JPS63317288A - Silver alloy filler metal for brazing - Google Patents
Silver alloy filler metal for brazingInfo
- Publication number
- JPS63317288A JPS63317288A JP15168787A JP15168787A JPS63317288A JP S63317288 A JPS63317288 A JP S63317288A JP 15168787 A JP15168787 A JP 15168787A JP 15168787 A JP15168787 A JP 15168787A JP S63317288 A JPS63317288 A JP S63317288A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- silver
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 title abstract description 10
- 239000002184 metal Substances 0.000 title abstract description 10
- 239000000945 filler Substances 0.000 title abstract description 8
- 229910001316 Ag alloy Inorganic materials 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 7
- 229910000846 In alloy Inorganic materials 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 description 15
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- DICWILYNZSJYMQ-UHFFFAOYSA-N [In].[Cu].[Ag] Chemical compound [In].[Cu].[Ag] DICWILYNZSJYMQ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Detergent Compositions (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、銀ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in silver solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用銀ろう合金としては、銀に銅を
７．５〜３５重量％さらにインジウム３〜１５重量％の
範囲で添加した銀−銅一インジウム合金が主に用いられ
ている。(Prior art and its problems) In general, silver brazing alloys for brazing materials in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc. contain 7.5 to 35% by weight of copper and 3 to 15% by weight of indium. A silver-copper-indium alloy is mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう件部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since it is difficult to completely remove this cleaning solution, the cleaning solution remains on uneven areas, resulting in disadvantages such as discoloration and corrosion of the solder area due to the remaining cleaning solution, and blistering of the plating. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
銀ろう合金を提供せんとするものである。(Objective of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a silver solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の銀ろう合金は、銅２０〜５５重量％、インジウ
ム３〜１５重量％及びチタン、ジルコニウム、バナジウ
ム、ニオブの少なくとも１種０．００１〜１．０重量％
、残部銀より成るものである。(Means for Solving the Problems) The silver brazing alloy of the present invention contains 20 to 55% by weight of copper, 3 to 15% by weight of indium, and 0.001 to 1.0% of at least one of titanium, zirconium, vanadium, and niobium. weight%
, the remainder consisting of silver.
本発明の銀ろう合金において、チタン、ジルコニウム、
バナジウム、ニオブの少なくとも１種を銀−銅一インジ
ウム合金に含有させる理由は、ろう付時溶融したろう材
の表面張力を小さくし、それによりろう付後のろう表面
の荒れを小さくし、凹凸の発生を抑制する為である。In the silver solder alloy of the present invention, titanium, zirconium,
The reason why at least one of vanadium and niobium is contained in the silver-copper-indium alloy is to reduce the surface tension of the melted brazing filler metal during brazing, thereby reducing the roughness of the solder surface after brazing and reducing unevenness. This is to suppress the occurrence.
そしてその含有量を０．００１〜１．０ｆｔ％と限定し
た理由は、０．００１重量％未満ではろう付後のろう表
面の荒れ及び凹凸の発生を抑制することができず、また
１、０重量％を超えると極端にろう流れが悪くなり、ろ
う付強度に悪影響を及ぼすからである。The reason for limiting the content to 0.001 to 1.0 ft% is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing, and This is because if it exceeds the weight percentage, the flow of the solder will be extremely poor, which will have an adverse effect on the brazing strength.
次に本発明の銀ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the silver solder alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左欄に示す実施例と従来例の銀ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−ニッケル４２を量％から成るリードフ
レームのろう付を行い、ろう付後のろう表面の凹凸（溝
）の個数及び凹凸（溝）の深さを測定したところ下記の
表の右横に示すような結果を得た。(Example) Silver solders of the example and conventional example shown in the left column of the table below were metallized with Mo-Mn on alumina for IC packages in a hydrogen atmosphere, and then 5μ of nickel was plated on top of the alumina. A lead frame made of 42% iron-nickel was brazed to the surface of the solder, and the number of unevenness (grooves) and the depth of the unevenness (grooves) on the soldering surface after brazing were measured. We obtained the results shown below.
上記の表の右欄の数値で明らかなように本発明の銀ろう
合金は、従来の銀ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。As is clear from the numbers in the right column of the table above, the silver brazing alloy of the present invention has fewer unevenness (grooves) than conventional silver brazing alloys, and the depth of the unevenness (grooves) is shallower. It is something.
（発明の効果）
以上詳記した通り本発明による銀ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう材部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the silver brazing alloy according to the present invention has less roughness on the solder surface after brazing and less occurrence of unevenness, and therefore, the soldered parts can be cleaned with acid or subjected to plating treatment. The amount of cleaning liquid, etc. that enters into the unevenness of the solder metal surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the solder metal part. be.
Claims (1)
タン、ジルコニウム、バナジウム、ニオブの少なくとも
１種０．００１〜１．０重量％、残部銀より成る銀ろう
合金。A silver brazing alloy comprising 20 to 55% by weight of copper, 3 to 15% by weight of indium, 0.001 to 1.0% by weight of at least one of titanium, zirconium, vanadium, and niobium, and the balance silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62151687A JPH0787996B2 (en) | 1987-06-18 | 1987-06-18 | Silver braze alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62151687A JPH0787996B2 (en) | 1987-06-18 | 1987-06-18 | Silver braze alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63317288A true JPS63317288A (en) | 1988-12-26 |
| JPH0787996B2 JPH0787996B2 (en) | 1995-09-27 |
Family
ID=15524064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62151687A Expired - Lifetime JPH0787996B2 (en) | 1987-06-18 | 1987-06-18 | Silver braze alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0787996B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106077867A (en) * | 2016-07-18 | 2016-11-09 | 吉林大学 | A kind of soldering tungstenio powder metallurgy is with polynary copper silver nickel niobium zirconium solder |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5713400A (en) * | 1980-06-27 | 1982-01-23 | Kawasaki Steel Co | Method of positioning collimater |
| JPS60166195A (en) * | 1984-02-10 | 1985-08-29 | Toshiba Corp | Brazing filler metal consisting of active metal |
| JPS60166165A (en) * | 1984-02-10 | 1985-08-29 | Toshiba Corp | Joining method of metal and ceramics |
-
1987
- 1987-06-18 JP JP62151687A patent/JPH0787996B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5713400A (en) * | 1980-06-27 | 1982-01-23 | Kawasaki Steel Co | Method of positioning collimater |
| JPS60166195A (en) * | 1984-02-10 | 1985-08-29 | Toshiba Corp | Brazing filler metal consisting of active metal |
| JPS60166165A (en) * | 1984-02-10 | 1985-08-29 | Toshiba Corp | Joining method of metal and ceramics |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106077867A (en) * | 2016-07-18 | 2016-11-09 | 吉林大学 | A kind of soldering tungstenio powder metallurgy is with polynary copper silver nickel niobium zirconium solder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0787996B2 (en) | 1995-09-27 |
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