JPS6334281Y2 - - Google Patents

Info

Publication number
JPS6334281Y2
JPS6334281Y2 JP1981001247U JP124781U JPS6334281Y2 JP S6334281 Y2 JPS6334281 Y2 JP S6334281Y2 JP 1981001247 U JP1981001247 U JP 1981001247U JP 124781 U JP124781 U JP 124781U JP S6334281 Y2 JPS6334281 Y2 JP S6334281Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
wiring board
bonding
conductor
flexible wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981001247U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57115253U (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981001247U priority Critical patent/JPS6334281Y2/ja
Publication of JPS57115253U publication Critical patent/JPS57115253U/ja
Application granted granted Critical
Publication of JPS6334281Y2 publication Critical patent/JPS6334281Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1981001247U 1981-01-07 1981-01-07 Expired JPS6334281Y2 (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981001247U JPS6334281Y2 (enFirst) 1981-01-07 1981-01-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981001247U JPS6334281Y2 (enFirst) 1981-01-07 1981-01-07

Publications (2)

Publication Number Publication Date
JPS57115253U JPS57115253U (enFirst) 1982-07-16
JPS6334281Y2 true JPS6334281Y2 (enFirst) 1988-09-12

Family

ID=29799735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981001247U Expired JPS6334281Y2 (enFirst) 1981-01-07 1981-01-07

Country Status (1)

Country Link
JP (1) JPS6334281Y2 (enFirst)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146531A1 (ja) * 2007-05-29 2008-12-04 Kyocera Corporation 電子部品収納用パッケージ、及び電子装置

Also Published As

Publication number Publication date
JPS57115253U (enFirst) 1982-07-16

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