JPS6349598B2 - - Google Patents

Info

Publication number
JPS6349598B2
JPS6349598B2 JP58144564A JP14456483A JPS6349598B2 JP S6349598 B2 JPS6349598 B2 JP S6349598B2 JP 58144564 A JP58144564 A JP 58144564A JP 14456483 A JP14456483 A JP 14456483A JP S6349598 B2 JPS6349598 B2 JP S6349598B2
Authority
JP
Japan
Prior art keywords
bonding
joining
temperature
bonding material
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58144564A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6037291A (ja
Inventor
Isao Okutomi
Sadao Sugyama
Masanori Ishimatsu
Hidekazu Aoki
Masanao Tanaka
Takeshiro Sakida
Hideki Tamaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Ishifuku Metal Industry Co Ltd
Original Assignee
Toshiba Corp
Ishifuku Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Ishifuku Metal Industry Co Ltd filed Critical Toshiba Corp
Priority to JP14456483A priority Critical patent/JPS6037291A/ja
Publication of JPS6037291A publication Critical patent/JPS6037291A/ja
Publication of JPS6349598B2 publication Critical patent/JPS6349598B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP14456483A 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法 Granted JPS6037291A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14456483A JPS6037291A (ja) 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14456483A JPS6037291A (ja) 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法

Publications (2)

Publication Number Publication Date
JPS6037291A JPS6037291A (ja) 1985-02-26
JPS6349598B2 true JPS6349598B2 (enrdf_load_stackoverflow) 1988-10-05

Family

ID=15365171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14456483A Granted JPS6037291A (ja) 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法

Country Status (1)

Country Link
JP (1) JPS6037291A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783929B2 (ja) * 1987-05-29 1995-09-13 株式会社富士通ゼネラル ハンダ付け方法
JP3057662B2 (ja) * 1988-09-30 2000-07-04 株式会社東芝 ロウ材料
CN104526181A (zh) * 2014-12-03 2015-04-22 浙江亚通焊材有限公司 一种应用于真空电子器件钎焊封接的电真空银基合金钎料及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132147A (en) * 1975-01-16 1976-11-17 Dowa Mining Co Silverrbrazing alloy

Also Published As

Publication number Publication date
JPS6037291A (ja) 1985-02-26

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