JPS6351543B2 - - Google Patents

Info

Publication number
JPS6351543B2
JPS6351543B2 JP57216160A JP21616082A JPS6351543B2 JP S6351543 B2 JPS6351543 B2 JP S6351543B2 JP 57216160 A JP57216160 A JP 57216160A JP 21616082 A JP21616082 A JP 21616082A JP S6351543 B2 JPS6351543 B2 JP S6351543B2
Authority
JP
Japan
Prior art keywords
head
lead pin
hole
solder
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57216160A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59105346A (ja
Inventor
Katsuyuki Takarasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP21616082A priority Critical patent/JPS59105346A/ja
Publication of JPS59105346A publication Critical patent/JPS59105346A/ja
Publication of JPS6351543B2 publication Critical patent/JPS6351543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21616082A 1982-12-08 1982-12-08 Ａｇろう付きリ−ドピンの製造方法 Granted JPS59105346A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21616082A JPS59105346A (ja) 1982-12-08 1982-12-08 Ａｇろう付きリ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21616082A JPS59105346A (ja) 1982-12-08 1982-12-08 Ａｇろう付きリ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS59105346A JPS59105346A (ja) 1984-06-18
JPS6351543B2 true JPS6351543B2 (enrdf_load_stackoverflow) 1988-10-14

Family

ID=16684231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21616082A Granted JPS59105346A (ja) 1982-12-08 1982-12-08 Ａｇろう付きリ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS59105346A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146014A (ja) * 1984-08-10 1986-03-06 東海カーボン株式会社 溶接用支持台
JPS63101167U (enrdf_load_stackoverflow) * 1986-12-18 1988-07-01

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946164A (enrdf_load_stackoverflow) * 1972-09-12 1974-05-02
JPS5736379B2 (enrdf_load_stackoverflow) * 1974-10-02 1982-08-03
JPS5944948B2 (ja) * 1977-12-09 1984-11-02 株式会社日立製作所 ろう付け法
JPS56119664A (en) * 1980-02-27 1981-09-19 Nec Home Electronics Ltd Brazing method
JPS56131066A (en) * 1980-03-19 1981-10-14 Toshiba Corp Silver-alloy brazing

Also Published As

Publication number Publication date
JPS59105346A (ja) 1984-06-18

Similar Documents

Publication Publication Date Title
JPS6351543B2 (enrdf_load_stackoverflow)
JPH03151B2 (enrdf_load_stackoverflow)
JPH0431782B2 (enrdf_load_stackoverflow)
JPS59105347A (ja) Ａｇろう付きストレートピンの製造方法
JPH0897325A (ja) ボール・グリッド・アレイパッケージにおける接続端子部構造及び接続端子部構造の形成方法
JP2526251B2 (ja) リベット型接点の製作方法
JP3715137B2 (ja) 配線基板の製造方法
JP3063587B2 (ja) 電子部品および電子部品の製造方法
JPS59101787A (ja) 配線基板に植設する端子とろう材との複合体の製造方法
JPH0757420B2 (ja) 銀ろう付きリードピンの製造方法
JPS6152981A (ja) ロウ付け方法
JPS6023998Y2 (ja) 加熱用圧着子
JPH04268739A (ja) 半導体装置の製造方法
JPS6032768Y2 (ja) 気密端子
JPS63104355A (ja) Ｉｃセラミツクパツケ−ジのシ−ルリングおよびその製造方法
JP2685559B2 (ja) ろう材付リードピンの製造方法およびその製造装置
JPH0642349Y2 (ja) 集積回路用複合ピンの製造用カーボン製治具
JPH0141033B2 (enrdf_load_stackoverflow)
JPH0136702B2 (enrdf_load_stackoverflow)
JPS6020896B2 (ja) ボンデイングツ−ル
JPS603138A (ja) 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法
JPH0463467A (ja) 半導体装置用リードピンとその製造方法
JPH0787268B2 (ja) フラットパッケージ型ｉｃの実装方法
JPS57192042A (en) Fixing method for semiconductor element
JPS582455B2 (ja) 半導体用ステムの製作方法