JPS6343193B2 - - Google Patents
Info
- Publication number
- JPS6343193B2 JPS6343193B2 JP1747280A JP1747280A JPS6343193B2 JP S6343193 B2 JPS6343193 B2 JP S6343193B2 JP 1747280 A JP1747280 A JP 1747280A JP 1747280 A JP1747280 A JP 1747280A JP S6343193 B2 JPS6343193 B2 JP S6343193B2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- circuit board
- printed circuit
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 6
- 230000007547 defect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1747280A JPS56114574A (en) | 1980-02-14 | 1980-02-14 | Jet type soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1747280A JPS56114574A (en) | 1980-02-14 | 1980-02-14 | Jet type soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56114574A JPS56114574A (en) | 1981-09-09 |
| JPS6343193B2 true JPS6343193B2 (enEXAMPLES) | 1988-08-29 |
Family
ID=11944947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1747280A Granted JPS56114574A (en) | 1980-02-14 | 1980-02-14 | Jet type soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56114574A (enEXAMPLES) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61289965A (ja) * | 1985-06-17 | 1986-12-19 | Meisho Kk | 噴流式ハンダ槽 |
| JPS63163265U (enEXAMPLES) * | 1987-08-21 | 1988-10-25 | ||
| JPH05291228A (ja) * | 1992-04-07 | 1993-11-05 | Fujitsu Ltd | ウェーハ洗浄装置及び洗浄方法 |
-
1980
- 1980-02-14 JP JP1747280A patent/JPS56114574A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56114574A (en) | 1981-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4401253A (en) | Mass soldering system | |
| JPS6343193B2 (enEXAMPLES) | ||
| US4375271A (en) | Soldering method for electric and or electronic component | |
| KR940008543A (ko) | 프린트 배선 기판 | |
| HK141195A (en) | Soldering apparatus and method | |
| JPH08181424A (ja) | プリント基板及びその半田付け方法 | |
| JPS6424491A (en) | Printed board | |
| JPS6415995A (en) | Method of soldering printed wiring board | |
| JPH0530849Y2 (enEXAMPLES) | ||
| JPS55153670A (en) | Flow type soldering method | |
| JPS6339117B2 (enEXAMPLES) | ||
| JPS6418569A (en) | Soldering wave former | |
| JPS6455895A (en) | Soldering method | |
| JP3159328B2 (ja) | 自動はんだ付け装置 | |
| JPS54100955A (en) | Solder equipment | |
| JPS63220972A (ja) | 噴流式自動ハンダ付装置に於けるハンダ噴出部の装置 | |
| KR200176573Y1 (ko) | 양면 실장형 인쇄회로기판 | |
| JPH03238167A (ja) | 半田噴流装置 | |
| JPS62144873A (ja) | はんだ付け方法および装置 | |
| JPS6039161Y2 (ja) | 噴流式はんだ付装置 | |
| JPS6231838B2 (enEXAMPLES) | ||
| SU778966A1 (ru) | Устройство дл лужени печатных плат | |
| JPH0352764A (ja) | 噴流式はんだコート装置 | |
| JPH0983123A (ja) | チップの半田付け方法 | |
| JPH0270377A (ja) | 自動半田付け方法及び装置 |