JPS6335380B2 - - Google Patents
Info
- Publication number
- JPS6335380B2 JPS6335380B2 JP57008883A JP888382A JPS6335380B2 JP S6335380 B2 JPS6335380 B2 JP S6335380B2 JP 57008883 A JP57008883 A JP 57008883A JP 888382 A JP888382 A JP 888382A JP S6335380 B2 JPS6335380 B2 JP S6335380B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding wheel
- piece
- workpiece
- grindstone
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP888382A JPS58126056A (ja) | 1982-01-25 | 1982-01-25 | 斜め溝加工方法 |
| US06/377,008 US4517769A (en) | 1981-05-20 | 1982-05-11 | Method and apparatus for forming oblique groove in semiconductor device |
| GB8214280A GB2098893B (en) | 1981-05-20 | 1982-05-17 | Method and apparatus for forming oblique groove in semiconductor device |
| DE3218953A DE3218953C2 (de) | 1981-05-20 | 1982-05-19 | Verfahren und Vorrichtung zur Ausbildung einer Schrägrille in einer Halbleitervorrichtung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP888382A JPS58126056A (ja) | 1982-01-25 | 1982-01-25 | 斜め溝加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58126056A JPS58126056A (ja) | 1983-07-27 |
| JPS6335380B2 true JPS6335380B2 (enEXAMPLES) | 1988-07-14 |
Family
ID=11705069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP888382A Granted JPS58126056A (ja) | 1981-05-20 | 1982-01-25 | 斜め溝加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58126056A (enEXAMPLES) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0632288Y2 (ja) * | 1985-10-01 | 1994-08-24 | ワシノ機械株式会社 | 光▲ほう▼い研削盤 |
| JPH01218027A (ja) * | 1988-02-26 | 1989-08-31 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
| JPH01264758A (ja) * | 1988-04-14 | 1989-10-23 | Nippon Inter Electronics Corp | 半導体装置の加工装置ならびにに製造方法 |
| JP3426544B2 (ja) * | 1999-08-30 | 2003-07-14 | 理化学研究所 | 中性子レンズ部材の加工装置及び方法 |
| KR20030064539A (ko) * | 2002-01-28 | 2003-08-02 | 배영철 | 엔드밀을 이용한 홈가공 장치 및 방법 |
| JP5399229B2 (ja) * | 2009-12-25 | 2014-01-29 | 日本碍子株式会社 | 複合基板及びその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54108086A (en) * | 1978-02-13 | 1979-08-24 | Nobumasa Fujishiro | Method of forming groove by means of saw machine and milling machine |
-
1982
- 1982-01-25 JP JP888382A patent/JPS58126056A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58126056A (ja) | 1983-07-27 |
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