CN104294083A - Preparation method for copper alloy for conducting wire - Google Patents
Preparation method for copper alloy for conducting wire Download PDFInfo
- Publication number
- CN104294083A CN104294083A CN201410591440.9A CN201410591440A CN104294083A CN 104294083 A CN104294083 A CN 104294083A CN 201410591440 A CN201410591440 A CN 201410591440A CN 104294083 A CN104294083 A CN 104294083A
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- copper alloy
- copper
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- wire
- alloy
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F3/00—Changing the physical structure of non-ferrous metals or alloys by special physical methods, e.g. treatment with neutrons
- C22F3/02—Changing the physical structure of non-ferrous metals or alloys by special physical methods, e.g. treatment with neutrons by solidifying a melt controlled by supersonic waves or electric or magnetic fields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Conductive Materials (AREA)
Abstract
The invention relates to a preparation method for copper alloy for a conducting wire. The copper alloy comprises the following ingredients in percentage by weight: 1.0-1.3 percent of nickel, 0.5-1.0 percent of aluminum, 0.01-0.03 percent of indium, 0.1-0.3 percent of beryllium, 0.3-0.8 percent of zinc, 0.4-0.6 percent of silicon, 0.001-0.05 percent of lanthanide series rare earth metal and the balance of copper and inevitable impurities.
Description
Technical field
The invention belongs to field of alloy material, refer to a kind of process for producing copper alloy for wire especially.
Background technology
The wire now used, in particular for having the wire of mobile or vibrations place and cable etc., mainly use annealed copper wire or it is coated with tin etc. the stranded formation of copper cash twist thread as conductor, this conductor is coated with the electric wire of the isolator such as the vinylchlorid of concentric circles or glue connection vinylchlorid.
The requirement of the recent weather resistance to wire, folding resistance and conductivity is also more and more higher.From saving the angle of the energy, the diameter reducing wire conductor is with weight reduction and save material, but the powered-on capacity of wire conductor is in the past certain, reduces the diameter of wire and it also reduces reduction by capacity.And the reduction of wire conductor diameter causes folding quality to decline, therefore existing electric wire cannot meet these requirements.
Summary of the invention
The object of this invention is to provide the improvement of a Cu alloy material, intensity and the specific conductivity of copper alloy can be improved by this technical scheme, also ensure while making to ensure powered-on capacity when reducing diameter of wire or improve folding quality.
The present invention is achieved by the following technical solutions:
For a process for producing copper alloy for wire, comprise the following steps:
High-frequency melting stove is used each component to be melted, liquation is bred 10-30 minute at 1200-1300 DEG C of constant temperature, then to be not less than 10 DEG C/min of cooling 150-200 DEG C, and then be warming up to 1200-1300 DEG C, copper base is cast after constant temperature 10-30 minute, lead to direct supply or electromagnetic field 5 minutes at the two ends of copper base, after copper base is carried out hot extrusion at 900 DEG C, quench treatment obtains pole immediately, then cold drawnly obtains line material.
Described each compositions in weight percentage is: the nickel of 1.0-1.3%, the aluminium of 0.5-1.0%, the indium of 0.01-0.03%, the beryllium of 0.1-0.3%, the zinc of 0.3-0.8%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
The composition composition of described Cu alloy material includes by weight percentage further: the tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
The composition composition of described Cu alloy material includes by weight percentage further: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
The invention has the beneficial effects as follows;
1, by adding lanthanide rare metal in the inventive solutions, effectively can improve the specific conductivity of copper alloy, because the perveance of nickel and silicon etc. is lower than the perveance of copper in the alloy, when the powered-on capacity after adding the material such as nickel and silicon after reducing diameter of wire reduces, but after adding lanthanide rare metal, the specific conductivity of copper alloy improves the specific conductivity even exceeding copper on the contrary, thus can realize the reduction of diameter of wire.
2, by using direct supply or electromagnetic field aborning, making the marshalling organizing interior crystal, and by the change of temperature, being conducive to the even of crystal grain in organizer.
Embodiment
Below by way of specific embodiment, the present invention is described in detail.
Each composition is measured all by weight percentage in the present invention.
The element adding the intensity in order to improve copper alloy of nickel and silicon, forms by nickel and silicon the intensity that tantnickel precipitate improves copper alloy in copper alloy, and the weight percent content of nickel is 1.0-1.3%, and the weight percentage of silicon is 0.4-0.6%.Although these two kinds of elements can strengthen the intensity of copper alloy, the specific conductivity of these two kinds of elements is a lot of lower than the specific conductivity of copper, and the amount added too much can affect the specific conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity declines.
