CN105118542A - Copper alloy material used for wires - Google Patents
Copper alloy material used for wires Download PDFInfo
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- CN105118542A CN105118542A CN201510566949.2A CN201510566949A CN105118542A CN 105118542 A CN105118542 A CN 105118542A CN 201510566949 A CN201510566949 A CN 201510566949A CN 105118542 A CN105118542 A CN 105118542A
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Abstract
The invention relates to a copper alloy material used for wires. The copper alloy material comprises the following components in weight percentage: 1.5 to 2.0% of nickel; 0.4 to 0.8% of aluminum; 0.4 to 0.6% of silicon; and 0.001 to 0.05% of lanthanide-series rare earth metal. The copper alloy material further comprises copper and inevitable impurities.
Description
Technical field
The invention belongs to field of alloy material, refer to a kind of Cu alloy material of wire especially.
Background technology
The wire now used, in particular for having the wire of mobile or vibrations place and cable etc., mainly use annealed copper wire or it is coated with tin etc. the stranded formation of copper cash twist thread as conductor, this conductor is coated with the electric wire of the insulator such as the vinyl chloride of concentric circles or glue connection vinyl chloride.
The requirement of the recent durability to wire, folding resistance and electric conductivity is also more and more higher.From saving the angle of the energy, the diameter reducing wire conductor is with weight reduction and save material, but the powered-on capacity of wire conductor is in the past certain, reduces the diameter of wire and it also reduces reduction by capacity.And the reduction of wire conductor diameter causes folding quality to decline, therefore existing electric wire cannot meet these requirements.
Summary of the invention
The object of this invention is to provide a kind of improvement of Cu alloy material, intensity and the conductivity of copper alloy can be improved by this technical scheme, also ensure while making to ensure powered-on capacity when reducing diameter of wire or improve folding quality.
The present invention is achieved by the following technical solutions:
A kind of Cu alloy material of wire, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-2.0%, the aluminium of 0.4-0.8%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
The composition composition of described Cu alloy material includes by weight percentage further: the tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
The composition composition of described Cu alloy material includes by weight percentage further: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
The composition composition of described Cu alloy material includes by weight percentage further: the zinc of 0.2-1.0%.
The invention has the beneficial effects as follows;
By adding lanthanide rare metal in the inventive solutions, effectively can improve the conductivity of copper alloy, because the electrical conductivity of nickel and silicon etc. is lower than the electrical conductivity of copper in the alloy, when the powered-on capacity after adding the material such as nickel and silicon after reducing diameter of wire reduces, but after adding lanthanide rare metal, the conductivity of copper alloy improves the conductivity even exceeding copper on the contrary, thus can realize the reduction of diameter of wire.
Embodiment
Below by way of specific embodiment, the present invention is described in detail.
Each composition is measured all by weight percentage in the present invention.
The element adding the intensity in order to improve copper alloy of nickel and silicon, forms by nickel and silicon the intensity that tantnickel precipitate improves copper alloy in copper alloy, and the weight percent content of nickel is 1.5-2.0%, and the weight percentage of silicon is 0.4-0.6%.Although these two kinds of elements can strengthen the intensity of copper alloy, the conductivity of these two kinds of elements is a lot of lower than the conductivity of copper, and the amount added too much can affect the conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity declines.The weight percentage of aluminium is 0.4-0.8%, has power-assisted to improve the intensity of wire and less on the impact of conductivity.
Lanthanide rare metal is added in the technical program, this rare earth metal can change the crystal arrangement of copper alloy inside, the percent of pass improving electronics can improve the powered-on capacity of copper alloy, and the consumption the lanthanide rare metal be suitable in the present invention is 0.001-0.05%.Certainly can increase the consumption of lanthanide rare metal, but increase according to the purposes of wire the cost too much improving copper alloy on the contrary, and the conductance of copper alloy can not be increased when use amount is more than 1.0% on the contrary again.
For Cu alloy material of the present invention, can also contain at least one in tin, iron, chromium, cobalt, phosphorus, in these elements, phosphorus can increase the intensity of Cu alloy material, but consumption too much can affect the toughness of Cu alloy material.Improve bending endurance quality while other several elements can increase Cu alloy material intensity, concrete consumption is the iron of the phosphorus of the cobalt of the chromium of the tin of 0.1-0.6%, 0.01-0.1%, 0.05-1.0%, 0.01-0.05%, 0.05-0.1%.The conductivity of Cu alloy material can be affected when the consumption of these elements is too much.
Can also select at least one in magnesium and manganese two kinds of elements in the present invention, these two kinds of elements can prevent from adding thermal embrittlement and improving in hot-working character have very large advantage, are conducive to reducing diameter of wire.But obviously can affect the electric conductivity of copper alloy when the consumption of these two kinds of elements is more than 0.5%, the consumption of these two kinds of elements is the manganese of 0.02-0.1% and/or the magnesium of 0.08-0.2% in the present invention.
