JPS63317277A - Gold alloy filler metal for brazing - Google Patents
Gold alloy filler metal for brazingInfo
- Publication number
- JPS63317277A JPS63317277A JP15170087A JP15170087A JPS63317277A JP S63317277 A JPS63317277 A JP S63317277A JP 15170087 A JP15170087 A JP 15170087A JP 15170087 A JP15170087 A JP 15170087A JP S63317277 A JPS63317277 A JP S63317277A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- gold
- occurrence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 23
- 239000000945 filler Substances 0.000 title abstract 7
- 239000002184 metal Substances 0.000 title abstract 7
- 229910052751 metal Inorganic materials 0.000 title abstract 7
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 3
- 239000003353 gold alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 12
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 229910052796 boron Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 4
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000007747 plating Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910002708 Au–Cu Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、金ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in gold solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用金ろう合金としては、金に銅を
２０〜６３重量％の範囲で添加した金−銅合金が主に用
いられている。(Prior art and its problems) In general, gold brazing alloys for brazing materials in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc. are mainly gold-copper alloys in which 20 to 63% by weight of copper is added to gold. It is used in
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう打部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the soldered parts and blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
金ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a gold solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の金ろう合金は、銅１０〜８０重量％、ボロン、
ガリウム、ゲルマニウムの少なくとも１種０．００１〜
１．５重量％、残部金より成るものである。(Means for solving the problems) The gold solder alloy of the present invention contains 10 to 80% by weight of copper, boron,
At least one of gallium and germanium 0.001~
It consists of 1.5% by weight, the balance being gold.
本発明の金ろう合金において、ボロン、ガリウム、ゲル
マニウムの少なくとも１種を金−銅合金に含有させる理
由は、ろう付時溶融したろう材の表面張力を小さくし、
それによりろう付後のろう″表面の荒れを小さくし、凹
凸の発生を抑制する為である。In the gold brazing alloy of the present invention, the reason why at least one of boron, gallium, and germanium is contained in the gold-copper alloy is to reduce the surface tension of the brazing material melted during brazing,
This is to reduce the roughness of the solder's surface after brazing and to suppress the occurrence of unevenness.
そしてそれの含有量を０．００１〜１．５重量％と限定
した理由は、０．００１重量％未満ではろう付後のろう
表面の荒れ及び凹凸の発生を抑制することができず、ま
た１、５重量％を超えると極端にろう流れが生じ、母材
を汚損し、さらにろう付強度に悪影響を及ぼすからであ
る。The reason why the content is limited to 0.001 to 1.5% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing. This is because, if the content exceeds 5% by weight, excessive solder flow will occur, staining the base material, and having an adverse effect on brazing strength.
次に本発明の金ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the gold brazing alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左欄に示す実施例と従来例１〜２の金ろうを
水素雰囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍ
ｎをメタライズし、さらにその上にニッケルめっきを５
μ施し、その部分に鉄−ニッケル４２重量％から成るリ
ードフレームのろう付を行い、ろう付後のろう表面の凹
凸（溝）の個数及び凹凸（溝）の深さを測定したところ
下記の表の右欄に示すような結果を得た。(Example) The gold solders of Examples and Conventional Examples 1 and 2 shown in the left column of the table below were applied to Mo-M on alumina for IC packages in a hydrogen atmosphere.
metallize n and further nickel plating on top of it.
A lead frame made of 42% iron-nickel by weight was brazed to that part, and the number of unevenness (grooves) and the depth of the unevenness (grooves) on the soldering surface after brazing were measured, and the results are shown in the table below. The results shown in the right column were obtained.
（以下余白）
上記の表の右欄の数値で明らかなように本発明の金ろう
合金は、従来の金ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。(Left below) As is clear from the numbers in the right column of the table above, the gold solder alloy of the present invention has fewer unevenness (grooves) than conventional gold solder alloys, and also has fewer unevenness (grooves). The depth is shallow.
（発明の効果）
以上詳記した通り本発明による金ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう打部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the gold brazing alloy according to the present invention has less roughness on the solder surface after brazing and less occurrence of unevenness, so brazed parts can be cleaned with acid or subjected to plating treatment. The amount of cleaning liquid that penetrates into the unevenness of the solder surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the soldered part. be.
Claims (1)
の少なくとも１種０．００１〜１．５重量％、残部金よ
り成る金ろう合金。A gold brazing alloy consisting of 10 to 80% by weight of copper, 0.001 to 1.5% by weight of at least one of boron, gallium, and germanium, and the balance gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170087A JPS63317277A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170087A JPS63317277A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317277A true JPS63317277A (en) | 1988-12-26 |
Family
ID=15524353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15170087A Pending JPS63317277A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317277A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366493A (en) * | 1989-08-04 | 1991-03-22 | Ngk Spark Plug Co Ltd | Material for brazing |
-
1987
- 1987-06-18 JP JP15170087A patent/JPS63317277A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366493A (en) * | 1989-08-04 | 1991-03-22 | Ngk Spark Plug Co Ltd | Material for brazing |
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