JPS6336688Y2 - - Google Patents
Info
- Publication number
- JPS6336688Y2 JPS6336688Y2 JP1982181194U JP18119482U JPS6336688Y2 JP S6336688 Y2 JPS6336688 Y2 JP S6336688Y2 JP 1982181194 U JP1982181194 U JP 1982181194U JP 18119482 U JP18119482 U JP 18119482U JP S6336688 Y2 JPS6336688 Y2 JP S6336688Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- conductive
- metallized layer
- metallized
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982181194U JPS5984847U (ja) | 1982-11-30 | 1982-11-30 | 半導体素子用セラミツクパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982181194U JPS5984847U (ja) | 1982-11-30 | 1982-11-30 | 半導体素子用セラミツクパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5984847U JPS5984847U (ja) | 1984-06-08 |
| JPS6336688Y2 true JPS6336688Y2 (enExample) | 1988-09-28 |
Family
ID=30392690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982181194U Granted JPS5984847U (ja) | 1982-11-30 | 1982-11-30 | 半導体素子用セラミツクパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5984847U (enExample) |
-
1982
- 1982-11-30 JP JP1982181194U patent/JPS5984847U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5984847U (ja) | 1984-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0143607B1 (en) | Semiconductor package | |
| JP3009788B2 (ja) | 集積回路用パッケージ | |
| US4266090A (en) | All metal flat package | |
| US3681513A (en) | Hermetic power package | |
| JP3336982B2 (ja) | 半導体装置およびその製造方法 | |
| US5406120A (en) | Hermetically sealed semiconductor ceramic package | |
| US3303265A (en) | Miniature semiconductor enclosure | |
| US5200640A (en) | Hermetic package having covers and a base providing for direct electrical connection | |
| US4857988A (en) | Leadless ceramic chip carrier | |
| US6051784A (en) | Semiconductor package | |
| JPH0382060A (ja) | 半導体装置 | |
| USRE29325E (en) | Hermetic power package | |
| JPH083009Y2 (ja) | 半導体素子収納用パッケージ | |
| JPH0621248A (ja) | 電子部品用パッケージ | |
| JP2543149Y2 (ja) | 半導体素子収納用パッケージ | |
| JP3051225B2 (ja) | 集積回路用パッケージ | |
| JPH0739235Y2 (ja) | プラグイン型半導体素子収納用パッケージ | |
| JP2666588B2 (ja) | 半導体装置 | |
| JP2728585B2 (ja) | 半導体素子収納用パッケージ | |
| JPH03248449A (ja) | ヒートシンク搭載型半導体装置 | |
| JP2003309205A (ja) | セラミックパッケージ | |
| JPH06112337A (ja) | 半導体装置用パッケージ | |
| JP2000277872A (ja) | 配線基板 | |
| JPS6120768Y2 (enExample) | ||
| JP3034376B2 (ja) | 半導体集積回路装置 |