JPS6337077B2 - - Google Patents
Info
- Publication number
- JPS6337077B2 JPS6337077B2 JP57167859A JP16785982A JPS6337077B2 JP S6337077 B2 JPS6337077 B2 JP S6337077B2 JP 57167859 A JP57167859 A JP 57167859A JP 16785982 A JP16785982 A JP 16785982A JP S6337077 B2 JPS6337077 B2 JP S6337077B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal
- metal layer
- ceramic
- ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 88
- 239000002184 metal Substances 0.000 claims description 88
- 239000000919 ceramic Substances 0.000 claims description 62
- 238000005240 physical vapour deposition Methods 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 229910052750 molybdenum Inorganic materials 0.000 claims description 11
- 239000011733 molybdenum Substances 0.000 claims description 11
- 229910052726 zirconium Inorganic materials 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 8
- 239000010937 tungsten Substances 0.000 claims description 8
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 description 28
- 230000000694 effects Effects 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16785982A JPS5957976A (ja) | 1982-09-27 | 1982-09-27 | 金属膜積層セラミツクス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16785982A JPS5957976A (ja) | 1982-09-27 | 1982-09-27 | 金属膜積層セラミツクス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5957976A JPS5957976A (ja) | 1984-04-03 |
| JPS6337077B2 true JPS6337077B2 (fi) | 1988-07-22 |
Family
ID=15857409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16785982A Granted JPS5957976A (ja) | 1982-09-27 | 1982-09-27 | 金属膜積層セラミツクス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5957976A (fi) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60211897A (ja) * | 1984-04-05 | 1985-10-24 | 日本電気株式会社 | 多層配線基板 |
| JPH0660064B2 (ja) * | 1986-06-16 | 1994-08-10 | 住友電気工業株式会社 | 非酸化物セラミックスと金属との接合体の製法 |
| JPH0651594B2 (ja) * | 1986-06-16 | 1994-07-06 | 住友電気工業株式会社 | 非酸化物セラミックスと金属との接合体の製法 |
| US5198265A (en) * | 1991-04-01 | 1993-03-30 | General Electric Company | Method of coating an aluminum compound substrate with a composition of elemental titanium and an alkali metal halide, melting the coating, and rinsing the coated substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495837A (fi) * | 1972-03-24 | 1974-01-19 | ||
| JPS51125641A (en) * | 1974-08-05 | 1976-11-02 | Ngk Insulators Ltd | Process for metallizing ceramics |
-
1982
- 1982-09-27 JP JP16785982A patent/JPS5957976A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495837A (fi) * | 1972-03-24 | 1974-01-19 | ||
| JPS51125641A (en) * | 1974-08-05 | 1976-11-02 | Ngk Insulators Ltd | Process for metallizing ceramics |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5957976A (ja) | 1984-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0216273B2 (fi) | ||
| US4624897A (en) | Clad brazing filler for bonding ceramic to metal, glass, or other ceramic and composites using such filler | |
| US4763828A (en) | Method for bonding ceramics and metals | |
| JPS61158876A (ja) | セラミツク対金属の直接液相結合 | |
| US3395993A (en) | Titanium activated nickel seal and method of forming it | |
| US4559277A (en) | Ceramic and aluminum alloy composite | |
| JP2001010874A (ja) | 無機材料とアルミニウムを含む金属との複合材料の製造方法とその関連する製品 | |
| JPH0367985B2 (fi) | ||
| US4657825A (en) | Electronic component using a silicon carbide substrate and a method of making it | |
| US3793705A (en) | Process for brazing a magnetic ceramic member to a metal member | |
| US6884511B1 (en) | Method for brazing ceramic-containing bodies, and articles made thereby | |
| JP3095490B2 (ja) | セラミックス−金属接合体 | |
| JPS6337077B2 (fi) | ||
| JPS59232692A (ja) | セラミツクと金属等との接合用ろう材及びこれを用いたセラミツクと金属等の複合体 | |
| JPH0492871A (ja) | セラミックス―金属接合体及びその製造方法 | |
| JP3505212B2 (ja) | 接合体および接合体の製造方法 | |
| JP2001048670A (ja) | セラミックス−金属接合体 | |
| JPH07187839A (ja) | 窒化物系セラミックス−金属接合体およびその製造方法 | |
| JPS61215272A (ja) | セラミツクス部材と金属部材との接合方法 | |
| JPS61151071A (ja) | 炭化ケイ素焼結体と金属との接合体 | |
| JPH059396B2 (fi) | ||
| JPH0426568A (ja) | 金属―セラミックス接合体 | |
| JPS6261558B2 (fi) | ||
| JPS62171979A (ja) | 非酸化物系セラミックスのメタライズ方法 | |
| JPH0651594B2 (ja) | 非酸化物セラミックスと金属との接合体の製法 |