JP5843533B2 - 熱伝導性シートおよびその製造方法 - Google Patents
熱伝導性シートおよびその製造方法 Download PDFInfo
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- JP5843533B2 JP5843533B2 JP2011197524A JP2011197524A JP5843533B2 JP 5843533 B2 JP5843533 B2 JP 5843533B2 JP 2011197524 A JP2011197524 A JP 2011197524A JP 2011197524 A JP2011197524 A JP 2011197524A JP 5843533 B2 JP5843533 B2 JP 5843533B2
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- meth
- acrylate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Inorganic Chemistry (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
1.粒子含有単量体混合物の調製
(1)単量体組成物の調製
攪拌機、温度計、窒素ガス導入管および冷却管を備えた4つ口のセパラブルフラスコに、単量体として、2−エチルヘキシルアクリレート90質量部と、アクリル酸10質量部とを仕込み、混合した。
(2)粒子含有単量体混合物の調製
得られた単量体組成物100質量部に対して、窒化ホウ素粒子(平均粒子径9μm、UHP−1、昭和電工製)50質量部、1,6−ヘキサンジオールジアクリレート0.1質量部を均一に混合して、粒子含有単量体混合物を調製した。
2.樹脂層の作製
単量体組成物を、厚さ38μmの2軸延伸ポリエチレンテレフタレートフィルム上に塗布し、その上から、保護フィルムを、その離型処理された面が単量体組成物に接触するように、貼り合わせた。
3.熱伝導性シートの作製
カバーフィルムの離型処理された面に粒子含有単量体混合物を塗布して、カバーフィルム上に粒子含有単量体混合物塗膜を形成した(図2(a)参照。)。
1.粒子含有単量体混合物の調製
実施例1と同様の単量体組成物87.4質量部に対して、窒化ホウ素粒子(平均粒子径9μm、UHP−1、昭和電工製)12.5質量部、1,6−ヘキサンジオールジアクリレート0.1質量部を均一に混合して、粒子含有単量体混合物を調製した。
2.熱伝導シートの作製
粒子含有単量体混合物を、厚さ38μmの2軸延伸ポリエチレンテレフタレートフィルム上に塗布し、その上から、保護フィルムを、その離型処理された面が粒子含有単量体混合物に接触するように、貼り合わせた。
(熱伝導率の測定)
実施例および比較例の熱伝導性シートの、面方向における熱伝導率を、キセノンフラッシュアナライザー(LFA−447型、NETZSCH社製)を用いて測定した。
3 熱伝導性粒子
4 樹脂層
9 粒子偏在シート積層体
Claims (2)
- 樹脂層と熱伝導性粒子とを有する熱伝導性シートであって、
前記熱伝導性シートの一方面から他方面までの長さを100%としたときに、前記熱伝導性シートの一方面から5〜80%の範囲内に、前記熱伝導性粒子の総量の90%以上が存在していることを特徴とする、熱伝導性シート。 - 樹脂層を用意する工程、
前記樹脂層に吸収される前記単量体と、熱伝導性粒子とを含有する粒子含有単量体混合物層を、前記樹脂層の一方面に積層する工程、
前記単量体を前記樹脂層に吸収させることにより、前記熱伝導性粒子を一方に偏在させる工程、および、
前記単量体を反応させて硬化させる工程
を含むことを特徴とする、熱伝導性シートの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011197524A JP5843533B2 (ja) | 2011-09-09 | 2011-09-09 | 熱伝導性シートおよびその製造方法 |
CN2012103283342A CN102993451A (zh) | 2011-09-09 | 2012-09-06 | 热传导性片及其制备方法 |
US13/606,931 US20130062046A1 (en) | 2011-09-09 | 2012-09-07 | Thermal conductive sheet and producing method thereof |
TW101132824A TW201311876A (zh) | 2011-09-09 | 2012-09-07 | 熱傳導性片材及其製造方法 |
KR1020120099346A KR20130028691A (ko) | 2011-09-09 | 2012-09-07 | 열전도성 시트 및 그의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011197524A JP5843533B2 (ja) | 2011-09-09 | 2011-09-09 | 熱伝導性シートおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013058700A JP2013058700A (ja) | 2013-03-28 |
JP5843533B2 true JP5843533B2 (ja) | 2016-01-13 |
Family
ID=47828779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011197524A Expired - Fee Related JP5843533B2 (ja) | 2011-09-09 | 2011-09-09 | 熱伝導性シートおよびその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130062046A1 (ja) |
