JPS635226Y2 - - Google Patents
Info
- Publication number
- JPS635226Y2 JPS635226Y2 JP1982004841U JP484182U JPS635226Y2 JP S635226 Y2 JPS635226 Y2 JP S635226Y2 JP 1982004841 U JP1982004841 U JP 1982004841U JP 484182 U JP484182 U JP 484182U JP S635226 Y2 JPS635226 Y2 JP S635226Y2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- filling part
- runner
- mold
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP484182U JPS58118736U (ja) | 1982-01-18 | 1982-01-18 | トランスフア−成形装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP484182U JPS58118736U (ja) | 1982-01-18 | 1982-01-18 | トランスフア−成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58118736U JPS58118736U (ja) | 1983-08-13 |
| JPS635226Y2 true JPS635226Y2 (h) | 1988-02-12 |
Family
ID=30017671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP484182U Granted JPS58118736U (ja) | 1982-01-18 | 1982-01-18 | トランスフア−成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118736U (h) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8206146B2 (en) * | 2009-12-08 | 2012-06-26 | Husky Injection Molding Systems Ltd. | Mold-tool system having a manifold body defining uninterrupted melt channels |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217366U (h) * | 1975-07-25 | 1977-02-07 | ||
| JPS54101858A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Mold |
| US4241108A (en) * | 1978-10-10 | 1980-12-23 | Rca Corporation | Sprayable titanium composition |
| JPH0216095Y2 (h) * | 1986-06-20 | 1990-05-01 |
-
1982
- 1982-01-18 JP JP484182U patent/JPS58118736U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58118736U (ja) | 1983-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0560656B2 (h) | ||
| JPH04147814A (ja) | 樹脂封入成形用金型 | |
| JP3411448B2 (ja) | 半導体素子の樹脂封止金型及び半導体装置の製造方法 | |
| JPS635226Y2 (h) | ||
| JP3727446B2 (ja) | 半導体装置の樹脂封止成形金型 | |
| JPH05175396A (ja) | リードフレーム及びモールド方法 | |
| JPS6063122A (ja) | 半導体素子の樹脂封入成形方法及びその金型装置 | |
| JP2587539B2 (ja) | 半導体装置の樹脂封止用金型 | |
| JP2644551B2 (ja) | 半導体装置製造方法及びその実施装置 | |
| JPS6120755Y2 (h) | ||
| JP2666630B2 (ja) | 半導体装置の製造方法 | |
| JPH0821667B2 (ja) | リードフレーム | |
| JPS5839868Y2 (ja) | 樹脂封止金型 | |
| JPS62150834A (ja) | 半導体装置樹脂成形方法および樹脂成形装置 | |
| JPS62125635A (ja) | 樹脂封止型半導体装置の樹脂封止方法 | |
| JPS638130Y2 (h) | ||
| JP2545409Y2 (ja) | 半導体素子封入金型 | |
| JPS59151436A (ja) | 半導体装置の樹脂封止方法 | |
| JPH09181105A (ja) | 半導体樹脂封止用金型 | |
| JPS6262435U (h) | ||
| JPS637639A (ja) | 電子素子の樹脂モ−ルド方法及びそのモ−ルド金型 | |
| JPS63237536A (ja) | 半導体製造装置 | |
| JPH0324341Y2 (h) | ||
| JP3106946B2 (ja) | 樹脂封止型半導体装置の製造方法およびその金型 | |
| JPS60187031A (ja) | トランスフアモ−ルド金型 |