Can also select element zinc in the present invention, be mainly used in the thermal effectiveness improving copper alloy, the amount selected in the present invention is 0.2-1.0%.The conductivity of copper alloy can be affected when consumption is too much.
Use high-frequency melting stove each component to be melted casting copper base in embodiments of the invention 1-6, after copper base is carried out hot extrusion at 900 DEG C, quench process immediately obtains pole, then cold drawnly obtains line material.
Composition in each specific embodiment and performance are shown in Table 1
Table 1
By above embodiment, only include nickel, the highest conductance close to copper of conductance of the copper alloy of silicon and lanthanide rare metal, but intensity is not high.The preferred embodiment of the present invention is 3 and 4.
Claims (4)
1. the Cu alloy material of a wire, it is characterized in that: the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-2.0%, the aluminium of 0.4-0.8%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
2. the Cu alloy material of a kind of wire according to claim 1, it is characterized in that: the composition composition of described Cu alloy material includes by weight percentage further: the tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
3. the Cu alloy material of a kind of wire according to claim 1 and 2, is characterized in that: the composition of described Cu alloy material composition includes by weight percentage further: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
4. the Cu alloy material of a kind of wire according to claim 1 and 2, is characterized in that: the composition composition of described Cu alloy material includes by weight percentage further: the zinc of 0.2-1.0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566949.2A CN105118542A (en) | 2015-09-08 | 2015-09-08 | Copper alloy material used for wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566949.2A CN105118542A (en) | 2015-09-08 | 2015-09-08 | Copper alloy material used for wires |
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| Publication Number | Publication Date |
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| CN105118542A true CN105118542A (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510566949.2A Pending CN105118542A (en) | 2015-09-08 | 2015-09-08 | Copper alloy material used for wires |
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| CN (1) | CN105118542A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222485A (en) * | 2016-08-22 | 2016-12-14 | 吴雅萍 | A kind of Cu alloy material of wire |
| CN106297943A (en) * | 2016-08-29 | 2017-01-04 | 芜湖楚江合金铜材有限公司 | A kind of copper conductor of flame-resistant insulation and preparation method thereof |
| CN114293065A (en) * | 2021-12-31 | 2022-04-08 | 镇江市镇特合金材料有限公司 | Copper alloy plate with high strength |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2553733A1 (en) * | 1975-11-29 | 1977-06-08 | Metallgesellschaft Ag | Creep resistant copper-nickel alloys - obtd. by treating the melt to reduce the amt. of impurities |
| US20100092334A1 (en) * | 2007-05-10 | 2010-04-15 | Gebauer & Griller Metallwerk Gmbh | Metal Alloy |
| CN102855957A (en) * | 2012-09-10 | 2013-01-02 | 顾建 | Copper alloy material for lead |
| CN102851536A (en) * | 2012-09-10 | 2013-01-02 | 任静儿 | Copper alloy used in conductor wire |
| CN102864333A (en) * | 2012-09-10 | 2013-01-09 | 顾建 | Copper rare earth alloy material |
| CN102864332A (en) * | 2012-09-10 | 2013-01-09 | 任静儿 | Copper rare earth alloy |
-
2015
- 2015-09-08 CN CN201510566949.2A patent/CN105118542A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2553733A1 (en) * | 1975-11-29 | 1977-06-08 | Metallgesellschaft Ag | Creep resistant copper-nickel alloys - obtd. by treating the melt to reduce the amt. of impurities |
| US20100092334A1 (en) * | 2007-05-10 | 2010-04-15 | Gebauer & Griller Metallwerk Gmbh | Metal Alloy |
| CN102855957A (en) * | 2012-09-10 | 2013-01-02 | 顾建 | Copper alloy material for lead |
| CN102851536A (en) * | 2012-09-10 | 2013-01-02 | 任静儿 | Copper alloy used in conductor wire |
| CN102864333A (en) * | 2012-09-10 | 2013-01-09 | 顾建 | Copper rare earth alloy material |
| CN102864332A (en) * | 2012-09-10 | 2013-01-09 | 任静儿 | Copper rare earth alloy |
Non-Patent Citations (1)
| Title |
|---|
| 史文等: "《金属材料及热处理》", 28 February 2011, 上海科学技术出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222485A (en) * | 2016-08-22 | 2016-12-14 | 吴雅萍 | A kind of Cu alloy material of wire |
| CN106297943A (en) * | 2016-08-29 | 2017-01-04 | 芜湖楚江合金铜材有限公司 | A kind of copper conductor of flame-resistant insulation and preparation method thereof |
| CN114293065A (en) * | 2021-12-31 | 2022-04-08 | 镇江市镇特合金材料有限公司 | Copper alloy plate with high strength |
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Application publication date: 20151202 |