JPS6339119B2 - - Google Patents
Info
- Publication number
- JPS6339119B2 JPS6339119B2 JP57217288A JP21728882A JPS6339119B2 JP S6339119 B2 JPS6339119 B2 JP S6339119B2 JP 57217288 A JP57217288 A JP 57217288A JP 21728882 A JP21728882 A JP 21728882A JP S6339119 B2 JPS6339119 B2 JP S6339119B2
- Authority
- JP
- Japan
- Prior art keywords
- holes
- hole
- resistant
- thin film
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 29
- 239000011889 copper foil Substances 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 230000000873 masking effect Effects 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 9
- 239000003513 alkali Substances 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21728882A JPS59106191A (ja) | 1982-12-10 | 1982-12-10 | スル−ホ−ルを有する配線基板製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21728882A JPS59106191A (ja) | 1982-12-10 | 1982-12-10 | スル−ホ−ルを有する配線基板製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59106191A JPS59106191A (ja) | 1984-06-19 |
| JPS6339119B2 true JPS6339119B2 (ko) | 1988-08-03 |
Family
ID=16701783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21728882A Granted JPS59106191A (ja) | 1982-12-10 | 1982-12-10 | スル−ホ−ルを有する配線基板製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59106191A (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0450401B2 (ko) * | 1989-07-11 | 1992-08-14 | Hekisa Purosesu Kk | |
| JPH0525701A (ja) * | 1991-07-09 | 1993-02-02 | Aavan Raifu:Kk | 部分かつら及びその装着法 |
| JPH0681205A (ja) * | 1992-08-14 | 1994-03-22 | Nippon Sutera Kk | かつら、およびかつらの装着方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60250289A (ja) * | 1984-05-25 | 1985-12-10 | Seiko Epson Corp | 電子時計 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085872A (ko) * | 1973-12-03 | 1975-07-10 | ||
| JPS5097859A (ko) * | 1973-12-28 | 1975-08-04 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5633165Y2 (ko) * | 1973-02-27 | 1981-08-06 |
-
1982
- 1982-12-10 JP JP21728882A patent/JPS59106191A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085872A (ko) * | 1973-12-03 | 1975-07-10 | ||
| JPS5097859A (ko) * | 1973-12-28 | 1975-08-04 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0450401B2 (ko) * | 1989-07-11 | 1992-08-14 | Hekisa Purosesu Kk | |
| JPH0525701A (ja) * | 1991-07-09 | 1993-02-02 | Aavan Raifu:Kk | 部分かつら及びその装着法 |
| JPH0681205A (ja) * | 1992-08-14 | 1994-03-22 | Nippon Sutera Kk | かつら、およびかつらの装着方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59106191A (ja) | 1984-06-19 |
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