CN106222485A - A kind of Cu alloy material of wire - Google Patents
A kind of Cu alloy material of wire Download PDFInfo
- Publication number
- CN106222485A CN106222485A CN201610707434.4A CN201610707434A CN106222485A CN 106222485 A CN106222485 A CN 106222485A CN 201610707434 A CN201610707434 A CN 201610707434A CN 106222485 A CN106222485 A CN 106222485A
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- CN
- China
- Prior art keywords
- alloy material
- wire
- composition
- copper
- weight percentage
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to the Cu alloy material of a kind of wire, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5 2.0%, the aluminum of 0.4 0.8%, the indium of 0.3 0.5%, the silicon of 0.4 0.6%, the lanthanide rare metal of 0.001 0.05%, remaining is copper and inevitable impurity.
Description
Technical field
The invention belongs to field of alloy material, particularly relate to the Cu alloy material of a kind of wire.
Background technology
The wire now used, in particular for having mobile or the wire in vibrations place and cable etc., mainly uses
Annealed copper wire or be coated with the twisting thread as conductor of the stranded formation of copper cash of stannum etc. on it, this conductor is coated with the chloroethene of concentric circles
The electric wire of the insulators such as alkene or glue connection vinyl chloride.
More and more higher to the requirement of durability, folding resistance and the electric conductivity of wire.From the angle saving the energy
Setting out, the diameter of reduction wire conductor is to alleviate weight and to save material, but the powered-on capacity of conventional wire conductor is certain
, reduce the diameter of wire and it also reduce the reduction by capacity.And the reduction of wire conductor diameter causes under folding quality
Fall, the most existing electric wire cannot meet these requirements.
Summary of the invention
It is an object of the invention to provide the improvement of a kind of Cu alloy material, copper alloy can be improved by this technical scheme
Intensity and electrical conductivity so that also ensure while ensureing powered-on capacity in the case of reducing diameter of wire or improve folding resistance
Energy.
The present invention is achieved by the following technical solutions:
A kind of Cu alloy material of wire, the composition composition of described Cu alloy material includes by weight percentage:
The nickel of 1.5-2.0%, the aluminum of 0.4-0.8%, the indium of 0.3-0.5%, the silicon of 0.4-0.6%, the group of the lanthanides of 0.001-0.05% is dilute
Earth metal, remaining is copper and inevitable impurity.
The composition composition of described Cu alloy material farther includes by weight percentage: the stannum of 0.1-0.6%, 0.01-
The chromium of 0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the ferrum of 0.05-0.1%.
Described Cu alloy material composition composition farther include by weight percentage: the manganese of 0.02-0.1% and
One or both combinations in the magnesium of 0.08-0.2%.
The composition composition of described Cu alloy material farther includes by weight percentage: the zinc of 0.2-1.0%.
The invention has the beneficial effects as follows；
By adding lanthanide rare metal in the inventive solutions, it is possible to be effectively improved the electrical conductivity of copper alloy,
Because the electrical conductivity of nickel and silicon etc. is less than the electrical conductivity of copper in the alloy, after adding the material such as nickel and silicon, reducing wire
Powered-on capacity after diameter reduces, but after adding lanthanide rare metal, the electrical conductivity of copper alloy improves even more than copper on the contrary
Electrical conductivity, such that it is able to realize the reduction of diameter of wire.
Detailed description of the invention
Below by way of specific embodiment, the present invention is described in detail.
The most each composition is all measured by the percentage by weight.
The element of the addition of nickel and the silicon intensity in order to improve copper alloy, forms tantnickel in copper alloy by nickel and silicon and analyses
Going out thing to improve the intensity of copper alloy, the weight percent content of nickel is 1.5-2.0%, and the weight percent content of indium is 0.3-
0.5%, the weight percentage of silicon is 0.4-0.6%.Although both elements can strengthen the intensity of copper alloy, but both
The electrical conductivity of element is a lot of less than the electrical conductivity of copper, and the amount of addition too much can affect the electrical conductivity of copper alloy, increases copper alloy
Resistance, powered-on capacity declines.The weight percentage of aluminum is 0.4-0.8%, has power-assisted to improve the intensity of wire and to conductance
The impact of rate is less.
Adding lanthanide rare metal in the technical program, this rare earth metal can change the crystal row within copper alloy
Row, the percent of pass improving electronics can improve the powered-on capacity of copper alloy, the use of the lanthanide rare metal being suitable in the present invention
Amount is 0.001-0.05%.It is of course possible to increase the consumption of lanthanide rare metal, but increase the most on the contrary according to the purposes of wire
Improve the cost of copper alloy, and the conductivity of copper alloy will not be further added by when usage amount is more than 1.0% on the contrary.