Lanthanide rare metal is added in the technical program, this rare earth metal can change the crystal arrangement of copper alloy inside, the percent of pass improving electronics can improve the powered-on capacity of copper alloy, and the consumption the lanthanide rare metal be suitable in the present invention is 0.001-0.05%.Certainly can increase the consumption of lanthanide rare metal, but increase according to the purposes of wire the cost too much improving copper alloy on the contrary, and the electric conductivity of copper alloy can not be increased when usage quantity is more than 1.0% on the contrary again.
Copper alloy of the present invention, also includes the aluminium of 0.5-1.0%, the indium of 0.01-0.03%, the beryllium of 0.1-0.3%, the zinc of 0.3-0.8%.
For copper alloy of the present invention, can also contain at least one in tin, iron, chromium, cobalt, phosphorus, in these elements, phosphorus can increase the intensity of Cu alloy material, but consumption too much can affect the toughness of copper alloy.Improve bending endurance quality while other several elements can increase Cu alloy material intensity, concrete consumption is the iron of the phosphorus of the cobalt of the chromium of the tin of 0.1-0.6%, 0.01-0.1%, 0.05-1.0%, 0.01-0.05%, 0.05-0.1%.The specific conductivity of Cu alloy material can be affected when the consumption of these elements is too much.
Can also select at least one in magnesium and manganese two kinds of elements in the present invention, these two kinds of elements can prevent from adding thermal embrittlement and improving in hot workability have very large advantage, are conducive to reducing diameter of wire.But obviously can affect the conductivity of copper alloy when the consumption of these two kinds of elements is more than 0.5%, the consumption of these two kinds of elements is the manganese of 0.02-0.1% and/or the magnesium of 0.08-0.2% in the present invention.
Preparation method of the present invention is, high-frequency melting stove is used each component to be melted, liquation is bred 10-30 minute at 1200-1300 DEG C of constant temperature, then to be not less than 10 DEG C/min of cooling 150-200 DEG C, and then be warming up to 1200-1300 DEG C, cast copper base after constant temperature 10-30 minute, lead to direct supply or electromagnetic field 5 minutes at the two ends of copper base, after copper base is carried out hot extrusion at 900 DEG C, quench treatment obtains pole immediately, then cold drawnly obtains line material.
By above technique, the highest electric conductivity close to copper of electric conductivity can be obtained.
The material composition of following examples of the present invention is different, but preparation method is identical, therefore, below in an example, and the only difference composition of illustrative material.
Embodiment 1
For a copper alloy for wire, the composition composition of described copper alloy is by weight percentage: the nickel of 1.0%, the aluminium of 0.5%, the indium of 0.01%, the beryllium of 0.1%, the zinc of 0.3%, the silicon of 0.4%, the lanthanide rare metal of 0.001%, all the other are copper and inevitable impurity.
Embodiment 2
For a copper alloy for wire, the composition composition of described copper alloy is by weight percentage: the nickel of 1.3%, the aluminium of 1.0%, the indium of 0.03%, the beryllium of 0.3%, the zinc of 0.8%, the silicon of 0.6%, the lanthanide rare metal of 0.05%, all the other are copper and inevitable impurity.
Embodiment 3
For a copper alloy for wire, the composition composition of described copper alloy is by weight percentage: the nickel of 1.1%, the aluminium of 0.8%, the indium of 0.02%, the beryllium of 0.15%, the zinc of 0.5%, the silicon of 0.5%, the lanthanide rare metal of 0.02%, all the other are copper and inevitable impurity.
Embodiment 4
For a copper alloy for wire, the composition composition of described copper alloy is by weight percentage: the nickel of 1.0%, the aluminium of 0.8%, the indium of 0.015%, the beryllium of 0.2%, the zinc of 0.5%, the silicon of 0.5%, the tin of 0.3%, the chromium of 0.06%, the cobalt of 0.08%, the phosphorus of 0.03%, the iron of 0.08%, the lanthanide rare metal of 0.003%, the manganese of 0.05%, the magnesium of 0.12%, all the other are copper and inevitable impurity.
Embodiment 5
For a copper alloy for wire, the composition composition of described copper alloy is by weight percentage: the nickel of 1.2%, the aluminium of 0.9%, the indium of 0.016%, the beryllium of 0.18%, the zinc of 0.4%, the silicon of 0.35%, the tin of 0.5%, the chromium of 0.08%, the cobalt of 0.06%, the phosphorus of 0.04%, the lanthanide rare metal of 0.003%, the magnesium of 0.15%, all the other are copper and inevitable impurity.
