JPH0558278B2 - - Google Patents

Info

Publication number
JPH0558278B2
JPH0558278B2 JP61148787A JP14878786A JPH0558278B2 JP H0558278 B2 JPH0558278 B2 JP H0558278B2 JP 61148787 A JP61148787 A JP 61148787A JP 14878786 A JP14878786 A JP 14878786A JP H0558278 B2 JPH0558278 B2 JP H0558278B2
Authority
JP
Japan
Prior art keywords
land
solder resist
circuit pattern
solder
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61148787A
Other languages
English (en)
Japanese (ja)
Other versions
JPS635593A (ja
Inventor
Yasuaki Ootani
Fusao Orukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Priority to JP14878786A priority Critical patent/JPS635593A/ja
Publication of JPS635593A publication Critical patent/JPS635593A/ja
Publication of JPH0558278B2 publication Critical patent/JPH0558278B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14878786A 1986-06-25 1986-06-25 プリント配線板の製造方法 Granted JPS635593A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14878786A JPS635593A (ja) 1986-06-25 1986-06-25 プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14878786A JPS635593A (ja) 1986-06-25 1986-06-25 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS635593A JPS635593A (ja) 1988-01-11
JPH0558278B2 true JPH0558278B2 (enrdf_load_stackoverflow) 1993-08-26

Family

ID=15460675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14878786A Granted JPS635593A (ja) 1986-06-25 1986-06-25 プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS635593A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096868U (ja) * 1983-12-07 1985-07-02 株式会社ケンウッド プリント配線板

Also Published As

Publication number Publication date
JPS635593A (ja) 1988-01-11

Similar Documents

Publication Publication Date Title
US5368883A (en) Method and stencil design for printing non-planar hybrid circuits
US20020112348A1 (en) Component mounting method
US5010448A (en) Printed circuit board
JPH08236914A (ja) プリント配線板表面取付パッドの半田マスク
US4779339A (en) Method of producing printed circuit boards
JPH0558278B2 (enrdf_load_stackoverflow)
JP2561642B2 (ja) プリント配線板用部品位置決めマークの形成法
JPS5853890A (ja) 電子部品のはんだ付け方法
JPH02148884A (ja) 電子部品塔載ランドとその形成方法
JP2606304B2 (ja) クリーム半田印刷方法
JPH0767001B2 (ja) 電子部品用基板
JPH07304Y2 (ja) 半田ペ−スト印刷用マスク
JPS5849653Y2 (ja) プリント配線板
JPH06326446A (ja) 基板の製造方法及び基板
JPH0516199B2 (enrdf_load_stackoverflow)
JPH04373156A (ja) クリーム半田接続方法
JP2603863B2 (ja) プリント配線板
JPH0634710Y2 (ja) プリント配線板
JPS63204790A (ja) プリント配線板
JPH09135070A (ja) プリント基板
JPH01217994A (ja) 印刷配線板
JPH0621604A (ja) チップ電子部品表面実装回路基板装置
JPH0655277U (ja) 部品実装回路基板
JPH0548257A (ja) プリント基板の製造方法
JPH08255969A (ja) プリント基板装置