CN106591620A - Copper-gold alloy material and copper-gold alloy wire - Google Patents
Copper-gold alloy material and copper-gold alloy wire Download PDFInfo
- Publication number
- CN106591620A CN106591620A CN201510677652.3A CN201510677652A CN106591620A CN 106591620 A CN106591620 A CN 106591620A CN 201510677652 A CN201510677652 A CN 201510677652A CN 106591620 A CN106591620 A CN 106591620A
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- China
- Prior art keywords
- copper
- gold alloy
- gold
- alloy material
- good
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
The invention puts forward a copper-gold alloy material, which comprises the following components by weight percentage: 57.00%-59.00% of gold, the balance copper and no more than 0.10% of the inevitable impurities. At the same time, the invention puts forward a copper-gold alloy wire, which is made of the aforementioned material. The copper-gold alloy not only has good metallic luster close to a 18K gold state, but also has good ductility, and is easy for machine shaping, especially the copper-gold alloy material integrates the metal characteristics of gold and copper, has very good electrical conductivity and tensile strength, and is suitable for wide application to industrial production. At the same time, the copper-gold alloy wire made of the copper-gold alloy material has good electrical conductivity and low electrical resistivity, improves the conductive transmission efficiency, also has high tensile strength, and cannot be damaged easily in repeated stretching, bending and other adverse working environments, thereby prolonging the service life.
Description
Technical field
The present invention relates to metal alloy compositions and lead technology field, more particularly to a kind of copper-gold alloy material and copper-gold alloy wire.
Background technology
In metal material field, the material capability of gold it is further preferred that, with good metallic luster, its can forgeability and ductility etc. all very well, and molding is easily worked, in being widely used in the industrial circles such as electronics industry, modern communication, space flight and aviation industry；The material capability of copper also preferably, its made of soft, ductility also very well, outstanding other conductive and heat conductivilitys it is further preferred that, be widely used in electric field the preferable selection as conductor material.
More than being based on, at present both at home and abroad the research institution of metal alloy compositions is attempted and has been studied to copper-gold alloy material, how to provide that a kind of performance is good, enable in particular to become problem and the direction of research staff's research as the copper-gold alloy material of conductor material.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided one kind conducts electricity very well, tensile strength is high, and the copper-gold alloy material with good metallic luster degree and has copper-gold alloy wire made by the material.
What the present invention was realized in：A kind of copper-gold alloy material, its material composition composition includes by weight percentage：The gold of 57.00%-59.00%, remaining is copper and the inevitable impurity less than 0.10%.
Preferably, its material composition composition includes by weight percentage：The gold of 58.00%-59.00%, remaining is copper and the inevitable impurity less than 0.10%.
Preferably, its material composition composition includes by weight percentage：The gold of 58.80%-59.00%, remaining is copper and the inevitable impurity less than 0.10%.
Further, a kind of copper-gold alloy wire, it is made up of above-mentioned copper-gold alloy material.
What the present invention had has the technical effect that：The present invention into the proportioning being grouped into by studying copper-gold alloy, especially the Component Percent of gold is configured, so as to draw a kind of copper-gold alloy material of offer of the present invention, it not only has good metallic luster degree, has reached the state of the close 18K gold of its metallic luster, and its ductility is fine, it is easily worked molding, especially this copper-gold alloy material fusion metallic character of Jin Hetong, possesses good electric conductivity and tensile strength, is suitable to be widely applied in commercial production.Meanwhile, the copper-gold alloy wire by made by this copper-gold alloy material, with good electric conductivity, relatively low resistivity, improves conducting transmission efficiency, and tensile strength is high, in the severe working environments such as stretching repeatedly, bending, it is not easy to be damaged, and then extends its service life.
Specific embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made belongs to the scope of protection of the invention.
Embodiment one：
The invention provides a kind of copper-gold alloy material, its material composition is constituted to be included by weight percentage：57.00% gold, remaining is copper and the inevitable impurity less than 0.10%.
Embodiment two：
The invention provides a kind of copper-gold alloy material, its material composition is constituted to be included by weight percentage：58.00% gold, remaining is copper and the inevitable impurity less than 0.10%.
Embodiment three：
The invention provides a kind of copper-gold alloy material, its material composition is constituted to be included by weight percentage：58.80% gold, remaining is copper and the inevitable impurity less than 0.10%.
Example IV：
The invention provides a kind of copper-gold alloy material, its material composition is constituted to be included by weight percentage：59.00% gold, remaining is copper and the inevitable impurity less than 0.10%.
