CN106350701A

CN106350701A - Copper alloy

Info

Publication number: CN106350701A
Application number: CN201610707327.1A
Authority: CN
Inventors: 吴雅萍
Original assignee: Individual
Current assignee: Individual
Priority date: 2016-08-22
Filing date: 2016-08-22
Publication date: 2017-01-25

Abstract

The invention relates to a copper alloy material, which is prepared from the following ingredients in percentage by weight: 1.5 to 3.5 percent of nickel, 0.01 to 0.03 percent of silver, 0.01 to 0.03 percent of indium, 0.01 to 0.03 percent of yttrium, 0.01 to 0.05 percent of ruthenium, 0.03 to 0.05 percent of scandium, 0.4 to 0.6 percent of silicon, 0.003 to 0.03 percent of lanthanide series rare earth metal and the balance copper and unavoidable impurities. The copper alloy material has the advantages that the tensile strength is high; good folding-resistant performance is realized; the conductivity is similar to that of metal copper.

Description

One Albatra metal

Technical field

The invention belongs to field of alloy material, particularly relate to an Albatra metal.

Background technology

The wire now using, in particular for having wire and cable of mobile or vibrations place etc., mainly uses Annealed copper wire or be coated with thereon stannum etc. the stranded formation of copper cash the chloroethene twisted thread as conductor, this conductor is coated with concentric circles The electric wire of the insulator such as alkene or glue connection vinyl chloride.

Recently the requirement also more and more higher to the durability, folding resistance and electric conductivity of wire.Angle from save energy Set out, the diameter reducing wire conductor is to mitigate weight and material-saving, but the powered-on capacity of conventional wire conductor is certain , reduce the diameter of wire and also reduce the reduction by capacity.And the reduction of wire conductor diameter leads under folding quality Fall, therefore existing electric wire cannot meet these requirements.

Content of the invention

It is an object of the invention to provide the improvement of a Cu alloy material, the strong of copper alloy can be improved by this technical scheme Degree and electrical conductivity, also ensure while ensureing powered-on capacity or improve folding quality.

The present invention is achieved by the following technical solutions:

One Albatra metal, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-3.5%, The silver of 0.01-0.03%, the indium of 0.01-0.03%, the yttrium of 0.01-0.03%, the ruthenium of 0.01-0.05%, 0.03-0.05%'s Scandium, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.003-0.03%, remaining is copper and inevitable impurity.

The composition composition of described copper alloy further includes by weight percentage: the stannum of 0.1-0.6%, 0.06-0.8% Cobalt, the phosphorus of 0.01-0.05%, one or more of ferrum of 0.05-0.1% combine.

The composition composition of described copper alloy further includes by weight percentage: the manganese of 0.02-0.1% and 0.08- One of 0.2% magnesium or two kinds of combinations.

The invention has the beneficial effects as follows；

The electrical conductivity of copper alloy by adding lanthanide rare metal in the inventive solutions, can be effectively improved, Because the electrical conductivity of nickel and silicon etc. is less than the electrical conductivity of copper in the alloy, powered-on capacity after adding the material such as nickel and silicon Reduce, but after adding lanthanide rare metal, the electrical conductivity of copper alloy improves the electrical conductivity of even more than copper on the contrary.

Specific embodiment

Below by way of specific embodiment, the present invention is described in detail.

Each composition is all measured by the percentage by weight in the present invention.

The addition of nickel and silicon, in order to improve the element of the intensity of copper alloy, forms tantnickel analysis by nickel and silicon in copper alloy Go out thing to improve the intensity of copper alloy, the weight percent content of nickel is 1.5-3.5%, and the weight percentage of silicon is 0.4- 0.6%.Although both elements can strengthen the intensity of copper alloy, the electrical conductivity of both elements is less than the electrical conductivity of copper very Many, the amount of addition excessively can affect the electrical conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity declines.

Add lanthanide rare metal in the technical program, this rare earth metal can change the crystal row within copper alloy Row, the percent of pass improving electronics can improve the powered-on capacity of copper alloy, the use of applicable lanthanide rare metal in the present invention Measure as 0.003-0.03%.It is of course possible to increase the consumption of lanthanide rare metal, but increased excessively on the contrary according to the purposes of wire Improve the cost of copper alloy, and the conductivity of copper alloy will not be further added by when usage amount is more than 1.0% on the contrary.

For the Cu alloy material of the present invention, can also be containing at least one in stannum, ferrum, cobalt, phosphorus, phosphorus in these elements The intensity of Cu alloy material can be increased, but consumption excessively can affect the toughness of Cu alloy material.Other several elements can Increase and while Cu alloy material intensity, improve bending endurance quality, specific consumption is the stannum of 0.1-0.6%, 0.01- 0.03% indium, the yttrium of 0.01-0.03%, the cobalt of 0.06-0.8%, the phosphorus of 0.01-0.05%, the ferrum of 0.05-0.1%.When this The consumption of a little elements can affect the electrical conductivity of Cu alloy material when excessive.

Can also be from least one in magnesium and two kinds of elements of manganese in the present invention, both elements can prevent from heating Brittle and improve hot-working character aspect and have very big advantage, advantageously reduce diameter of wire.But the consumption of both elements surpasses The electric conductivity of copper alloy can be significantly affected when 0.5%, the consumption of both elements is 0.02-0.1%'s in the present invention Manganese and/or the magnesium of 0.08-0.2%.

Using high-frequency melting stove, each component is melted casting copper base in embodiments of the invention 1-6, by copper base at 900 DEG C After carrying out hot extrusion, pure fire processes and obtains pole immediately, then cold drawn obtains expecting material.

Composition in each specific embodiment and performance are shown in Table 1

Table 1

By above example, comprise only nickel, the conductivity highest of the copper alloy of silicon and lanthanide rare metal is close to copper Conductivity, but intensity is not high.The preferred embodiment of the present invention is 3 and 4.

Claims

1. an Albatra metal it is characterised in that: the composition of described Cu alloy material composition includes by weight percentage: 1.5- 3.5% nickel, the silver of 0.01-0.03%, the indium of 0.01-0.03%, the yttrium of 0.01-0.03%, the ruthenium of 0.01-0.05%, The scandium of 0.03-0.05%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.003-0.03%, remaining is copper and inevitably Impurity.

2. an Albatra metal according to claim 1 it is characterised in that: the composition of described Cu alloy material forms by weight Percentage ratio further includes: the stannum of 0.1-0.6%, the cobalt of 0.06-0.8%, the phosphorus of 0.01-0.05%, 0.05-0.1%'s One or more of ferrum combines.

3. a kind of copper alloy for wire according to claim 1 and 2 it is characterised in that: described Cu alloy material Composition composition further includes by weight percentage: one of the manganese of 0.02-0.1% and the magnesium of 0.08-0.2% or two kinds Combination.