JPS6337463B2 - - Google Patents
Info
- Publication number
- JPS6337463B2 JPS6337463B2 JP59088362A JP8836284A JPS6337463B2 JP S6337463 B2 JPS6337463 B2 JP S6337463B2 JP 59088362 A JP59088362 A JP 59088362A JP 8836284 A JP8836284 A JP 8836284A JP S6337463 B2 JPS6337463 B2 JP S6337463B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- connector
- elastomer
- conductive elastomer
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001971 elastomer Polymers 0.000 claims description 83
- 239000000806 elastomer Substances 0.000 claims description 81
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 238000001723 curing Methods 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 89
- 239000004020 conductor Substances 0.000 description 49
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229920002379 silicone rubber Polymers 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000004945 silicone rubber Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 208000027418 Wounds and injury Diseases 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000012811 non-conductive material Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- -1 siloxanes Chemical class 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/06—Electric connectors, e.g. conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Clocks (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46865174A | 1974-05-10 | 1974-05-10 | |
| US468651 | 1974-05-10 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13209389A Division JPH02126578A (ja) | 1974-05-10 | 1989-05-24 | エラスチックコネクター |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59230270A JPS59230270A (ja) | 1984-12-24 |
| JPS6337463B2 true JPS6337463B2 (xx) | 1988-07-26 |
Family
ID=23860668
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50055910A Expired JPS5836513B2 (ja) | 1974-05-10 | 1975-05-08 | 積層片コネクタ−とその製造方法 |
| JP8836284A Granted JPS59230270A (ja) | 1974-05-10 | 1984-05-04 | エラスチックコネクターの製造方法 |
| JP13209389A Granted JPH02126578A (ja) | 1974-05-10 | 1989-05-24 | エラスチックコネクター |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50055910A Expired JPS5836513B2 (ja) | 1974-05-10 | 1975-05-08 | 積層片コネクタ−とその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13209389A Granted JPH02126578A (ja) | 1974-05-10 | 1989-05-24 | エラスチックコネクター |
Country Status (7)
| Country | Link |
|---|---|
| JP (3) | JPS5836513B2 (xx) |
| CA (1) | CA1056031A (xx) |
| CH (1) | CH587599A5 (xx) |
| DE (1) | DE2520590C2 (xx) |
| FR (1) | FR2280218A1 (xx) |
| GB (1) | GB1505678A (xx) |
| HK (1) | HK82279A (xx) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5144264A (en) * | 1974-10-14 | 1976-04-15 | Oki Electric Ind Co Ltd | Furekishiburu kontakuto |
| JPS52115849U (xx) * | 1976-02-27 | 1977-09-02 | ||
| JPS583343B2 (ja) * | 1976-06-14 | 1983-01-20 | 信越ポリマ−株式会社 | インタ−コネクタ− |
| JPS52155365A (en) * | 1976-06-21 | 1977-12-23 | Shinetsu Polymer Co | Method of producing stacking interconnector |
| JPS5615746Y2 (xx) * | 1976-06-24 | 1981-04-13 | ||
| JPS53892A (en) * | 1976-06-25 | 1978-01-07 | Fuji Gomme Kk | Method of manufacturing multi connector |
| JPS5310055A (en) * | 1976-07-14 | 1978-01-30 | Fuji Gomme Kk | Method of manufacturing multiconnector |
| JPS5317755U (xx) * | 1976-07-26 | 1978-02-15 | ||
| JPS5333367A (en) * | 1976-09-09 | 1978-03-29 | Kato Shiyouji | Method of producing circuit connector |
| JPS618640Y2 (xx) * | 1976-12-20 | 1986-03-17 | ||
