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Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP47022519ApriorityCriticalpatent/JPS5128500B2/ja
Publication of JPS4942281ApublicationCriticalpatent/JPS4942281A/ja
Publication of JPS5128500B2publicationCriticalpatent/JPS5128500B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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Engineering & Computer Science
(AREA)
Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
(AREA)
Power Engineering
(AREA)
Die Bonding
(AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices
(AREA)