JPS6352775B2 - - Google Patents

Info

Publication number
JPS6352775B2
JPS6352775B2 JP56052232A JP5223281A JPS6352775B2 JP S6352775 B2 JPS6352775 B2 JP S6352775B2 JP 56052232 A JP56052232 A JP 56052232A JP 5223281 A JP5223281 A JP 5223281A JP S6352775 B2 JPS6352775 B2 JP S6352775B2
Authority
JP
Japan
Prior art keywords
lead frame
pellet
wire
wire bonding
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56052232A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57166041A (en
Inventor
Shige Yamada
Yasuo Sakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56052232A priority Critical patent/JPS57166041A/ja
Publication of JPS57166041A publication Critical patent/JPS57166041A/ja
Publication of JPS6352775B2 publication Critical patent/JPS6352775B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56052232A 1981-04-07 1981-04-07 Wire bonding method Granted JPS57166041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56052232A JPS57166041A (en) 1981-04-07 1981-04-07 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052232A JPS57166041A (en) 1981-04-07 1981-04-07 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS57166041A JPS57166041A (en) 1982-10-13
JPS6352775B2 true JPS6352775B2 (enExample) 1988-10-20

Family

ID=12908977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052232A Granted JPS57166041A (en) 1981-04-07 1981-04-07 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS57166041A (enExample)

Also Published As

Publication number Publication date
JPS57166041A (en) 1982-10-13

Similar Documents

Publication Publication Date Title
JPS63148646A (ja) 半導体装置
JPH08116007A (ja) 半導体装置
JPS6352775B2 (enExample)
JPS60120543A (ja) 半導体装置およびそれに用いるリ−ドフレ−ム
JPS5867035A (ja) 半導体装置の製造方法
JPS6344998Y2 (enExample)
JPH0332048A (ja) 半導体装置
JPH03129869A (ja) リードフレーム
JPS60101938A (ja) 半導体装置
JPH05259360A (ja) 樹脂封止型半導体装置
JPH01319955A (ja) 半導体装置
JPS62198142A (ja) 半導体装置
JPH0499339A (ja) ワイヤボンダ用ツール
JPH0794544A (ja) 半導体装置の製造方法
JPS621239A (ja) 半導体装置
JPS59181656A (ja) 半導体装置
JPH0498861A (ja) 樹脂封止型半導体装置
JPS59188954A (ja) 半導体装置
JPS6151953A (ja) 半導体装置
JPH01297834A (ja) ワイヤボンデイング方法
JPS63226035A (ja) ワイヤボンデイング方法
JPH0645499A (ja) 半導体装置
JPS5915493B2 (ja) ワイヤボンディング方法
JPH0689928A (ja) ワイヤボンディングにおけるボール圧着方法
JPS6095927A (ja) 半導体装置