Cu alloy material for the present invention, it is also possible to containing at least one in stannum, ferrum, chromium, cobalt, phosphorus, these elements
Middle phosphorus can increase the intensity of Cu alloy material, but consumption too much can affect the toughness of Cu alloy material.Other several elements
Improving bending endurance quality while can increasing Cu alloy material intensity, concrete consumption is the stannum of 0.1-0.6%, 0.01-
The chromium of 0.1%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, the ferrum of 0.05-0.1%.When the consumption of these elements is too much
Time can affect the electrical conductivity of Cu alloy material.
Can also select at least one in magnesium and two kinds of elements of manganese in the present invention, both elements can prevent heating
Brittle and improve hot-working character aspect and have the biggest advantage, advantageously reduce diameter of wire.But the consumption of both elements surpasses
Can significantly affect the electric conductivity of copper alloy after 0.5% time, the consumption of both elements is 0.02-0.1%'s in the present invention
Manganese and/or the magnesium of 0.08-0.2%.
Element zinc can also be selected in the present invention, be mainly used in improving the thermal effectiveness of copper alloy, in the present invention
The amount selected is 0.2-1.0%.The electrical conductivity of copper alloy can be affected when consumption is too much.
Embodiments of the invention 1-6 use high-frequency melting stove each component melts casting copper base, by copper base at 900 DEG C
After carrying out hot extrusion, pure fire processes and obtains pole immediately, the most cold drawn obtains strands.
Composition and performance in each specific embodiment are shown in Table 1
Table 1
By above example, comprising only nickel, the conductivity of the copper alloy of silicon and lanthanide rare metal is the highest close to copper
Conductivity, but intensity is the highest.The preferred embodiment of the present invention is 3 and 4.
Claims (4)
1. the Cu alloy material of a wire, it is characterised in that: the composition of described Cu alloy material forms by weight percentage
Include: the nickel of 1.5-2.0%, the aluminum of 0.4-0.8%, the indium of 0.3-0.5%, the silicon of 0.4-0.6%, 0.001-0.05%'s
Lanthanide rare metal, remaining is copper and inevitable impurity.
The Cu alloy material of a kind of wire the most according to claim 1, it is characterised in that: the one-tenth of described Cu alloy material
Part composition farther includes by weight percentage: the stannum of 0.1-0.6%, the chromium of 0.01-0.1%, the cobalt of 0.05-1.0%,
The phosphorus of 0.01-0.05%, one or more combinations in the ferrum of 0.05-0.1%.
The Cu alloy material of a kind of wire the most according to claim 1 and 2, it is characterised in that: described Cu alloy material
Composition composition farther include by weight percentage: the one or two in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%
Plant combination.
The Cu alloy material of a kind of wire the most according to claim 1 and 2, it is characterised in that: described Cu alloy material
Composition composition farther include by weight percentage: the zinc of 0.2-1.0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610707434.4A CN106222485A (en) | 2016-08-22 | 2016-08-22 | A kind of Cu alloy material of wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610707434.4A CN106222485A (en) | 2016-08-22 | 2016-08-22 | A kind of Cu alloy material of wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106222485A true CN106222485A (en) | 2016-12-14 |
Family
ID=57553588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610707434.4A Pending CN106222485A (en) | 2016-08-22 | 2016-08-22 | A kind of Cu alloy material of wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106222485A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429497A (en) * | 2017-06-22 | 2019-03-05 | 日本精线株式会社 | Spring copper alloy superfine wire and its manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06184670A (en) * | 1992-12-18 | 1994-07-05 | Mitsubishi Materials Corp | Pitting corrosion resistant copper alloy piping for feeding water and hot water |
| CN104060120A (en) * | 2014-07-03 | 2014-09-24 | 兰宝琴 | Method for preparing high-strength copper alloy wire rods |
| CN105118542A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper alloy material used for wires |
-
2016
- 2016-08-22 CN CN201610707434.4A patent/CN106222485A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06184670A (en) * | 1992-12-18 | 1994-07-05 | Mitsubishi Materials Corp | Pitting corrosion resistant copper alloy piping for feeding water and hot water |
| CN104060120A (en) * | 2014-07-03 | 2014-09-24 | 兰宝琴 | Method for preparing high-strength copper alloy wire rods |
| CN105118542A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper alloy material used for wires |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429497A (en) * | 2017-06-22 | 2019-03-05 | 日本精线株式会社 | Spring copper alloy superfine wire and its manufacturing method |
| CN109429497B (en) * | 2017-06-22 | 2021-07-09 | 日本精线株式会社 | Copper alloy ultra-fine wire for spring and method for producing same |
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Application publication date: 20161214 |