CN107858556A - A kind of Cu alloy material - Google Patents
A kind of Cu alloy material Download PDFInfo
- Publication number
- CN107858556A CN107858556A CN201711343865.8A CN201711343865A CN107858556A CN 107858556 A CN107858556 A CN 107858556A CN 201711343865 A CN201711343865 A CN 201711343865A CN 107858556 A CN107858556 A CN 107858556A
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- CN
- China
- Prior art keywords
- alloy material
- copper
- composition
- alloy
- electrical conductivity
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
A kind of Cu alloy material, the composition composition of the Cu alloy material include by weight percentage：2.1 ~ 2.5% nickel, 0.2 ~ 0.3% silicon, 0.06 ~ 0.07% lanthanide rare metal, remaining is copper and inevitable impurity.The beneficial effects of the invention are as follows：Lanthanide rare metal is added in Cu alloy material, the electrical conductivity of copper alloy can be effectively improved, because the electrical conductivity of nickel and silicon etc. is less than the electrical conductivity of copper in the alloy, the powered-on capacity after material such as nickel and silicon is added after diameter of wire is reduced reduces, but after lanthanide rare metal is added, the electrical conductivity of copper alloy improves the electrical conductivity of even more than copper on the contrary, so as to realize the reduction of diameter of wire.
Description
Technical field
The invention belongs to metal material field, and in particular to a kind of Cu alloy material as wire.
Background technology
The wire used at present in daily life, in particular for having mobile or vibrations place wire and cable etc.,
The main copper cash for using annealed copper wire or being coated with tin etc. thereon is twisted twisting thread as conductor of being formed, covers on the conductor
There is the electric wire of the insulators such as vinyl chloride or the glue connection vinyl chloride of concentric circles.
Recently the requirement to the durability of wire, folding resistance and electric conductivity also more and more higher.From the angle for saving the energy
Set out, reduce the diameter of wire conductor to mitigate weight and save material, but the powered-on capacity of conventional wire conductor is certain
, the reduction diameter of wire also reduces the reduction by capacity.And the reduction of wire conductor diameter causes under folding quality
Drop, therefore existing electric wire can not meet these requirements.
The content of the invention
For deficiency of the prior art, the invention provides a kind of Cu alloy material as wire, the copper alloy material
Wire made of material has good intensity and electrical conductivity so that ensures the same of powered-on capacity in the case where reducing diameter of wire
When also ensure or improve folding quality.
The present invention is achieved through the following technical solutions.
A kind of Cu alloy material, the composition composition of the Cu alloy material include by weight percentage：2.1 ~ 2.5%
Nickel, 0.2 ~ 0.3% silicon, 0.06 ~ 0.07% lanthanide rare metal, remaining is copper and inevitable impurity.
Further, the composition composition of the Cu alloy material further comprises having by weight percentage：0.7 ~ 0.8%
Tin, 0.11 ~ 0.12% chromium, 0.6 ~ 0.7% cobalt, 0.05 ~ 0.06% phosphorus, in 0.1 ~ 0.13% iron
One or more combination.
Further, the composition composition of the Cu alloy material further comprises having by weight percentage：0.06 ~
One or both of 0.08% manganese and 0.13 ~ 0.16% magnesium combine.
Further, the composition composition of the Cu alloy material further comprises having by weight percentage：0.65 ~
0.75% zinc.
Compared with prior art, the beneficial effects of the invention are as follows：Lanthanide rare metal, Neng Gouyou are added in Cu alloy material
Effect improves the electrical conductivity of copper alloy, because the electrical conductivity of nickel and silicon etc. is less than the electrical conductivity of copper in the alloy, when adding nickel
Reduced with the powered-on capacity after the material such as silicon after diameter of wire is reduced, but after lanthanide rare metal is added, the electricity of copper alloy
Conductance improves the electrical conductivity of even more than copper on the contrary, so as to realize the reduction of diameter of wire.
Embodiment
Below by way of specific embodiment, the present invention is described in detail.
Each composition is measured by the percentage by weight in the present invention.
Embodiment 1：A kind of Cu alloy material, the composition composition of the Cu alloy material include by weight percentage：
2.1% nickel, 0.2% silicon, 0.06% lanthanide rare metal, remaining is copper and inevitable impurity；Also include
0.8% tin, 0.12% chromium, 0.7% cobalt, 0.06% phosphorus, 0.13% iron, 0.08% manganese, 0.16% magnesium,
0.75% zinc.
