JPS63313692A - Gold alloy filler metal for brazing - Google Patents
Gold alloy filler metal for brazingInfo
- Publication number
- JPS63313692A JPS63313692A JP14640487A JP14640487A JPS63313692A JP S63313692 A JPS63313692 A JP S63313692A JP 14640487 A JP14640487 A JP 14640487A JP 14640487 A JP14640487 A JP 14640487A JP S63313692 A JPS63313692 A JP S63313692A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- weight
- gold
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 21
- 239000002184 metal Substances 0.000 title abstract description 10
- 229910052751 metal Inorganic materials 0.000 title abstract description 10
- 239000000945 filler Substances 0.000 title abstract description 9
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 4
- 239000003353 gold alloy Substances 0.000 title 1
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 13
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000007788 roughening Methods 0.000 abstract 2
- 239000010953 base metal Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、金ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in gold solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう付用金ろう合金としては、金に銅を
１５〜６２重量％、ニッケル２〜５重量％の範囲で添加
した金−制御ニッケル合金が主に用いられている。(Prior art and its problems) Generally, as a gold solder alloy for brazing vacuum circuit breakers, electron tubes, thyristors, IC packages, etc., copper is added to gold in a range of 15 to 62% by weight and nickel in a range of 2 to 5% by weight. Gold-controlled nickel alloys are mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう材部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the brazing metal or blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
金ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a gold solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の金ろう合金は、銅１０〜７０重量％、ニッケル
１〜８重量％、りん０．００１〜１．５重量％、シリコ
ン０．００１〜１．０重量％、残部金より成るものであ
る。(Means for Solving the Problems) The gold brazing alloy of the present invention includes 10 to 70% by weight of copper, 1 to 8% by weight of nickel, 0.001 to 1.5% by weight of phosphorus, and 0.001 to 1.5% by weight of silicon. 0% by weight, the balance being gold.
本発明の金ろう合金において、りん０．００１〜１．５
重量％、シリコン０．００１〜１．０重量％を金−制御
ニッケル合金に含有させる理由は、ろう付時溶融したろ
う材の表面張力を小さくし、それによりろう付部のろう
表面の荒れを小さくし、凹凸の発生を抑制する為である
。In the gold brazing alloy of the present invention, phosphorus 0.001 to 1.5
The reason why 0.001 to 1.0% by weight of silicon is contained in the gold-controlled nickel alloy is to reduce the surface tension of the melted brazing filler metal during brazing, thereby reducing the roughness of the brazed surface of the brazed part. This is to reduce the size and suppress the occurrence of unevenness.
そしてこれらりん及びシリコンの含有量をそれぞれ０．
００１〜１．５重量％、０．００１〜１．０重量％と限
定した理由は、りんが０．００１重量％又はシリコンが
０．００１重量％未満ではろう付部のろう表面の荒れ及
び凹凸の発生を抑制することができず、またりんが１．
５重量％又はシリコンが１．０重量％を超えると極端に
ろう流れが生じ、母材を汚損し、さらにろう付強度に悪
影響を及ぼすからである。The contents of phosphorus and silicon are each 0.
The reason for limiting it to 0.001 to 1.5% by weight and 0.001 to 1.0% by weight is that if the phosphorus content is less than 0.001% by weight or the silicon content is less than 0.001% by weight, the solder surface of the brazed part will become rough and uneven. The generation of phosphorus cannot be suppressed, and phosphorus is
This is because if the silicon content exceeds 5% by weight or 1.0% by weight, excessive solder flow will occur, staining the base material, and further affecting the brazing strength.
次に本発明の金ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the gold brazing alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左欄に示す実施例と従来例の金ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−ニッケル４２重量％から成るリードフ
レームのろう付を行い、ろう付部のろう表面の凹凸（溝
）の個数及び凹凸（溝）の深さを測定したところ下記の
表の右欄に示すような結果を得た。(Example) The gold solders of the example and conventional example shown in the left column of the table below were metallized with Mo-Mn on alumina for IC packages in a hydrogen atmosphere, and then 5 μm of nickel was plated on top of that, and the parts were A lead frame made of 42% iron and nickel by weight was brazed to the surface of the soldered part, and the number of irregularities (grooves) and the depth of the irregularities (grooves) on the brazed surface of the brazed part were measured, and the results are shown in the right column of the table below. I got similar results.
上記の表の右欄の数値で明らかなように本発明の金ろう
合金は、従来の金ろう合金に比較して凹凸（溝）の発生
数が少な（、また凹凸（溝）の深さが浅いものである。As is clear from the numbers in the right column of the table above, the gold solder alloy of the present invention has fewer unevenness (grooves) than conventional gold solder alloys (and has a lower depth of unevenness (grooves)). It is shallow.
（発明の効果）
以上詳記した通り本発明による金ろう合金は、ろう付部
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう何部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the gold brazing alloy according to the present invention has less roughness on the brazed surface of the brazed part and less occurrence of unevenness, and therefore the brazed parts can be cleaned with acid or subjected to plating treatment. The amount of cleaning liquid, etc. that enters into the unevenness of the wax surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of some parts of the wax. be.
Claims (1)
００１〜１．５重量％、シリコン０．００１〜１．０重
量％、残部金より成る金ろう合金。Copper 10-70% by weight, nickel 1-8% by weight, phosphorus 0.
A gold brazing alloy consisting of 0.001 to 1.5% by weight of silicon, 0.001 to 1.0% by weight of silicon, and the balance gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14640487A JPS63313692A (en) | 1987-06-12 | 1987-06-12 | Gold alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14640487A JPS63313692A (en) | 1987-06-12 | 1987-06-12 | Gold alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63313692A true JPS63313692A (en) | 1988-12-21 |
Family
ID=15406936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14640487A Pending JPS63313692A (en) | 1987-06-12 | 1987-06-12 | Gold alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63313692A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366493A (en) * | 1989-08-04 | 1991-03-22 | Ngk Spark Plug Co Ltd | Material for brazing |
| JP2007090430A (en) * | 2005-09-28 | 2007-04-12 | General Electric Co <Ge> | GOLD/NICKEL/COPPER BRAZING ALLOY FOR BRAZING WC-Co TO TITANIUM ALLOY |
| CN106591620A (en) * | 2015-10-17 | 2017-04-26 | 深圳市远思达成科技有限公司 | Copper-gold alloy material and copper-gold alloy wire |
-
1987
- 1987-06-12 JP JP14640487A patent/JPS63313692A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366493A (en) * | 1989-08-04 | 1991-03-22 | Ngk Spark Plug Co Ltd | Material for brazing |
| JP2007090430A (en) * | 2005-09-28 | 2007-04-12 | General Electric Co <Ge> | GOLD/NICKEL/COPPER BRAZING ALLOY FOR BRAZING WC-Co TO TITANIUM ALLOY |
| CN106591620A (en) * | 2015-10-17 | 2017-04-26 | 深圳市远思达成科技有限公司 | Copper-gold alloy material and copper-gold alloy wire |
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