JPS63317281A - Gold alloy filler metal for brazing - Google Patents
Gold alloy filler metal for brazingInfo
- Publication number
- JPS63317281A JPS63317281A JP62151704A JP15170487A JPS63317281A JP S63317281 A JPS63317281 A JP S63317281A JP 62151704 A JP62151704 A JP 62151704A JP 15170487 A JP15170487 A JP 15170487A JP S63317281 A JPS63317281 A JP S63317281A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- gold
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title abstract description 20
- 239000000945 filler Substances 0.000 title abstract 7
- 239000002184 metal Substances 0.000 title abstract 7
- 229910052751 metal Inorganic materials 0.000 title abstract 7
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 3
- 239000003353 gold alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 229910052796 boron Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 4
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910002482 Cu–Ni Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、金ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in gold solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用金ろう合金としては、金に銅を
１５〜６２重量％、ニッケル２〜５重量％の範囲で添加
した金−銅−ニッケル合金が主に用いられている。(Prior art and its problems) Generally, as a gold brazing alloy for use in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc., copper is added to gold in a range of 15 to 62% by weight and nickel in a range of 2 to 5% by weight. Gold-copper-nickel alloys are mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう打部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the soldered parts and blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
金ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a gold solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の金ろう合金は、銅１０〜７０重量％、二・７ケ
ル１〜８重盪％、ボロン、ガリウム、ゲルマニウムの少
なくとも１種０．００１〜１．０重量％、残部金より成
るものである。(Means for Solving the Problems) The gold brazing alloy of the present invention contains 10 to 70% by weight of copper, 1 to 8% by weight of 2.7 Kel, and 0.001 to 1% of at least one of boron, gallium, and germanium. .0% by weight, the balance being gold.
本発明の金ろう合金において、ボロン、ガリウム、ゲル
マニウムの少なくとも１種を金−銅−ニッケル合金に含
有させる理由は、ろう付時溶融したろう材の表面張力を
小さくし、それによりろう付部のろう表面の荒れを小さ
くし、凹凸の発斗を抑制する為である。In the gold brazing alloy of the present invention, the reason why at least one of boron, gallium, and germanium is contained in the gold-copper-nickel alloy is to reduce the surface tension of the melted brazing material during brazing, thereby reducing the surface tension of the brazed part. This is to reduce the roughness of the solder surface and suppress the appearance of irregularities.
そしてそれの含有量をｏ、ｏｏｔ〜１．０重量％と限定
した理由は、０．００１重量％未満ではろう付部のろう
表面の荒れ及び凹凸の発生を抑制することができず、ま
た１、０重量％を超えると極端にろう流れが生じ、母材
を汚損し、さらにろう付強度に悪影響を及ぼすからであ
る。The reason for limiting the content to o,oot~1.0% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the brazed surface of the brazed part, and This is because if the content exceeds 0% by weight, the solder will excessively flow, staining the base material, and having an adverse effect on the brazing strength.
次に本発明の金ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the gold brazing alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左欄に示す実施例と従来例の金ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭＯ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−ニッケル４２重量％から成るリードフ
レームのろう付を行い、ろう付部のろう表面の凹凸（溝
）の個数及び凹凸（溝）の深さを測定したところ下記の
表の右欄に示すような結果を得た。(Example) The gold solders of the example and conventional example shown in the left column of the table below were metallized with MO-Mn on alumina for IC packages in a hydrogen atmosphere, and then 5 μm of nickel was plated on top of that. A lead frame made of 42% iron and nickel by weight was brazed to the surface of the soldered part, and the number of irregularities (grooves) and the depth of the irregularities (grooves) on the brazed surface of the brazed part were measured, and the results are shown in the right column of the table below. I got similar results.
上記の表の右欄の数値で明らかなように本発明の余ろう
合金は、従来の金ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。As is clear from the values in the right column of the table above, the surplus brazing alloy of the present invention has fewer unevenness (grooves) than conventional gold brazing alloys, and the depth of the unevenness (grooves) is shallower. It is something.
（発明の効果）
以上詳記した通り本発明による金ろう合金は、ろう付部
のろう表面の荒れが少な（、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう打部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the gold brazing alloy according to the present invention has less roughness on the solder surface of the brazed part (and less occurrence of unevenness). Even after treatment, the amount of cleaning liquid that enters into the unevenness of the wax surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the waxed part. There is.
Claims (1)
ガリウム、ゲルマニウムの少なくとも１種０．００１〜
１．０重量％、残部金より成る金ろう合金。Copper 10-70% by weight, nickel 1-8% by weight, boron,
At least one of gallium and germanium 0.001~
A gold braze alloy consisting of 1.0% by weight and the balance being gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62151704A JPS63317281A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62151704A JPS63317281A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317281A true JPS63317281A (en) | 1988-12-26 |
Family
ID=15524444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62151704A Pending JPS63317281A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317281A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007090430A (en) * | 2005-09-28 | 2007-04-12 | General Electric Co <Ge> | GOLD/NICKEL/COPPER BRAZING ALLOY FOR BRAZING WC-Co TO TITANIUM ALLOY |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191453U (en) * | 1982-06-17 | 1983-12-20 | 日本電気株式会社 | Vibration isolator |
| JPS5977640U (en) * | 1982-11-18 | 1984-05-25 | 三菱製鋼株式会社 | Vibration isolation table |
-
1987
- 1987-06-18 JP JP62151704A patent/JPS63317281A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191453U (en) * | 1982-06-17 | 1983-12-20 | 日本電気株式会社 | Vibration isolator |
| JPS5977640U (en) * | 1982-11-18 | 1984-05-25 | 三菱製鋼株式会社 | Vibration isolation table |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007090430A (en) * | 2005-09-28 | 2007-04-12 | General Electric Co <Ge> | GOLD/NICKEL/COPPER BRAZING ALLOY FOR BRAZING WC-Co TO TITANIUM ALLOY |
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