CN102867562A - Cupper alloy - Google Patents
Cupper alloy Download PDFInfo
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- CN102867562A CN102867562A CN2012103341494A CN201210334149A CN102867562A CN 102867562 A CN102867562 A CN 102867562A CN 2012103341494 A CN2012103341494 A CN 2012103341494A CN 201210334149 A CN201210334149 A CN 201210334149A CN 102867562 A CN102867562 A CN 102867562A
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- alloy material
- cupper
- copper
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- copper alloy
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Abstract
The invention relates to a cupper alloy material. The cupper alloy material consists of following components in percentage by weight: 1.5-3.5 percent of nickel, 0.4-0.6 percent of silicon, 0.003-0.03 percent of lanthanide rare earth metal, and the balance of cupper and inevitable impurities. The cupper alloy material provided by the invention is high in tension strength and good in fracture resistance, and is similar to conductivity of metal cupper.
Description
Technical field
The invention belongs to field of alloy material, refer to especially a kind of copper alloy.
Background technology
The wire that now uses, in particular for wire that mobile or vibrations place are arranged and cable etc., main what use is the twisting thread as conductor of annealed copper wire or the stranded formation of copper cash that is coated with tin etc. on it, is coated with the electric wire of the insulators such as the vinyl chloride of concentric circles or glue connection vinyl chloride on this conductor.
Recently also more and more higher to the requirement of durability, folding resistance and the electric conductivity of wire.From saving the angle of the energy, reduce the diameter of wire conductor with weight reduction and saving material, but the powered-on capacity of wire conductor in the past is certain, reduces the diameter of wire and has also just reduced reducing by capacity.And the reducing of wire conductor diameter causes folding quality to descend, and therefore existing electric wire can't satisfy these requirements.
Summary of the invention
The purpose of this invention is to provide the improvement of a Cu alloy material, can improve intensity and the conductivity of copper alloy by this technical scheme, when guaranteeing powered-on capacity, also guarantee or improve folding quality.
The present invention is achieved by the following technical solutions:
One Albatra metal-, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-3.5%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.003-0.03%, all the other are copper and inevitable impurity.
The composition composition of described copper alloy further includes by weight percentage: the tin of 0.1-0.6%, the cobalt of 0.06-0.8%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
The composition composition of described copper alloy further includes by weight percentage: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
The invention has the beneficial effects as follows;
By in technical scheme of the present invention, adding the lanthanide rare metal, conductivity that can the Effective Raise copper alloy, because the electrical conductivity of nickel and silicon etc. is lower than the electrical conductivity of copper in alloy, powered-on capacity after adding the materials such as nickel and silicon reduces, but after adding the lanthanide rare metal, the conductivity of copper alloy improves even surpasses the conductivity of copper on the contrary.
Embodiment
Below come by specific embodiment that the present invention is described in detail.
Each composition is all measured by weight percentage in the present invention.
The adding of nickel and silicon forms the intensity that the tantnickel precipitate improves copper alloy for the element of the intensity that improves copper alloy by nickel and silicon in copper alloy, the weight percent content of nickel is 1.5-3.5%, and the weight percentage of silicon is 0.4-0.6%.Although these two kinds of elements can strengthen the intensity of copper alloy, the conductivity that the conductivity of these two kinds of elements is lower than copper is a lot, and the amount of adding too much can affect the conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity descends.
In the technical program, add the lanthanide rare metal, this rare earth metal can change the crystal arrangement of copper alloy inside, the percent of pass that improves electronics can improve the powered-on capacity of copper alloy, and the consumption of the lanthanide rare metal that is suitable among the present invention is 0.003-0.03%.Certainly can increase the consumption of lanthanide rare metal, but increase the cost that too much improves on the contrary copper alloy according to the purposes of wire, and when use amount surpasses 1.0%, can not increase again on the contrary the conductance of copper alloy.
