CN106636735A - Copper alloy material for wires - Google Patents
Copper alloy material for wires Download PDFInfo
- Publication number
- CN106636735A CN106636735A CN201611009559.6A CN201611009559A CN106636735A CN 106636735 A CN106636735 A CN 106636735A CN 201611009559 A CN201611009559 A CN 201611009559A CN 106636735 A CN106636735 A CN 106636735A
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- CN
- China
- Prior art keywords
- alloy material
- composition
- copper
- wire
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
The invention relates to a copper alloy material for wires. The copper alloy material comprises, by weight, 1.5%-2.0% of nickel, 0.01%-0.03% of iridium, 0.4%-0.6% of silicon, 0.001%-0.05% of lanthanide rare earth metal, and the balance copper and inevitable impurities.
Description
Technical field
The invention belongs to field of alloy material, particularly relates to a kind of Cu alloy material for wire.
Background technology
The wire for now using, in particular for having mobile or shaking the wire and cable in place etc., mainly uses
Annealed copper wire is coated with thereon the copper cash stranded formation of tin etc. and twists thread as conductor, and the chloroethene of concentric circles is coated with the conductor
The electric wire of the insulator such as alkene or glue connection vinyl chloride.
Recently the requirement to the durability, folding resistance and electric conductivity of wire also more and more higher.From the angle of save energy
Set out, reduce the diameter of wire conductor to mitigate weight and material-saving, but the powered-on capacity of conventional wire conductor is certain
, the reduction diameter of wire also reduces the reduction by capacity.And the reduction of wire conductor diameter causes under folding quality
Drop, therefore existing electric wire cannot meet these requirements.
The content of the invention
It is an object of the invention to provide the improvement of a Cu alloy material, by the technical scheme the strong of copper alloy can be improved
Degree and electrical conductivity so that also ensure or improve folding quality while powered-on capacity is ensured in the case of reducing diameter of wire.
The present invention is achieved by the following technical solutions:
A kind of Cu alloy material for wire, the composition composition of the Cu alloy material is included by weight percentage:
The nickel of 1.5-2.0%, the iridium of 0.01-0.03%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, remaining is
Copper and inevitable impurity.
The composition composition of the Cu alloy material has been further included by weight percentage:The tin of 0.1-0.6%, 0.01-
0.1% chromium, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combination in the iron of 0.05-0.1%.
The composition composition of the Cu alloy material has been further included by weight percentage:The manganese of 0.02-0.1% and
One or two combinations in the magnesium of 0.08-0.2%.
The composition composition of the Cu alloy material has been further included by weight percentage:The zinc of 0.2-1.0%.
The invention has the beneficial effects as follows;
By adding lanthanide rare metal in the inventive solutions, the electrical conductivity of copper alloy can be effectively improved,
Because in the alloy the electrical conductivity of nickel and silicon etc. is reducing wire less than the electrical conductivity of copper after the material such as nickel and silicon is added
Powered-on capacity after diameter is reduced, but after lanthanide rare metal is added, the electrical conductivity of copper alloy improves on the contrary even more than copper
Electrical conductivity, such that it is able to realize the reduction of diameter of wire.
Specific embodiment
Below by way of specific embodiment, the present invention is described in detail.
In the present invention each composition is measured by the percentage by weight.
The addition of nickel and silicon forms tantnickel analysis by nickel and silicon in order to improve the element of the intensity of copper alloy in copper alloy
Go out thing to improve the intensity of copper alloy, the weight percent content of nickel is 1.5-2.0%, and the weight percentage of silicon is 0.4-
0.6%.Although both elements can strengthen the intensity of copper alloy, the electrical conductivity of both elements less than copper electrical conductivity very
Many, the amount of addition can excessively affect the electrical conductivity of copper alloy, increase the resistance of copper alloy, and powered-on capacity declines.
Lanthanide rare metal, the rare earth metal is added to change the crystal row inside copper alloy in the technical program
Row, improving the percent of pass of electronics can improve the powered-on capacity of copper alloy, the use of lanthanide rare metal applicable in the present invention
Measure as 0.001-0.05%.It is of course possible to increase the consumption of lanthanide rare metal, but increased excessively on the contrary according to the purposes of wire
The cost of copper alloy is improved, and the conductance of copper alloy will not be further added by the contrary when usage amount is more than 1.0%.
