JPS6338864B2 - - Google Patents

Info

Publication number
JPS6338864B2
JPS6338864B2 JP57013111A JP1311182A JPS6338864B2 JP S6338864 B2 JPS6338864 B2 JP S6338864B2 JP 57013111 A JP57013111 A JP 57013111A JP 1311182 A JP1311182 A JP 1311182A JP S6338864 B2 JPS6338864 B2 JP S6338864B2
Authority
JP
Japan
Prior art keywords
refrigerant
cooling air
section
passage
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57013111A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58131755A (ja
Inventor
Osamu Watabe
Takashi Tanaka
Ryoichi Hoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1311182A priority Critical patent/JPS58131755A/ja
Publication of JPS58131755A publication Critical patent/JPS58131755A/ja
Publication of JPS6338864B2 publication Critical patent/JPS6338864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1311182A 1982-01-29 1982-01-29 半導体素子の冷却装置 Granted JPS58131755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1311182A JPS58131755A (ja) 1982-01-29 1982-01-29 半導体素子の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1311182A JPS58131755A (ja) 1982-01-29 1982-01-29 半導体素子の冷却装置

Publications (2)

Publication Number Publication Date
JPS58131755A JPS58131755A (ja) 1983-08-05
JPS6338864B2 true JPS6338864B2 (tr) 1988-08-02

Family

ID=11824036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1311182A Granted JPS58131755A (ja) 1982-01-29 1982-01-29 半導体素子の冷却装置

Country Status (1)

Country Link
JP (1) JPS58131755A (tr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527887Y2 (tr) * 1987-10-30 1993-07-16

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
JPH08264694A (ja) * 1995-03-20 1996-10-11 Calsonic Corp 電子部品用冷却装置
JP3255818B2 (ja) * 1995-03-20 2002-02-12 カルソニックカンセイ株式会社 電子部品用冷却装置
JP3216770B2 (ja) * 1995-03-20 2001-10-09 カルソニックカンセイ株式会社 電子部品用冷却装置
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
FR2746177B1 (fr) * 1996-03-14 2000-04-07 Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant
US6279649B1 (en) * 1998-04-27 2001-08-28 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
JP5163548B2 (ja) * 2009-03-10 2013-03-13 トヨタ自動車株式会社 沸騰冷却装置
JP2011174647A (ja) * 2010-02-24 2011-09-08 Showa Denko Kk ヒートパイプ式放熱器
CN108955326B (zh) * 2018-07-12 2020-03-17 上海交通大学 基于分配回收通道的微通道气液分离蒸发器装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5026142A (tr) * 1973-07-11 1975-03-19
JPS5072587A (tr) * 1973-10-29 1975-06-16
JPS5111330A (ja) * 1974-07-19 1976-01-29 Hitachi Ltd Mojihyojisochi
JPS5240859A (en) * 1975-09-27 1977-03-30 Mitsubishi Electric Corp Heat discharging body

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080742U (tr) * 1973-11-26 1975-07-11

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5026142A (tr) * 1973-07-11 1975-03-19
JPS5072587A (tr) * 1973-10-29 1975-06-16
JPS5111330A (ja) * 1974-07-19 1976-01-29 Hitachi Ltd Mojihyojisochi
JPS5240859A (en) * 1975-09-27 1977-03-30 Mitsubishi Electric Corp Heat discharging body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527887Y2 (tr) * 1987-10-30 1993-07-16

Also Published As

Publication number Publication date
JPS58131755A (ja) 1983-08-05

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