JPS63317287A - Silver alloy filler metal for brazing - Google Patents
Silver alloy filler metal for brazingInfo
- Publication number
- JPS63317287A JPS63317287A JP15168687A JP15168687A JPS63317287A JP S63317287 A JPS63317287 A JP S63317287A JP 15168687 A JP15168687 A JP 15168687A JP 15168687 A JP15168687 A JP 15168687A JP S63317287 A JPS63317287 A JP S63317287A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- silver
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title abstract description 17
- 239000000945 filler Substances 0.000 title abstract 7
- 229910052751 metal Inorganic materials 0.000 title abstract 7
- 239000002184 metal Substances 0.000 title abstract 7
- 229910001316 Ag alloy Inorganic materials 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000011572 manganese Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 4
- 229910000846 In alloy Inorganic materials 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- DICWILYNZSJYMQ-UHFFFAOYSA-N [In].[Cu].[Ag] Chemical compound [In].[Cu].[Ag] DICWILYNZSJYMQ-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、銀ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in silver solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用銀ろう合金としては、銀に銅を
７．５〜３５重量％さらにインジウム３〜１５重量％の
範囲で添加した銀−銅−インジウム合金が主に用いられ
ている。(Prior art and its problems) In general, silver brazing alloys for brazing materials in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc. contain 7.5 to 35% by weight of copper and 3 to 15% by weight of indium. A silver-copper-indium alloy is mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう打部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, cleaning liquid or the like will penetrate into the irregularities. Since it is difficult to completely remove this cleaning solution, the cleaning solution remains on uneven areas, resulting in disadvantages such as discoloration and corrosion of the soldered parts and blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
銀ろう合金を提供せんとするものである。(Objective of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a silver solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の銀ろう合金は、銅２０〜５５重量％、インジウ
ム３〜１５重量％及びクロム、パラジウム、マンガンの
少なくとも１種０．００１〜１．５重量％、残部銀より
成るものである。(Means for Solving the Problems) The silver brazing alloy of the present invention comprises 20 to 55% by weight of copper, 3 to 15% by weight of indium, and 0.001 to 1.5% by weight of at least one of chromium, palladium, and manganese. , the remainder consisting of silver.
本発明の限ろう合金において、クロム、パラジウム、マ
ンガンの少なくとも１種を銀−銅−インジウム合金に含
有させる理由は、ろう付時溶融したろう材の表面張力を
小さくし、それによりろう付部のろう表面の荒れを小さ
くし、凹凸の発生を抑制する為である。In the brazing alloy of the present invention, the reason why at least one of chromium, palladium, and manganese is contained in the silver-copper-indium alloy is to reduce the surface tension of the melted brazing material during brazing, thereby reducing the This is to reduce the roughness of the solder surface and suppress the occurrence of unevenness.
そしてそれの含有量をそれぞれ０．００１−１．５重量
％と限定した理由は、０．００１重量％未満ではろう付
部のろう表面の荒れ及び凹凸の発生を抑制することがで
きず、１．５重量％を超えると極端にろう流れが悪くな
り、に悪影響を及ぼすからである。The reason for limiting the content to 0.001-1.5% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the soldering surface of the brazed part, and 1. This is because if the content exceeds .5% by weight, the flow of the solder will be extremely poor, and this will have an adverse effect on the performance.
次に本発明の銀ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the silver solder alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左横に示す実施例と従来例の恨ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭ ｏ −Ｍ
ｎをメタライズし、さらにその上にニッケルめっきを５
μ施し、その部分に鉄−二・ノケル４２重量％から成る
リードフレームのろう付を行い、ろう付部のろう表面の
凹凸（溝）の個数及び凹凸（溝）の深さを測定したとこ
ろ下記の表の右欄に示すような結果を得た。(Example) The waxes of the example and the conventional example shown on the left side of the table below were coated with alumina for IC packages in a hydrogen atmosphere.
metallize n, and then nickel plating on top of it.
A lead frame made of 42 wt. The results shown in the right column of the table were obtained.
（以下余白）
上記の表の右欄の数値で明らかなように本発明の銀ろう
合金は、従来の恨ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。(Left below) As is clear from the numbers in the right column of the table above, the silver solder alloy of the present invention has fewer irregularities (grooves) than conventional solder alloys, and has fewer irregularities (grooves). The depth is shallow.
（発明の効果）
以上詳記した通り本発明による限ろう合金は、ろう付部
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう件部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the limited brazing alloy according to the present invention has less roughness on the brazed surface of the brazed part and less occurrence of unevenness, and therefore the brazed parts can be cleaned with acid or subjected to plating treatment. The amount of cleaning liquid that penetrates into the unevenness of the solder surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the solder area. be.
Claims (1)
ロム、パラジウム、マンガンの少なくとも１種０．００
１〜１．５重量％、残部銀より成る銀ろう合金。20-55% by weight of copper, 3-15% by weight of indium, and 0.00% of at least one of chromium, palladium, and manganese
A silver solder alloy consisting of 1 to 1.5% by weight, the balance being silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15168687A JPS63317287A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15168687A JPS63317287A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317287A true JPS63317287A (en) | 1988-12-26 |
Family
ID=15524041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15168687A Pending JPS63317287A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317287A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02165895A (en) * | 1988-12-16 | 1990-06-26 | Kyocera Corp | Material for brazing |
-
1987
- 1987-06-18 JP JP15168687A patent/JPS63317287A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02165895A (en) * | 1988-12-16 | 1990-06-26 | Kyocera Corp | Material for brazing |
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