CN102855957A - Copper alloy material for lead - Google Patents
Copper alloy material for lead Download PDFInfo
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- CN102855957A CN102855957A CN2012103342406A CN201210334240A CN102855957A CN 102855957 A CN102855957 A CN 102855957A CN 2012103342406 A CN2012103342406 A CN 2012103342406A CN 201210334240 A CN201210334240 A CN 201210334240A CN 102855957 A CN102855957 A CN 102855957A
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Abstract
The invention relates to a copper alloy material for a lead. The copper alloy material comprises the following components in percentage by weight: 1.5 to 2.0% of nickel, 0.4 to 0.6% of silicon, 0.001 to 0.05% of lanthanide rare-earth metal, and the balance of copper and inevitable impurities.
Description
Technical field
The invention belongs to field of alloy material, refer to especially a kind of Cu alloy material for wire.
Background technology
The wire that now uses, in particular for wire that mobile or vibrations place are arranged and cable etc., main what use is the twisting thread as conductor of annealed copper wire or the stranded formation of copper cash that is coated with tin etc. on it, is coated with the electric wire of the insulators such as the vinyl chloride of concentric circles or glue connection vinyl chloride on this conductor.
Recently also more and more higher to the requirement of durability, folding resistance and the electric conductivity of wire.From saving the angle of the energy, reduce the diameter of wire conductor with weight reduction and saving material, but the powered-on capacity of wire conductor in the past is certain, reduces the diameter of wire and has also just reduced reducing by capacity.And the reducing of wire conductor diameter causes folding quality to descend, and therefore existing electric wire can't satisfy these requirements.
Summary of the invention
The purpose of this invention is to provide the improvement of a Cu alloy material, can improve intensity and the conductivity of copper alloy by this technical scheme, so that in the situation that reduce also to guarantee when diameter of wire guarantees powered-on capacity or improve folding quality.
The present invention is achieved by the following technical solutions:
A kind of Cu alloy material for wire, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-2.0%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
The composition composition of described Cu alloy material further includes by weight percentage: the tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
The composition composition of described Cu alloy material further includes by weight percentage: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
The composition composition of described Cu alloy material further includes by weight percentage: the zinc of 0.2-1.0%.
The invention has the beneficial effects as follows;
By in technical scheme of the present invention, adding the lanthanide rare metal, conductivity that can the Effective Raise copper alloy, because the electrical conductivity of nickel and silicon etc. is lower than the electrical conductivity of copper in alloy, powered-on capacity reducing diameter of wire after adding the materials such as nickel and silicon after reduces, but after adding the lanthanide rare metal, the conductivity of copper alloy improves even surpasses the conductivity of copper on the contrary, thereby can realize reducing of diameter of wire.
Embodiment
Below come by specific embodiment that the present invention is described in detail.
Each composition is all measured by weight percentage in the present invention.
The adding of nickel and silicon forms the intensity that the tantnickel precipitate improves copper alloy for the element of the intensity that improves copper alloy by nickel and silicon in copper alloy, the weight percent content of nickel is 1.5-2.0%, and the weight percentage of silicon is 0.4-0.6%.Although these two kinds of elements can strengthen the intensity of copper alloy, the conductivity that the conductivity of these two kinds of elements is lower than copper is a lot, and the amount of adding too much can affect the conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity descends.
In the technical program, add the lanthanide rare metal, this rare earth metal can change the crystal arrangement of copper alloy inside, the percent of pass that improves electronics can improve the powered-on capacity of copper alloy, and the consumption of the lanthanide rare metal that is suitable among the present invention is 0.001-0.05%.Certainly can increase the consumption of lanthanide rare metal, but increase the cost that too much improves on the contrary copper alloy according to the purposes of wire, and when use amount surpasses 1.0%, can not increase again on the contrary the conductance of copper alloy.
