JPS6354800A - 多層プリント配線板の製造方法 - Google Patents
多層プリント配線板の製造方法Info
- Publication number
- JPS6354800A JPS6354800A JP19929986A JP19929986A JPS6354800A JP S6354800 A JPS6354800 A JP S6354800A JP 19929986 A JP19929986 A JP 19929986A JP 19929986 A JP19929986 A JP 19929986A JP S6354800 A JPS6354800 A JP S6354800A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- multilayer printed
- layer
- wiring board
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000007747 plating Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 15
- 238000007788 roughening Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011253 protective coating Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19929986A JPS6354800A (ja) | 1986-08-25 | 1986-08-25 | 多層プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19929986A JPS6354800A (ja) | 1986-08-25 | 1986-08-25 | 多層プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6354800A true JPS6354800A (ja) | 1988-03-09 |
| JPH0366831B2 JPH0366831B2 (enrdf_load_stackoverflow) | 1991-10-18 |
Family
ID=16405491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19929986A Granted JPS6354800A (ja) | 1986-08-25 | 1986-08-25 | 多層プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6354800A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271590A (ja) * | 1988-09-06 | 1990-03-12 | Mitsubishi Electric Corp | ハイブリッドｉｃ用基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156375A (en) * | 1976-06-22 | 1977-12-26 | Nippon Electric Co | Method of producing multilayer circuit substrate |
| JPS5398096A (en) * | 1977-02-08 | 1978-08-26 | Nec Corp | Production of thin film metal resistor |
| JPS60124891A (ja) * | 1983-12-09 | 1985-07-03 | セイコーエプソン株式会社 | プリント回路基板の製造方法 |
| JPS6167989A (ja) * | 1984-09-11 | 1986-04-08 | 三洋電機株式会社 | 多層配線基板の製造方法 |
-
1986
- 1986-08-25 JP JP19929986A patent/JPS6354800A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156375A (en) * | 1976-06-22 | 1977-12-26 | Nippon Electric Co | Method of producing multilayer circuit substrate |
| JPS5398096A (en) * | 1977-02-08 | 1978-08-26 | Nec Corp | Production of thin film metal resistor |
| JPS60124891A (ja) * | 1983-12-09 | 1985-07-03 | セイコーエプソン株式会社 | プリント回路基板の製造方法 |
| JPS6167989A (ja) * | 1984-09-11 | 1986-04-08 | 三洋電機株式会社 | 多層配線基板の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271590A (ja) * | 1988-09-06 | 1990-03-12 | Mitsubishi Electric Corp | ハイブリッドｉｃ用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0366831B2 (enrdf_load_stackoverflow) | 1991-10-18 |
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