| JPS55165696A (en) * | 1979-06-13 | 1980-12-24 | Hitachi Ltd | Electronic part mounting structure |
| JPS56123680A (en) * | 1980-03-05 | 1981-09-28 | Hitachi Ltd | Conductive rubber connector |
| JPS59180472U (ja) * | 1983-05-20 | 1984-12-01 | 株式会社 シチズン電子 | 回路基板における高密度接続構造 |
| DE3701310A1 (de) * | 1987-01-17 | 1988-07-28 | Bodenseewerk Geraetetech | Kontaktierungsvorrichtung zur kontaktierung von oberflaechenmontierbaren integrierten schaltkreisen |
| JPH01206575A (ja) * | 1988-02-15 | 1989-08-18 | Shin Etsu Polymer Co Ltd | 接着性熱融着形コネクタ |
| JP2521599Y2 (ja) * | 1989-01-31 | 1996-12-25 | セイコーエプソン株式会社 | 電子時計 |
| JP2536676B2 (ja) * | 1990-07-30 | 1996-09-18 | 日本電気株式会社 | マイクロピン集合体及びその製造方法 |
| US5585138A (en) * | 1991-07-30 | 1996-12-17 | Nec Corporation | Micropin array and production method thereof |
| JP2502881B2 (ja) * | 1992-02-12 | 1996-05-29 | 信越ポリマー株式会社 | ヒ―トシ―ルコネクタ― |
| JPH0834118B2 (ja) * | 1992-11-30 | 1996-03-29 | 第二しなのポリマー株式会社 | 高精細エラスチックコネクタの製造方法 |
| JP2678163B2 (ja) * | 1993-01-29 | 1997-11-17 | 信越化学工業株式会社 | エラスチックコネクター |
| DE4323494C1 (de) * | 1993-07-14 | 1994-08-18 | Union Special Gmbh | Fadentrenneinrichtung für eine Zylinderarm-Kettenstichnähmaschine |
| NL1003557C2 (nl) * | 1996-07-10 | 1998-01-15 | Oce Tech Bv | Verbeterde zebra-connector. |
| DE69738298T2 (de) | 1996-08-08 | 2008-09-18 | Nitto Denko Corp., Ibaraki | Anisotropische, leitende folie und ihr herstellungsverfahren |
| CN1089933C (zh) * | 1999-09-13 | 2002-08-28 | 韩甫清 | 可用于电子元器件的导电连接绝缘隔离片及制备方法 |
| JP5843533B2 (ja) * | 2011-09-09 | 2016-01-13 | 日東電工株式会社 | 熱伝導性シートおよびその製造方法 |
| JP5843534B2 (ja) * | 2011-09-09 | 2016-01-13 | 日東電工株式会社 | 熱伝導性シートおよびその製造方法 |
| DE102016106704A1 (de) | 2016-04-12 | 2017-10-12 | HARTING Electronics GmbH | Steckverbinder mit Leitgummi |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3620873A (en) * | 1969-03-26 | 1971-11-16 | Ercon Inc | Making metal-plastic gasket materials |
| DE2119567C2 (de) * | 1970-05-05 | 1983-07-14 | International Computers Ltd., London | Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung |
| GB1387587A (en) * | 1971-07-22 | 1975-03-19 | Plessey Co Ltd | Electrical interconnectors and connector assemblies |
| BE794428A (fr) * | 1972-01-29 | 1973-07-23 | Amp Inc | Connecteur electrique et son procede de fabrication |
-
1975
- 1975-05-08 JP JP50055910A patent/JPS5836513B2/ja not_active Expired
- 1975-05-08 CA CA226,569A patent/CA1056031A/en not_active Expired
- 1975-05-09 DE DE19752520590 patent/DE2520590C2/de not_active Expired
- 1975-05-09 FR FR7514550A patent/FR2280218A1/fr active Granted
- 1975-05-09 GB GB1965575A patent/GB1505678A/en not_active Expired
- 1975-05-12 CH CH603175A patent/CH587599A5/xx not_active IP Right Cessation
-
1979
- 1979-11-29 HK HK82279A patent/HK82279A/xx unknown
-
1984
- 1984-05-04 JP JP8836284A patent/JPS59230270A/ja active Granted
-
1989
- 1989-05-24 JP JP13209389A patent/JPH02126578A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2520590A1 (de) | 1975-11-20 |
| JPS5123673A (xx) | 1976-02-25 |
| CH587599A5 (xx) | 1977-05-13 |
| JPS5836513B2 (ja) | 1983-08-09 |
| JPH02126578A (ja) | 1990-05-15 |
| CA1056031A (en) | 1979-06-05 |
| HK82279A (en) | 1979-12-07 |
| JPH0334194B2 (xx) | 1991-05-21 |
| FR2280218A1 (fr) | 1976-02-20 |
| GB1505678A (en) | 1978-03-30 |
| FR2280218B1 (xx) | 1980-08-14 |
| JPS59230270A (ja) | 1984-12-24 |
| DE2520590C2 (de) | 1983-02-24 |
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