JPS6333298B2 - - Google Patents

Info

Publication number
JPS6333298B2
JPS6333298B2 JP53078391A JP7839178A JPS6333298B2 JP S6333298 B2 JPS6333298 B2 JP S6333298B2 JP 53078391 A JP53078391 A JP 53078391A JP 7839178 A JP7839178 A JP 7839178A JP S6333298 B2 JPS6333298 B2 JP S6333298B2
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor
lead frame
fixing
burrs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53078391A
Other languages
English (en)
Japanese (ja)
Other versions
JPS554985A (en
Inventor
Hiroshi Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP7839178A priority Critical patent/JPS554985A/ja
Publication of JPS554985A publication Critical patent/JPS554985A/ja
Publication of JPS6333298B2 publication Critical patent/JPS6333298B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7839178A 1978-06-27 1978-06-27 Lead frame for semiconductor device Granted JPS554985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7839178A JPS554985A (en) 1978-06-27 1978-06-27 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7839178A JPS554985A (en) 1978-06-27 1978-06-27 Lead frame for semiconductor device

Publications (2)

Publication Number Publication Date
JPS554985A JPS554985A (en) 1980-01-14
JPS6333298B2 true JPS6333298B2 (pm) 1988-07-05

Family

ID=13660706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7839178A Granted JPS554985A (en) 1978-06-27 1978-06-27 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS554985A (pm)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980949A (ja) * 1983-07-01 1984-05-10 Hitachi Ltd 樹脂封止半導体装置
JPS5994449A (ja) * 1983-07-01 1984-05-31 Hitachi Ltd 半導体装置
JPS60200553A (ja) * 1984-03-26 1985-10-11 Nec Corp 半導体装置の製造方法
JPS61104560U (pm) * 1984-12-13 1986-07-03
JPS61141164A (ja) * 1984-12-13 1986-06-28 Tamagawa Kikai Kinzoku Kk 半導体装置用フレ−ムの製造方法およびその装置
JPS62204344U (pm) * 1986-06-17 1987-12-26
JP2008016714A (ja) * 2006-07-07 2008-01-24 Sanyo Electric Co Ltd フレームパッケージ型半導体レーザ装置
JP2008016715A (ja) * 2006-07-07 2008-01-24 Sanyo Electric Co Ltd フレームパッケージ型半導体レーザ装置
JP2008021754A (ja) * 2006-07-12 2008-01-31 Sanyo Electric Co Ltd フレームパッケージ型半導体レーザ装置
JP5543724B2 (ja) * 2008-08-28 2014-07-09 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128500B2 (pm) * 1972-03-03 1976-08-19
JPS539251Y2 (pm) * 1974-12-19 1978-03-10

Also Published As

Publication number Publication date
JPS554985A (en) 1980-01-14

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