JP (1) | JP5843533B2 (ja) |
KR (1) | KR20130028691A (ja) |
CN (1) | CN102993451A (ja) |
TW (1) | TW201311876A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014117862A1 (en) * | 2013-02-01 | 2014-08-07 | Abb Technology Ltd | A metallized film capacitor element comprising thermally conductive films and a thermally conducting film for an electrical power component |
JP6303345B2 (ja) * | 2013-09-09 | 2018-04-04 | Dic株式会社 | 熱伝導シート、物品及び電子部材 |
JP2015088593A (ja) * | 2013-10-30 | 2015-05-07 | 日東電工株式会社 | 通信モジュール |
JP6261386B2 (ja) * | 2014-03-04 | 2018-01-17 | デクセリアルズ株式会社 | 多層型熱伝導性シート、多層型熱伝導性シートの製造方法 |
JP6344951B2 (ja) | 2014-03-31 | 2018-06-20 | デクセリアルズ株式会社 | 熱伝導性シート、及び熱伝導性シートの製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1056031A (en) * | 1974-05-10 | 1979-06-05 | Leonard S. Buchoff | Layered strip connector |
US5660917A (en) * | 1993-07-06 | 1997-08-26 | Kabushiki Kaisha Toshiba | Thermal conductivity sheet |
CN101028228A (zh) * | 2006-03-01 | 2007-09-05 | 通用电气公司 | 含有亚微粒氮化硼颗粒的化妆品组合物 |
US20070205706A1 (en) * | 2006-03-01 | 2007-09-06 | General Electric Company | Optical Substrate Comprising Boron Nitride Particles |
EP2022628A4 (en) * | 2006-06-02 | 2012-03-28 | Nitto Denko Corp | POLYMERIC ELEMENT WITH POLYMERIC LAYER CONTAINING UNEQUALLY DISTRIBUTED INCOMPATIBLE SUBSTANCE AND SURFACE DEGROSSI TAPE OR SHEET COMPRISING THE POLYMERIC ELEMENT |
EP2118191A1 (en) * | 2007-01-10 | 2009-11-18 | Momentive Performance Materials Inc. | Thermal interface materials and methods for making thereof |
JP4916423B2 (ja) * | 2007-11-30 | 2012-04-11 | 日東電工株式会社 | ガスバリア性物質偏在ポリマー層を有するガスバリア部材 |
JP5507806B2 (ja) * | 2007-11-30 | 2014-05-28 | 日東電工株式会社 | 導電性物質偏在ポリマー層を有する導電部材 |
JP5443028B2 (ja) * | 2009-03-17 | 2014-03-19 | 日東電工株式会社 | ポリマー部材の製造方法、及びポリマー部材 |
-
2011
- 2011-09-09 JP JP2011197524A patent/JP5843533B2/ja not_active Expired - Fee Related
-
2012
- 2012-09-06 CN CN2012103283342A patent/CN102993451A/zh active Pending
- 2012-09-07 KR KR1020120099346A patent/KR20130028691A/ko not_active Application Discontinuation
- 2012-09-07 US US13/606,931 patent/US20130062046A1/en not_active Abandoned
- 2012-09-07 TW TW101132824A patent/TW201311876A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN102993451A (zh) | 2013-03-27 |
TW201311876A (zh) | 2013-03-16 |
KR20130028691A (ko) | 2013-03-19 |
JP2013058700A (ja) | 2013-03-28 |
US20130062046A1 (en) | 2013-03-14 |
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