JPS6333298B2 - - Google Patents
Info
- Publication number
- JPS6333298B2 JPS6333298B2 JP53078391A JP7839178A JPS6333298B2 JP S6333298 B2 JPS6333298 B2 JP S6333298B2 JP 53078391 A JP53078391 A JP 53078391A JP 7839178 A JP7839178 A JP 7839178A JP S6333298 B2 JPS6333298 B2 JP S6333298B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- lead frame
- fixing
- burrs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7839178A JPS554985A (en) | 1978-06-27 | 1978-06-27 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7839178A JPS554985A (en) | 1978-06-27 | 1978-06-27 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS554985A JPS554985A (en) | 1980-01-14 |
| JPS6333298B2 true JPS6333298B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-07-05 |
Family
ID=13660706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7839178A Granted JPS554985A (en) | 1978-06-27 | 1978-06-27 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS554985A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5994449A (ja) * | 1983-07-01 | 1984-05-31 | Hitachi Ltd | 半導体装置 |
| JPS5980949A (ja) * | 1983-07-01 | 1984-05-10 | Hitachi Ltd | 樹脂封止半導体装置 |
| JPS60200553A (ja) * | 1984-03-26 | 1985-10-11 | Nec Corp | 半導体装置の製造方法 |
| JPS61104560U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1984-12-13 | 1986-07-03 | ||
| JPS61141164A (ja) * | 1984-12-13 | 1986-06-28 | Tamagawa Kikai Kinzoku Kk | 半導体装置用フレ−ムの製造方法およびその装置 |
| JPS62204344U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-06-17 | 1987-12-26 | ||
| JP2008016715A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
| JP2008016714A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
| JP2008021754A (ja) * | 2006-07-12 | 2008-01-31 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
| JP5543724B2 (ja) * | 2008-08-28 | 2014-07-09 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 樹脂封止型半導体装置及びその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128500B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-03-03 | 1976-08-19 | ||
| JPS539251Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-12-19 | 1978-03-10 |
-
1978
- 1978-06-27 JP JP7839178A patent/JPS554985A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS554985A (en) | 1980-01-14 |