JPS63317283A - Gold alloy filler metal for brazing - Google Patents
Gold alloy filler metal for brazingInfo
- Publication number
- JPS63317283A JPS63317283A JP15170687A JP15170687A JPS63317283A JP S63317283 A JPS63317283 A JP S63317283A JP 15170687 A JP15170687 A JP 15170687A JP 15170687 A JP15170687 A JP 15170687A JP S63317283 A JPS63317283 A JP S63317283A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- gold
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title abstract description 22
- 229910052751 metal Inorganic materials 0.000 title abstract description 8
- 239000002184 metal Substances 0.000 title abstract description 8
- 239000000945 filler Substances 0.000 title abstract 7
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 3
- 239000003353 gold alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011572 manganese Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910002482 Cu–Ni Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、金ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in gold solder alloys.
（従来技術とその問題点）
−ｉに真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用金ろう合金としては、金に銅を
１５〜６２重量％、ニッケル２〜５重量％の範囲で添加
した金−銅一ニッケル合金が主に用いられている。(Prior art and its problems) -i Gold brazing alloy for brazing material in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc. is a range of 15 to 62% by weight of copper and 2 to 5% by weight of nickel. Gold-copper-nickel alloys are mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行つた部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう打部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the soldered parts and blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
金ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a gold solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の金ろう合金は、銅１０〜７０重四％、ニッケル
１〜８重量％、クロム、パラジウム、マンガンの少なく
とも１種０．００１〜１．０重量％、残部金より成るも
のである。(Means for Solving the Problems) The gold brazing alloy of the present invention contains 10 to 70% by weight of copper, 1 to 8% by weight of nickel, and 0.001 to 1.0% by weight of at least one of chromium, palladium, and manganese. % and the balance.
本発明の金ろう合金において、クロム、パラジウム、マ
ンガンの少なくとも１種を金−銅一ニソケル合金に含有
させる理由は、ろう付時溶融したろう材の表面張力を小
さくし、それによりろう付後のろう表面の荒れを小さく
し、凹凸の発生を抑制する為である。In the gold brazing alloy of the present invention, the reason why at least one of chromium, palladium, and manganese is contained in the gold-copper-nisokel alloy is to reduce the surface tension of the melted brazing material during brazing, thereby reducing the This is to reduce the roughness of the solder surface and suppress the occurrence of unevenness.
そしてそれの含有量を０．００１〜１．０重量％と限定
した理由は、０．００１重量％未満ではろう付後のろう
表面の荒れ及び凹凸の発生を抑制することができず、ま
た１、０重量％を超えると極端にろう流れが悪（、ろう
付強度に悪影響を及ぼすからである。The reason for limiting the content to 0.001 to 1.0% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing, and 1. If the content exceeds 0% by weight, the flow of the solder will be extremely poor (and the brazing strength will be adversely affected).
次に本発明の金ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the gold brazing alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左欄に示す実施例と従来例の金ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−ニッケル４２重量％から成るリードフ
レームのろう付を行い、ろう付後のろう表面の凹凸（溝
）の個数及び凹凸（溝）の深さを測定したところ下記の
表の右欄に示すような結果を得た。(Example) The gold solders of the example and conventional example shown in the left column of the table below were metallized with Mo-Mn on alumina for IC packages in a hydrogen atmosphere, and then 5 μm of nickel was plated on top of that, and the parts were A lead frame made of 42% iron and nickel by weight was brazed on the surface of the solder, and the number of unevenness (grooves) and the depth of the unevenness (grooves) on the soldering surface after brazing were measured, and the results are shown in the right column of the table below. I got similar results.
上記の表の右欄の数値で明らかなように本発明の金ろう
合金は、従来の金ろう合金に比較して凹凸（溝）の発生
数が少な（、また凹凸（溝）の深さが浅いものである。As is clear from the numbers in the right column of the table above, the gold solder alloy of the present invention has fewer unevenness (grooves) than conventional gold solder alloys (and has a lower depth of unevenness (grooves)). It is shallow.
（発明の効果）
以上詳記した通り本発明による余ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗゛浄液等の量が少
なく、その結果それらを除去後の残存量も少なく、それ
だけろう材部の変色、腐蝕を抑制することができるとい
う優れた効果がある。(Effects of the Invention) As detailed above, the residual brazing alloy according to the present invention has less roughness on the solder surface after brazing and less occurrence of unevenness, so brazed parts can be cleaned with acid or treated with plating. The amount of cleaning liquid that penetrates into the unevenness of the solder surface is small, and as a result, the amount remaining after removal is also small, which is advantageous in that discoloration and corrosion of the solder metal part can be suppressed. It has a positive effect.
Claims (1)
パラジウム、マンガンの少なくとも１種０．００１〜１
．０重量％、残部金より成る金ろう合金。Copper 10-70% by weight, nickel 1-8% by weight, chromium,
At least one of palladium and manganese 0.001 to 1
．． A gold solder alloy consisting of 0% by weight and the balance being gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170687A JPS63317283A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170687A JPS63317283A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317283A true JPS63317283A (en) | 1988-12-26 |
Family
ID=15524488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15170687A Pending JPS63317283A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317283A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1178124A2 (en) * | 2000-07-31 | 2002-02-06 | Fachhochschule Pforzheim Hochschule für Gestaltung Technik und Wirtschaft | White gold alloy |
| EP1770178A1 (en) * | 2005-09-28 | 2007-04-04 | General Electric Company | Gold/nickel/copper brazing alloys for brazing wc-co to titanium alloys |
-
1987
- 1987-06-18 JP JP15170687A patent/JPS63317283A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1178124A2 (en) * | 2000-07-31 | 2002-02-06 | Fachhochschule Pforzheim Hochschule für Gestaltung Technik und Wirtschaft | White gold alloy |
| EP1178124A3 (en) * | 2000-07-31 | 2003-10-08 | Fachhochschule Pforzheim Hochschule für Gestaltung Technik und Wirtschaft | White gold alloy |
| EP1770178A1 (en) * | 2005-09-28 | 2007-04-04 | General Electric Company | Gold/nickel/copper brazing alloys for brazing wc-co to titanium alloys |
| JP2007090430A (en) * | 2005-09-28 | 2007-04-12 | General Electric Co <Ge> | GOLD/NICKEL/COPPER BRAZING ALLOY FOR BRAZING WC-Co TO TITANIUM ALLOY |
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