For the Cu alloy material of the present invention, can also be containing at least one in tin, iron, chromium, cobalt, phosphorus, these elements
Middle phosphorus can increase the intensity of Cu alloy material, but consumption can excessively affect the toughness of Cu alloy material.Other several elements
Improve bending endurance quality while can increasing Cu alloy material intensity, specific consumption for 0.1-0.6% tin, 0.01-
0.1% chromium, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, the iron of 0.05-0.1%.When the consumption of these elements it is excessive
When can affect the electrical conductivity of Cu alloy material.
At least one that can also be selected in two kinds of elements of magnesium and manganese in the present invention, both elements can prevent heating
Embrittlement has very big advantage with hot-working character aspect is improved, and advantageously reduces diameter of wire.But the consumption of both elements surpasses
The electric conductivity of copper alloy can be significantly affected when 0.5%, in the present invention the consumption of both elements is 0.02-0.1%'s
The magnesium of manganese and/or 0.08-0.2%.
Element zinc can also be selected in the present invention, be mainly used in improving the thermal effectiveness of copper alloy, in the present invention
From amount be 0.2-1.0%.The electrical conductivity of copper alloy can be affected when consumption is excessive.
Each component is melted casting copper base by high-frequency melting stove used in embodiments of the invention, and copper base is entered at 900 DEG C
Immediately pure fire is processed and obtains pole after row hot extrusion, then cold drawn to obtain strands.
Embodiment 1
A kind of Cu alloy material for wire, the composition composition of the Cu alloy material is included by weight percentage:
1.5% nickel, 0.01% iridium, 0.4% silicon, 0.001% lanthanide rare metal, remaining is copper and inevitably miscellaneous
Matter.
Embodiment 2
A kind of Cu alloy material for wire, it is characterised in that:The composition composition by weight hundred of the Cu alloy material
Ratio is divided to include:2.0% nickel, 0.03% iridium, 0.6% silicon, 0.05% lanthanide rare metal, remaining is copper and can not
The impurity for avoiding.
Embodiment 3
A kind of Cu alloy material for wire, it is characterised in that:The composition composition by weight hundred of the Cu alloy material
Ratio is divided to include:1.8% nickel, 0.02% iridium, 0.5% silicon, 0.005% lanthanide rare metal, 0.2% tin,
0.04% chromium, 0.08% cobalt, 0.03% phosphorus, 0.08% iron, 0.07% manganese and 0.12% magnesium, remaining be copper and
Inevitable impurity.
By above example, the close copper of conductance highest of the copper alloy of nickel, silicon and lanthanide rare metal is comprised only
Conductance, but intensity is not high.The preferred embodiment of the present invention is 3.
Claims (4)
1. a kind of Cu alloy material for wire, it is characterised in that:The composition composition percentage by weight of the Cu alloy material
Than including:The nickel of 1.5-2.0%, the iridium of 0.01-0.03%, the silicon of 0.4-0.6%, the lanthanide rare gold of 0.001-0.05%
Category, remaining is copper and inevitable impurity.
2. the Cu alloy material for wire according to claim 1, it is characterised in that:The composition of the Cu alloy material
Composition has been further included by weight percentage:The tin of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%,
The phosphorus of 0.01-0.05%, one or more combination in the iron of 0.05-0.1%.
3. the Cu alloy material for wire according to claim 1 and 2, it is characterised in that:The Cu alloy material
Composition composition has been further included by weight percentage:One or two in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%
Combination.
4. the Cu alloy material for wire according to claim 1 and 2, it is characterised in that:The Cu alloy material
Composition composition has been further included by weight percentage:The zinc of 0.2-1.0%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611009559.6A CN106636735A (en) | 2016-11-16 | 2016-11-16 | Copper alloy material for wires |
Applications Claiming Priority (1)
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---|---|---|---|
CN201611009559.6A CN106636735A (en) | 2016-11-16 | 2016-11-16 | Copper alloy material for wires |
Publications (1)
Publication Number | Publication Date |
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CN106636735A true CN106636735A (en) | 2017-05-10 |
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ID=58807200
Family Applications (1)
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CN201611009559.6A Pending CN106636735A (en) | 2016-11-16 | 2016-11-16 | Copper alloy material for wires |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107910098A (en) * | 2017-11-08 | 2018-04-13 | 无锡市长城电线电缆有限公司 | A kind of copper alloy conductor and preparation method thereof |
-
2016
- 2016-11-16 CN CN201611009559.6A patent/CN106636735A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107910098A (en) * | 2017-11-08 | 2018-04-13 | 无锡市长城电线电缆有限公司 | A kind of copper alloy conductor and preparation method thereof |
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Application publication date: 20170510 |