JPS6354238B2 - - Google Patents
Info
- Publication number
- JPS6354238B2 JPS6354238B2 JP57145153A JP14515382A JPS6354238B2 JP S6354238 B2 JPS6354238 B2 JP S6354238B2 JP 57145153 A JP57145153 A JP 57145153A JP 14515382 A JP14515382 A JP 14515382A JP S6354238 B2 JPS6354238 B2 JP S6354238B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- bent
- double
- sided mounting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14515382A JPS5934693A (ja) | 1982-08-20 | 1982-08-20 | 両面実装ハイブリツドｉｃの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14515382A JPS5934693A (ja) | 1982-08-20 | 1982-08-20 | 両面実装ハイブリツドｉｃの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5934693A JPS5934693A (ja) | 1984-02-25 |
| JPS6354238B2 true JPS6354238B2 (US08080257-20111220-C00005.png) | 1988-10-27 |
Family
ID=15378643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14515382A Granted JPS5934693A (ja) | 1982-08-20 | 1982-08-20 | 両面実装ハイブリツドｉｃの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5934693A (US08080257-20111220-C00005.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4259084B2 (ja) * | 2002-10-16 | 2009-04-30 | セイコーエプソン株式会社 | 表示体構造、表示体構造の製造方法および電子機器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437299A (en) * | 1977-08-30 | 1979-03-19 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of filamental piezo-electric material |
| JPS57120391A (en) * | 1981-01-19 | 1982-07-27 | Matsushita Electric Ind Co Ltd | Method of producing circuit board |
-
1982
- 1982-08-20 JP JP14515382A patent/JPS5934693A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437299A (en) * | 1977-08-30 | 1979-03-19 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of filamental piezo-electric material |
| JPS57120391A (en) * | 1981-01-19 | 1982-07-27 | Matsushita Electric Ind Co Ltd | Method of producing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5934693A (ja) | 1984-02-25 |
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