターン
JPH0383393A (ja) プリント配線板
JPH08130361A (ja) プリント配線基板
JPH0634710Y2 (ja) プリント配線板
JPH07111374A (ja) プリント配線基板及びその製造方法
JPS60187086A (ja) プリント板の表示方法