For Cu alloy material of the present invention, can also contain at least a in tin, iron, cobalt, the phosphorus, phosphorus can increase the intensity of Cu alloy material in these elements, but consumption too much can affect the toughness of Cu alloy material.Improve the bending endurance quality when other several elements can increase Cu alloy material intensity, concrete consumption is the tin of 0.1-0.6%, the cobalt of 0.06-0.8%, the phosphorus of 0.01-0.05%, the iron of 0.05-0.1%.When the consumption of these elements is too much, can affect the conductivity of Cu alloy material.
Can also select at least a in two kinds of elements of magnesium and manganese among the present invention, these two kinds of elements can preventing adding thermal embrittlement and improve very large advantage is arranged aspect the hot-working character, be conducive to reduce diameter of wire.But can obviously affect the electric conductivity of copper alloy when the consumption of these two kinds of elements surpasses 0.5%, the consumption of these two kinds of elements is the manganese of 0.02-0.1% and/or the magnesium of 0.08-0.2% in the present invention.
Use the high-frequency melting stove that each component is melted casting copper base among the embodiments of the invention 1-6, with the copper base after carrying out hot extrusion under 900 ℃ immediately quench process and obtain pole, then cold drawnly obtain expecting material.
Composition and performance in each specific embodiment are shown in Table 1
Table 1
By above embodiment, only include nickel, the highest conductance near copper of conductance of the copper alloy of silicon and lanthanide rare metal, but intensity is not high.The preferred embodiment of the present invention is 3 and 4.
Claims (3)
1. an Albatra metal-is characterized in that: the composition of described Cu alloy material forms and includes by weight percentage: the nickel of 1.5-3.5%, and the silicon of 0.4-0.6%, the lanthanide rare metal of 0.003-0.03%, all the other are copper and inevitable impurity.
2. a kind of Cu alloy material according to claim 1, it is characterized in that: the composition composition of described Cu alloy material further includes by weight percentage: the tin of 0.1-0.6%, the cobalt of 0.06-0.8%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
3. a kind of Cu alloy material for wire according to claim 1 and 2 is characterized in that: the composition of described Cu alloy material forms and further includes by weight percentage: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012103341494A CN102867562A (en) | 2012-09-10 | 2012-09-10 | Cupper alloy |
Applications Claiming Priority (1)
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CN2012103341494A CN102867562A (en) | 2012-09-10 | 2012-09-10 | Cupper alloy |
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CN102867562A true CN102867562A (en) | 2013-01-09 |
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CN2012103341494A Pending CN102867562A (en) | 2012-09-10 | 2012-09-10 | Cupper alloy |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105296797A (en) * | 2015-11-03 | 2016-02-03 | 任静儿 | Tensile copper alloy material |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101003871A (en) * | 2006-01-18 | 2007-07-25 | 江西理工大学 | Copper alloy with no lead |
CN101717877A (en) * | 2009-12-15 | 2010-06-02 | 甘肃大鑫铜业有限责任公司 | Alloy material of copper, nickel, silicon and bronze and preparation method thereof |
CN101981212A (en) * | 2008-03-31 | 2011-02-23 | Jx日矿日石金属株式会社 | Cu-Ni-Si alloy to be used in electrically conductive spring material |
CN102140594A (en) * | 2011-03-11 | 2011-08-03 | 无锡日月合金材料有限公司 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
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2012
- 2012-09-10 CN CN2012103341494A patent/CN102867562A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101003871A (en) * | 2006-01-18 | 2007-07-25 | 江西理工大学 | Copper alloy with no lead |
CN101981212A (en) * | 2008-03-31 | 2011-02-23 | Jx日矿日石金属株式会社 | Cu-Ni-Si alloy to be used in electrically conductive spring material |
CN101717877A (en) * | 2009-12-15 | 2010-06-02 | 甘肃大鑫铜业有限责任公司 | Alloy material of copper, nickel, silicon and bronze and preparation method thereof |
CN102140594A (en) * | 2011-03-11 | 2011-08-03 | 无锡日月合金材料有限公司 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105296797A (en) * | 2015-11-03 | 2016-02-03 | 任静儿 | Tensile copper alloy material |
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Application publication date: 20130109 |