Embodiment 2：A kind of Cu alloy material, the composition composition of the Cu alloy material include by weight percentage：
2.5% nickel, 0.3% silicon, 0.07% lanthanide rare metal, remaining is copper and inevitable impurity；Also include
0.7% tin, 0.11% chromium, 0.6% cobalt, 0.05% phosphorus, 0.1% iron, 0.06% manganese, 0.13% magnesium,
0.65% zinc.
Embodiment 3：A kind of Cu alloy material, the composition composition of the Cu alloy material include by weight percentage：
2.3% nickel, 0.2% silicon, 0.06% lanthanide rare metal, remaining is copper and inevitable impurity；Also include
0.75% tin, 0.11% chromium, 0.06% phosphorus, 0.13% iron, 0.14% magnesium, 0.7% zinc.
In the present invention, the addition of nickel and silicon is in order to improve the element of the intensity of copper alloy, by nickel and silicon in copper alloy
Tantnickel precipitate is formed to improve the intensity of copper alloy；The addition of lanthanide rare metal can change the crystal row inside copper alloy
Row, the powered-on capacity of copper alloy can be improved by improving the percent of pass of electronics；In tin, iron, chromium, cobalt, P elements, phosphorus can increase copper
The intensity of alloy material, but dosage can excessively influence the toughness of Cu alloy material.Other several elements can increase copper alloy
Bending endurance quality is improved while the strength of materials.
At least one of two kinds of elements of magnesium and manganese can also be selected in the present invention, both elements can prevent from heating
There is very big advantage in terms of brittle and improvement hot-working character, advantageously reduce diameter of wire.It can also select in the present invention
Element zinc, is mainly used in improving the thermal effectiveness of copper alloy, and the amount selected in the present invention is 0.65 ~ 0.75%.When with
The electrical conductivity of copper alloy can be influenceed when measuring excessive.
Each component is melted into casting copper base using high-frequency melting stove in embodiments of the invention 1 ~ 3, by copper base at 900 DEG C
Pure fire processing obtains pole immediately after lower carry out hot extrusion, and then cold drawn to obtain strands, these wires have higher electrical conductivity
Thinner diameter, it disclosure satisfy that the demand in market.
Protection scope of the present invention includes but is not limited to embodiment of above, and protection scope of the present invention is with claims
It is defined, any replacement being readily apparent that to those skilled in the art that this technology is made, deformation, improvement each fall within the present invention's
Protection domain.
Claims (4)
1. a kind of Cu alloy material, it is characterised in that the composition composition of the Cu alloy material includes by weight percentage：
2.1 ~ 2.5% nickel, 0.2 ~ 0.3% silicon, 0.06 ~ 0.07% lanthanide rare metal, remaining is copper and can not kept away
The impurity exempted from.
2. a kind of Cu alloy material according to claim 1, it is characterised in that the composition composition of the Cu alloy material is pressed
Percentage by weight further comprises having：0.7 ~ 0.8% tin, 0.11 ~ 0.12% chromium, 0.6 ~ 0.7% cobalt, 0.05
~ 0.06% phosphorus, one or more combinations in 0.1 ~ 0.13% iron.
A kind of 3. Cu alloy material according to claim 1 or 2, it is characterised in that the composition group of the Cu alloy material
Into further comprising having by weight percentage：One or both of 0.06 ~ 0.08% manganese and 0.13 ~ 0.16% magnesium
Combination.
A kind of 4. Cu alloy material according to claim 1 or 2, it is characterised in that the composition group of the Cu alloy material
Into further comprising having by weight percentage：0.65 ~ 0.75% zinc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711343865.8A CN107858556A (en) | 2017-12-15 | 2017-12-15 | A kind of Cu alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711343865.8A CN107858556A (en) | 2017-12-15 | 2017-12-15 | A kind of Cu alloy material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107858556A true CN107858556A (en) | 2018-03-30 |
Family
ID=61706595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711343865.8A Pending CN107858556A (en) | 2017-12-15 | 2017-12-15 | A kind of Cu alloy material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107858556A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109338155A (en) * | 2018-12-13 | 2019-02-15 | 常熟建华模具科技股份有限公司 | Rare-earth copper alloy lightweight glass mold and preparation method thereof |
-
2017
- 2017-12-15 CN CN201711343865.8A patent/CN107858556A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109338155A (en) * | 2018-12-13 | 2019-02-15 | 常熟建华模具科技股份有限公司 | Rare-earth copper alloy lightweight glass mold and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180330 |