JPS6332258B2 - - Google Patents
Info
- Publication number
- JPS6332258B2 JPS6332258B2 JP58244307A JP24430783A JPS6332258B2 JP S6332258 B2 JPS6332258 B2 JP S6332258B2 JP 58244307 A JP58244307 A JP 58244307A JP 24430783 A JP24430783 A JP 24430783A JP S6332258 B2 JPS6332258 B2 JP S6332258B2
- Authority
- JP
- Japan
- Prior art keywords
- elastic body
- wafer
- pressure
- wafer bonding
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24430783A JPS60137035A (ja) | 1983-12-26 | 1983-12-26 | ウエ−ハ接着装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24430783A JPS60137035A (ja) | 1983-12-26 | 1983-12-26 | ウエ−ハ接着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60137035A JPS60137035A (ja) | 1985-07-20 |
JPS6332258B2 true JPS6332258B2 (enrdf_load_html_response) | 1988-06-29 |
Family
ID=17116787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24430783A Granted JPS60137035A (ja) | 1983-12-26 | 1983-12-26 | ウエ−ハ接着装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60137035A (enrdf_load_html_response) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013115068A1 (ja) * | 2012-02-01 | 2015-05-11 | 旭硝子株式会社 | 積層体の製造方法および製造装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK8689A (da) * | 1988-01-11 | 1989-07-12 | Thiokol Morton Inc | Fremgangsmaade og apparat til placering af polymere materialer paa trykte kredsloebskort |
KR100553253B1 (ko) | 2004-12-30 | 2006-02-20 | 지 . 텍 (주) | 탄성고무를 이용한 공기압 실린더와 그 위치 제어시스템및 방법 |
JP4841412B2 (ja) * | 2006-12-06 | 2011-12-21 | 日東電工株式会社 | 基板貼合せ装置 |
JP2012089623A (ja) * | 2010-10-18 | 2012-05-10 | Tokyo Electron Ltd | 押圧用アダプタ |
JP6254795B2 (ja) * | 2013-09-06 | 2017-12-27 | リンテック株式会社 | シート貼付装置及び貼付方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53140373U (enrdf_load_html_response) * | 1977-04-11 | 1978-11-06 | ||
JPS5932135A (ja) * | 1982-08-18 | 1984-02-21 | Toshiba Corp | 半導体ウエハの接着装置 |
-
1983
- 1983-12-26 JP JP24430783A patent/JPS60137035A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013115068A1 (ja) * | 2012-02-01 | 2015-05-11 | 旭硝子株式会社 | 積層体の製造方法および製造装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS60137035A (ja) | 1985-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |