CN105112721A - Copper-rare earth alloy material - Google Patents

Copper-rare earth alloy material Download PDF

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Publication number
CN105112721A
CN105112721A CN201510567036.2A CN201510567036A CN105112721A CN 105112721 A CN105112721 A CN 105112721A CN 201510567036 A CN201510567036 A CN 201510567036A CN 105112721 A CN105112721 A CN 105112721A
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copper
alloy material
rare earth
earth alloy
silicon
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CN201510567036.2A
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Chinese (zh)
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周欢
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Individual
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Individual
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Abstract

The invention relates to a copper-rare earth alloy material. The copper-rare earth alloy material comprises the following components by weight percentage: 1.5-3.5% of nickel, 0.1-0.3% of lithium, 0.01-0.03% of silver, 0.4-0.6% of silicon, 0.001-0.05% of lanthanide series rare earth metals and the balance of copper and inevitable impurities. The copper alloy material has high tensile strength and good fracture resistance. The electric conductivity of the copper-rare earth alloy material is similar to that of metallic copper.

Description

A kind of Copper rare earth alloy material
Technical field
The invention belongs to field of alloy material, refer to a kind of Copper rare earth alloy material especially.
Background technology
The wire now used, in particular for having the wire of mobile or vibrations place and cable etc., mainly use annealed copper wire or it is coated with tin etc. the stranded formation of copper cash twist thread as conductor, this conductor is coated with the electric wire of the isolator such as the vinylchlorid of concentric circles or glue connection vinylchlorid.
The requirement of the recent weather resistance to wire, folding resistance and conductivity is also more and more higher.From saving the angle of the energy, the diameter reducing wire conductor is with weight reduction and save material, but the powered-on capacity of wire conductor is in the past certain, reduces the diameter of wire and it also reduces reduction by capacity.And the reduction of wire conductor diameter causes folding quality to decline, therefore existing electric wire cannot meet these requirements.
Summary of the invention
The object of this invention is to provide the improvement of a Cu alloy material, intensity and the specific conductivity of copper alloy can be improved by this technical scheme, also ensure while guarantee powered-on capacity or improve folding quality.
The present invention is achieved by the following technical solutions:
A kind of Cu alloy material, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-3.5%, the lithium of 0.1-0.3%, the silver of 0.01-0.03%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
Described nickel, it is 0.1-0.5 μm of particle that silicon and lanthanide rare metal form diameter, with 185-205/mm 2density exists.
The composition composition of described Cu alloy material includes by weight percentage further: the tin of 0.1-0.6%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
Described nickel, it is 0.1-0.5 μm of particle that silicon and lanthanide rare metal form diameter, and forming diameter with one or more combinations in described tin, cobalt, phosphorus or iron is 0.1-0.5 μm of particle, with 185-205/mm 2density exists.
The composition composition of described Cu alloy material includes by weight percentage further: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
Described nickel, it is 0.1-0.5 μm of particle that one or more combinations in silicon and the same tin of lanthanide rare metal, cobalt, phosphorus or iron form diameters, and forming diameters with one or both combinations in described manganese or magnesium is 0.1-0.5 μm of particle, with 185-205/mm 2density exists.
The invention has the beneficial effects as follows;
By adding lanthanide rare metal in the inventive solutions, effectively can improve the specific conductivity of copper alloy, because the perveance of nickel and silicon etc. is lower than the perveance of copper in the alloy, powered-on capacity after adding the material such as nickel and silicon reduces, but after adding lanthanide rare metal, the specific conductivity of copper alloy improves the specific conductivity even exceeding copper on the contrary.
Embodiment
Below by way of specific embodiment, the present invention is described in detail.
Each composition is measured all by weight percentage in the present invention.
The element adding the intensity in order to improve copper alloy of nickel and silicon, in copper alloy, the intensity that tantnickel precipitate improves copper alloy is formed by nickel and silicon, the weight percent content of nickel is 1.5-3.5%, the weight percentage of silicon is 0.4-0.6%, described nickel, it is 0.1-0.5 μm of particle that silicon and lanthanide rare metal form diameter, with 185-205/mm 2density exists.Although these two kinds of elements can strengthen the intensity of copper alloy, the specific conductivity of these two kinds of elements is a lot of lower than the specific conductivity of copper, and the amount added too much can affect the specific conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity declines.
Lanthanide rare metal is added in the technical program, this rare earth metal can change the crystal arrangement of copper alloy inside, the percent of pass improving electronics can improve the powered-on capacity of copper alloy, and the consumption the lanthanide rare metal be suitable in the present invention is 0.001-0.05%.Certainly can increase the consumption of lanthanide rare metal, but increase according to the purposes of wire the cost too much improving copper alloy on the contrary, and the electric conductivity of copper alloy can not be increased when usage quantity is more than 1.0% on the contrary again.
For Cu alloy material of the present invention, can also contain at least one in tin, iron, cobalt, phosphorus, in these elements, phosphorus can increase the intensity of Cu alloy material, but consumption too much can affect the toughness of Cu alloy material.Improve bending endurance quality while other several elements can increase Cu alloy material intensity, concrete consumption is the iron of the phosphorus of the cobalt of the tin of 0.1-0.6%, 0.05-1.0%, 0.01-0.05%, 0.05-0.1%; Described nickel, it is 0.1-0.5 μm of particle that silicon and lanthanide rare metal form diameter, and forming diameter with one or more combinations in described tin, cobalt, phosphorus or iron is 0.1-0.5 μm of particle, with 185-205/mm 2density exists.The specific conductivity of Cu alloy material can be affected when the consumption of these elements is too much.
Can also select at least one in magnesium and manganese two kinds of elements in the present invention, these two kinds of elements can prevent from adding thermal embrittlement and improving in hot workability have very large advantage, are conducive to reducing diameter of wire.But obviously can affect the conductivity of copper alloy when the consumption of these two kinds of elements is more than 0.5%, the consumption of these two kinds of elements is the manganese of 0.02-0.1% and/or the magnesium of 0.08-0.2% in the present invention.Described nickel, it is 0.1-0.5 μm of particle that one or more combinations in silicon and the same tin of lanthanide rare metal, cobalt, phosphorus or iron form diameters, and forming diameters with one or both combinations in described manganese or magnesium is 0.1-0.5 μm of particle, with 185-205/mm 2density exists.
Use high-frequency melting stove each component to be melted casting copper base in embodiments of the invention 1-6, after copper base is carried out hot extrusion at 900 DEG C, quench process immediately obtains pole, and then cold drawn obtaining expects material.
Composition in each specific embodiment and performance are shown in Table 1
By above embodiment, only include nickel, the highest electric conductivity close to copper of electric conductivity of the copper alloy of silicon and lanthanide rare metal, but intensity is not high.The preferred embodiment of the present invention is 3 and 4.

Claims (6)

1. a Copper rare earth alloy material, it is characterized in that: the composition composition of described Copper rare earth alloy material includes by weight percentage: the nickel of 1.5-3.5%, the lithium of 0.1-0.3%, the silver of 0.01-0.03%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
2. a kind of Copper rare earth alloy material according to claim 1, is characterized in that: described nickel, and it is 0.1-0.5 μm of particle that silicon and lanthanide rare metal form diameter, with 185-205/mm 2density exists.
3. a kind of Copper rare earth alloy material according to claim 1, it is characterized in that: the composition composition of described Cu alloy material includes by weight percentage further: the tin of 0.1-0.6%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
4. a kind of Copper rare earth alloy material according to claim 3, it is characterized in that: described nickel, it is 0.1-0.5 μm of particle that silicon and lanthanide rare metal form diameter, and forming diameter with one or more combinations in described tin, cobalt, phosphorus or iron is 0.1-0.5 μm of particle, with 185-205/mm 2density exists.
5. a kind of Copper rare earth alloy material according to claim 1 and 2, is characterized in that: the composition of described Cu alloy material composition includes by weight percentage further: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
6. a kind of Copper rare earth alloy material according to claim 5, it is characterized in that: described nickel, it is 0.1-0.5 μm of particle that one or more combinations in silicon and the same tin of lanthanide rare metal, cobalt, phosphorus or iron form diameters, forming diameter with one or both combinations in described manganese or magnesium is 0.1-0.5 μm of particle, with 185-205/mm 2density exists.
CN201510567036.2A 2015-09-08 2015-09-08 Copper-rare earth alloy material Pending CN105112721A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106167860A (en) * 2016-08-22 2016-11-30 吴雅萍 A kind of Cu-RE alloys
CN106834798A (en) * 2016-11-23 2017-06-13 虞海盈 A kind of high conductivity copper alloy
CN107447125A (en) * 2017-08-30 2017-12-08 太仓天润新材料科技有限公司 The highly conductive environmental friendly material of one Albatra metal
CN114453418A (en) * 2022-01-05 2022-05-10 广东中发摩丹科技有限公司 Short-process preparation method of high-strength high-conductivity Cu-Ni-Co-Si-Li alloy high-precision band

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1544672A (en) * 2003-11-11 2004-11-10 成都精作科技发展有限公司 Copper alloy material having high heat conductivity
CN102383002A (en) * 2011-10-26 2012-03-21 云南新铜人实业有限公司 Copper-based alloy for cable shielding
CN102851528A (en) * 2012-09-10 2013-01-02 任静儿 High-conductivity copper alloy
CN102864333A (en) * 2012-09-10 2013-01-09 顾建 Copper rare earth alloy material
CN104263992A (en) * 2014-10-15 2015-01-07 宁波兴业盛泰集团有限公司 Cu-Ag alloy material for motor communtator and preparation method of Cu-Ag alloy material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1544672A (en) * 2003-11-11 2004-11-10 成都精作科技发展有限公司 Copper alloy material having high heat conductivity
CN102383002A (en) * 2011-10-26 2012-03-21 云南新铜人实业有限公司 Copper-based alloy for cable shielding
CN102851528A (en) * 2012-09-10 2013-01-02 任静儿 High-conductivity copper alloy
CN102864333A (en) * 2012-09-10 2013-01-09 顾建 Copper rare earth alloy material
CN104263992A (en) * 2014-10-15 2015-01-07 宁波兴业盛泰集团有限公司 Cu-Ag alloy material for motor communtator and preparation method of Cu-Ag alloy material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106167860A (en) * 2016-08-22 2016-11-30 吴雅萍 A kind of Cu-RE alloys
CN106834798A (en) * 2016-11-23 2017-06-13 虞海盈 A kind of high conductivity copper alloy
CN107447125A (en) * 2017-08-30 2017-12-08 太仓天润新材料科技有限公司 The highly conductive environmental friendly material of one Albatra metal
CN114453418A (en) * 2022-01-05 2022-05-10 广东中发摩丹科技有限公司 Short-process preparation method of high-strength high-conductivity Cu-Ni-Co-Si-Li alloy high-precision band

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