JPS6332258B2 - - Google Patents

Info

Publication number
JPS6332258B2
JPS6332258B2 JP58244307A JP24430783A JPS6332258B2 JP S6332258 B2 JPS6332258 B2 JP S6332258B2 JP 58244307 A JP58244307 A JP 58244307A JP 24430783 A JP24430783 A JP 24430783A JP S6332258 B2 JPS6332258 B2 JP S6332258B2
Authority
JP
Japan
Prior art keywords
elastic body
wafer
pressure
wafer bonding
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58244307A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60137035A (ja
Inventor
Shuichi Misu
Takeshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP24430783A priority Critical patent/JPS60137035A/ja
Publication of JPS60137035A publication Critical patent/JPS60137035A/ja
Publication of JPS6332258B2 publication Critical patent/JPS6332258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP24430783A 1983-12-26 1983-12-26 ウエ−ハ接着装置 Granted JPS60137035A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24430783A JPS60137035A (ja) 1983-12-26 1983-12-26 ウエ−ハ接着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24430783A JPS60137035A (ja) 1983-12-26 1983-12-26 ウエ−ハ接着装置

Publications (2)

Publication Number Publication Date
JPS60137035A JPS60137035A (ja) 1985-07-20
JPS6332258B2 true JPS6332258B2 (enrdf_load_html_response) 1988-06-29

Family

ID=17116787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24430783A Granted JPS60137035A (ja) 1983-12-26 1983-12-26 ウエ−ハ接着装置

Country Status (1)

Country Link
JP (1) JPS60137035A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013115068A1 (ja) * 2012-02-01 2015-05-11 旭硝子株式会社 積層体の製造方法および製造装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK8689A (da) * 1988-01-11 1989-07-12 Thiokol Morton Inc Fremgangsmaade og apparat til placering af polymere materialer paa trykte kredsloebskort
KR100553253B1 (ko) 2004-12-30 2006-02-20 지 . 텍 (주) 탄성고무를 이용한 공기압 실린더와 그 위치 제어시스템및 방법
JP4841412B2 (ja) * 2006-12-06 2011-12-21 日東電工株式会社 基板貼合せ装置
JP2012089623A (ja) * 2010-10-18 2012-05-10 Tokyo Electron Ltd 押圧用アダプタ
JP6254795B2 (ja) * 2013-09-06 2017-12-27 リンテック株式会社 シート貼付装置及び貼付方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140373U (enrdf_load_html_response) * 1977-04-11 1978-11-06
JPS5932135A (ja) * 1982-08-18 1984-02-21 Toshiba Corp 半導体ウエハの接着装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013115068A1 (ja) * 2012-02-01 2015-05-11 旭硝子株式会社 積層体の製造方法および製造装置

Also Published As

Publication number Publication date
JPS60137035A (ja) 1985-07-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees