JPS635248Y2 - - Google Patents
Info
- Publication number
- JPS635248Y2 JPS635248Y2 JP1982167117U JP16711782U JPS635248Y2 JP S635248 Y2 JPS635248 Y2 JP S635248Y2 JP 1982167117 U JP1982167117 U JP 1982167117U JP 16711782 U JP16711782 U JP 16711782U JP S635248 Y2 JPS635248 Y2 JP S635248Y2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- external
- hole
- electrically insulating
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16711782U JPS5970354U (ja) | 1982-11-04 | 1982-11-04 | 半導体装置の外部リ−ド取付用治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16711782U JPS5970354U (ja) | 1982-11-04 | 1982-11-04 | 半導体装置の外部リ−ド取付用治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5970354U JPS5970354U (ja) | 1984-05-12 |
JPS635248Y2 true JPS635248Y2 (US07345094-20080318-C00003.png) | 1988-02-12 |
Family
ID=30365698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16711782U Granted JPS5970354U (ja) | 1982-11-04 | 1982-11-04 | 半導体装置の外部リ−ド取付用治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5970354U (US07345094-20080318-C00003.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0777253B2 (ja) * | 1986-03-20 | 1995-08-16 | イビデン株式会社 | 半導体搭載用基板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5379273A (en) * | 1976-12-24 | 1978-07-13 | Iwaki Denshi Kk | Method of mounting lead pins to electronic circuit substrate |
JPS5654583U (US07345094-20080318-C00003.png) * | 1979-10-01 | 1981-05-13 |
-
1982
- 1982-11-04 JP JP16711782U patent/JPS5970354U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5379273A (en) * | 1976-12-24 | 1978-07-13 | Iwaki Denshi Kk | Method of mounting lead pins to electronic circuit substrate |
JPS5654583U (US07345094-20080318-C00003.png) * | 1979-10-01 | 1981-05-13 |
Also Published As
Publication number | Publication date |
---|---|
JPS5970354U (ja) | 1984-05-12 |