For Cu alloy material of the present invention, can also contain at least a in tin, iron, chromium, cobalt, the phosphorus, phosphorus can increase the intensity of Cu alloy material in these elements, but consumption too much can affect the toughness of Cu alloy material.Improve the bending endurance quality when other several elements can increase Cu alloy material intensity, concrete consumption is the tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, the iron of 0.05-0.1%.When the consumption of these elements is too much, can affect the conductivity of Cu alloy material.
Can also select at least a in two kinds of elements of magnesium and manganese among the present invention, these two kinds of elements can preventing adding thermal embrittlement and improve very large advantage is arranged aspect the hot-working character, be conducive to reduce diameter of wire.But can obviously affect the electric conductivity of copper alloy when the consumption of these two kinds of elements surpasses 0.5%, the consumption of these two kinds of elements is the manganese of 0.02-0.1% and/or the magnesium of 0.08-0.2% in the present invention.
Can also select element zinc in the present invention, be mainly used in improving the thermal effectiveness of copper alloy, the amount of selecting in the present invention is 0.2-1.0%.When consumption is too much, can affect the conductivity of copper alloy.
Use the high-frequency melting stove that each component is melted casting copper base among the embodiments of the invention 1-6, the immediately quench processing after carrying out hot extrusion under 900 ℃ of copper base is obtained pole, the then cold drawn line material that obtains.
Composition and performance in each specific embodiment are shown in Table 1
Table 1
By above embodiment, only include nickel, the highest conductance near copper of conductance of the copper alloy of silicon and lanthanide rare metal, but intensity is not high.The preferred embodiment of the present invention is 3 and 4.
Claims (4)
1. Cu alloy material that is used for wire, it is characterized in that: the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-2.0%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
2. a kind of Cu alloy material for wire according to claim 1, it is characterized in that: the composition composition of described Cu alloy material further includes by weight percentage: the tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
3. a kind of Cu alloy material for wire according to claim 1 and 2 is characterized in that: the composition of described Cu alloy material forms and further includes by weight percentage: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
4. a kind of Cu alloy material for wire according to claim 1 and 2 is characterized in that: the composition of described Cu alloy material forms and further includes by weight percentage: the zinc of 0.2-1.0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103342406A CN102855957A (en) | 2012-09-10 | 2012-09-10 | Copper alloy material for lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103342406A CN102855957A (en) | 2012-09-10 | 2012-09-10 | Copper alloy material for lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102855957A true CN102855957A (en) | 2013-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103342406A Pending CN102855957A (en) | 2012-09-10 | 2012-09-10 | Copper alloy material for lead |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105118542A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper alloy material used for wires |
| CN106521233A (en) * | 2016-11-16 | 2017-03-22 | 严静儿 | Copper alloy applied to conductor |
| CN106521234A (en) * | 2016-12-20 | 2017-03-22 | 黄忠波 | Copper alloy used for conducting wire |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63310933A (en) * | 1987-06-12 | 1988-12-19 | Furukawa Electric Co Ltd:The | Lead material for package for electronic equipment |
| CN101981212A (en) * | 2008-03-31 | 2011-02-23 | Jx日矿日石金属株式会社 | Cu-Ni-Si alloy to be used in electrically conductive spring material |
| CN102140594A (en) * | 2011-03-11 | 2011-08-03 | 无锡日月合金材料有限公司 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
-
2012
- 2012-09-10 CN CN2012103342406A patent/CN102855957A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63310933A (en) * | 1987-06-12 | 1988-12-19 | Furukawa Electric Co Ltd:The | Lead material for package for electronic equipment |
| CN101981212A (en) * | 2008-03-31 | 2011-02-23 | Jx日矿日石金属株式会社 | Cu-Ni-Si alloy to be used in electrically conductive spring material |
| CN102140594A (en) * | 2011-03-11 | 2011-08-03 | 无锡日月合金材料有限公司 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105118542A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper alloy material used for wires |
| CN106521233A (en) * | 2016-11-16 | 2017-03-22 | 严静儿 | Copper alloy applied to conductor |
| CN106521234A (en) * | 2016-12-20 | 2017-03-22 | 黄忠波 | Copper alloy used for conducting wire |
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Application publication date: 20130102 |