Claims (4)
1. the process for producing copper alloy for wire, it is characterized in that, comprise the following steps: use high-frequency melting stove each component to be melted, liquation is bred 10-30 minute at 1200-1300 DEG C of constant temperature, then to be not less than 10 DEG C/min of cooling 150-200 DEG C, and then be warming up to 1200-1300 DEG C, copper base is cast after constant temperature 10-30 minute, direct supply or electromagnetic field 5 minutes is led at the two ends of copper base, after copper base is carried out hot extrusion at 900 DEG C, quench treatment obtains pole immediately, then cold drawnly obtains line material.
2. the process for producing copper alloy for wire according to claim 1, it is characterized in that: described each compositions in weight percentage is: the nickel of 1.0-1.3%, the aluminium of 0.5-1.0%, the indium of 0.01-0.03%, the beryllium of 0.1-0.3%, the zinc of 0.3-0.8%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
3. the process for producing copper alloy for wire according to claim 2, it is characterized in that: the composition composition of described Cu alloy material includes by weight percentage further: the tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
4. the process for producing copper alloy for wire according to claim 2, is characterized in that: the composition of described Cu alloy material composition includes by weight percentage further: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410591440.9A CN104294083A (en) | 2014-10-29 | 2014-10-29 | Preparation method for copper alloy for conducting wire |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410591440.9A CN104294083A (en) | 2014-10-29 | 2014-10-29 | Preparation method for copper alloy for conducting wire |
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| CN104294083A true CN104294083A (en) | 2015-01-21 |
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| CN201410591440.9A Pending CN104294083A (en) | 2014-10-29 | 2014-10-29 | Preparation method for copper alloy for conducting wire |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047245A (en) * | 2015-07-13 | 2015-11-11 | 江苏亨通线缆科技有限公司 | Copper magnesium alloy wire applied to cable introduction by user |
| CN105244079A (en) * | 2015-08-31 | 2016-01-13 | 无锡华虹信息科技有限公司 | Flexible high-current-carrying direct-current cable insulation material and cable |
| CN105575457A (en) * | 2016-02-02 | 2016-05-11 | 安徽幸福电器电缆有限公司 | Copper alloy cable |
| CN105609158A (en) * | 2016-02-17 | 2016-05-25 | 安徽华天电缆有限公司 | High-performance cerium alloy cable |
| CN105936982A (en) * | 2016-06-13 | 2016-09-14 | 芜湖卓越线束系统有限公司 | High-conductivity alloy material for wire harness terminal and preparation method thereof |
| CN106521233A (en) * | 2016-11-16 | 2017-03-22 | 严静儿 | Copper alloy applied to conductor |
| CN106521234A (en) * | 2016-12-20 | 2017-03-22 | 黄忠波 | Copper alloy used for conducting wire |
| CN114293065A (en) * | 2021-12-31 | 2022-04-08 | 镇江市镇特合金材料有限公司 | Copper alloy plate with high strength |
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| CN104313369A (en) * | 2014-10-29 | 2015-01-28 | 陈唯锋 | Preparation method of copper alloy for valve |
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2014
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047245A (en) * | 2015-07-13 | 2015-11-11 | 江苏亨通线缆科技有限公司 | Copper magnesium alloy wire applied to cable introduction by user |
| CN105244079A (en) * | 2015-08-31 | 2016-01-13 | 无锡华虹信息科技有限公司 | Flexible high-current-carrying direct-current cable insulation material and cable |
| CN105575457A (en) * | 2016-02-02 | 2016-05-11 | 安徽幸福电器电缆有限公司 | Copper alloy cable |
| CN105609158A (en) * | 2016-02-17 | 2016-05-25 | 安徽华天电缆有限公司 | High-performance cerium alloy cable |
| CN105936982A (en) * | 2016-06-13 | 2016-09-14 | 芜湖卓越线束系统有限公司 | High-conductivity alloy material for wire harness terminal and preparation method thereof |
| CN106521233A (en) * | 2016-11-16 | 2017-03-22 | 严静儿 | Copper alloy applied to conductor |
| CN106521234A (en) * | 2016-12-20 | 2017-03-22 | 黄忠波 | Copper alloy used for conducting wire |
| CN114293065A (en) * | 2021-12-31 | 2022-04-08 | 镇江市镇特合金材料有限公司 | Copper alloy plate with high strength |
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Application publication date: 20150121 |