In above-mentioned, the copper-gold alloy material that the present invention is provided into the proportioning being grouped into copper-gold alloy by being adjusted, especially the Component Percent of gold is configured, good metallic luster degree is respectively provided with, the state of the close 18K gold of its metallic luster has been reached, and its ductility is fine, it is easily worked molding, especially this copper-gold alloy material fusion metallic character of Jin Hetong, possesses good electric conductivity and tensile strength, is suitable to be widely applied in commercial production.Meanwhile, the copper-gold alloy wire by made by this copper-gold alloy material, with good electric conductivity, relatively low resistivity, improves conducting transmission efficiency, and tensile strength is high, in the severe working environments such as stretching repeatedly, bending, it is not easy to be damaged, and then extends its service life.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all any modification, equivalent substitution and improvements within the spirit and principles in the present invention, made etc., be should be included within the scope of the present invention.
Claims (4)
1. a kind of copper-gold alloy material, it is characterised in that its material composition composition includes by weight percentage：
The gold of 57.00%-59.00%, remaining is copper and the inevitable impurity less than 0.10%.
2. copper-gold alloy material according to claim 1, it is characterised in that its material composition composition is pressed
Percentage by weight includes：
The gold of 58.00%-59.00%, remaining is copper and the inevitable impurity less than 0.10%.
3. copper-gold alloy material according to claim 1, it is characterised in that its material composition composition is pressed
Percentage by weight includes：
The gold of 58.80%-59.00%, remaining is copper and the inevitable impurity less than 0.10%.
4. a kind of copper-gold alloy wire, it is closed by copper as claimed in any of claims 1 to 3 gold
Golden material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510677652.3A CN106591620A (en) | 2015-10-17 | 2015-10-17 | Copper-gold alloy material and copper-gold alloy wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510677652.3A CN106591620A (en) | 2015-10-17 | 2015-10-17 | Copper-gold alloy material and copper-gold alloy wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106591620A true CN106591620A (en) | 2017-04-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510677652.3A Pending CN106591620A (en) | 2015-10-17 | 2015-10-17 | Copper-gold alloy material and copper-gold alloy wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106591620A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110106384A (en) * | 2019-04-02 | 2019-08-09 | 安徽捷澳电子有限公司 | Super thin noble metal flat filament and preparation method thereof |
| CN110468297A (en) * | 2019-09-09 | 2019-11-19 | 上海电缆研究所有限公司 | A kind of high performance audio transmission alloy wire and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313692A (en) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | Gold alloy filler metal for brazing |
| JP2001335861A (en) * | 2000-05-26 | 2001-12-04 | Tokuriki Honten Co Ltd | Gold alloy for ornament |
| CN102923640A (en) * | 2011-08-12 | 2013-02-13 | Nxp股份有限公司 | Semiconductor device having Au-Cu electrodes and method of manufacturing semiconductor device |
| CN104775049A (en) * | 2015-03-31 | 2015-07-15 | 中国科学院物理研究所 | Au-Cu alloy material as well as pure spin current device containing Au-Cu alloy material and application of Au-Cu alloy material |
-
2015
- 2015-10-17 CN CN201510677652.3A patent/CN106591620A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313692A (en) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | Gold alloy filler metal for brazing |
| JP2001335861A (en) * | 2000-05-26 | 2001-12-04 | Tokuriki Honten Co Ltd | Gold alloy for ornament |
| CN102923640A (en) * | 2011-08-12 | 2013-02-13 | Nxp股份有限公司 | Semiconductor device having Au-Cu electrodes and method of manufacturing semiconductor device |
| CN104775049A (en) * | 2015-03-31 | 2015-07-15 | 中国科学院物理研究所 | Au-Cu alloy material as well as pure spin current device containing Au-Cu alloy material and application of Au-Cu alloy material |
Non-Patent Citations (2)
| Title |
|---|
| V. A. LAVRENKO，ET，AL: "Kinetics and Mechanism of High-temperature Oxidation in Air of Au-Cu alloy", 《POWDER METALLURGY AND METAL CERAMICS》 * |
| 张涛，等: "冷变形Au-44%Cu合金固态相转变研究", 《稀有金属》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110106384A (en) * | 2019-04-02 | 2019-08-09 | 安徽捷澳电子有限公司 | Super thin noble metal flat filament and preparation method thereof |
| CN110468297A (en) * | 2019-09-09 | 2019-11-19 | 上海电缆研究所有限公司 | A kind of high performance audio transmission alloy wire and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170426 |
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| RJ01 | Rejection of invention patent application after publication |