CN106077867A - A kind of soldering tungstenio powder metallurgy is with polynary copper silver nickel niobium zirconium solder - Google Patents
A kind of soldering tungstenio powder metallurgy is with polynary copper silver nickel niobium zirconium solder Download PDFInfo
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- CN106077867A CN106077867A CN201610564583.XA CN201610564583A CN106077867A CN 106077867 A CN106077867 A CN 106077867A CN 201610564583 A CN201610564583 A CN 201610564583A CN 106077867 A CN106077867 A CN 106077867A
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- tungstenio
- powder metallurgy
- solder
- soldering
- copper silver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a kind of polynary copper silver nickel niobium zirconium solder of soldering tungstenio powder metallurgy, its objective is that realizing tungstenio powder metallurgy is reliably connected with steel with tungstenio powder metallurgy, tungstenio powder metallurgy.This solder alloying component based on Cu, Ag, alloy phase diagram according to element and the mechanism of action of various addition element, add Ni, Nb and Zr element to come from different backgrounds and possess different abilities copper silver nickel niobium zirconium solder, brazing filler metal alloy composition (Wt/%) by mass percentage: copper (Cu): 60 80, silver (Ag): 10 30, nickel (Ni): 15, niobium (Nb): 15, zirconium (Zr) 0.1 0.5.
Description
Technical field
The present invention relates to a kind of soldering tungstenio powder metallurgy with polynary copper silver nickel niobium zirconium solder, be applied to tungstenio powder metallurgy
Soldering and the soldering of tungstenio powder metallurgy and other metals, belong to welding and interconnection technique field.
Background technology
Tungstenio powder metallurgy is a kind of with tungsten as hard phase, the composite wood constituted for Binder Phase with nickel, copper or nickel, ferrum etc.
Material, has high heat conduction, high intensity, high density, high-melting-point, low thermal coefficient of expansion, and excellent corrosion stability, non-oxidizability, shock resistance are tough
Property and the performance such as good ray absorption capacity, applied at numerous engineering fields, as manufactured big mouth at military industry field
Footpath, rod-type kinetic energy penetrator bullet core material, machine gun armor piercing discarding sabot bullet core, counterweight and inertance element, bullet and warship canon bullet
Bullet material and some tactical missile in high-explosive fragmentation etc.；Field of machining manufacture drilling rod, connecting rod, cutter holder,
Knife bar, the pendulum of automatic watch, the compression mod of precision casting process and extrusion die etc..The development of any new material and application all from
Do not open secondary operations, only by secondary operations, material just can be made to be converted to product, and this process is required efficiently, low cost,
Meet the market demand in time.Tungstenio powder metallurgy has good ductility, can carry out rolling, swage, forge, car, milling, plane,
Cutting thread and tapping etc. machine, but, due to the physical and chemical performance that it is special, there is certain difficulty in welding.This is because
Tungstenio powder metallurgy heat conductivity is extremely strong, easily causes and do not fuse phenomenon during molten solder, require during welding to use energy density high,
Thermal weld stress amount is big, speed of welding is fast efficient welding technology and technique.Tungstenio powder metallurgy linear expansion coefficient is little, in joint
Residual stress can be produced, reduce mechanical property and the thermal shock resistance of joint.Under tungstenio powder metallurgy high temperature, chemism is strong,
Surface staining when 300 DEG C, when 500 DEG C, surface oxidation is serious, and welding process center tap easily aoxidizes, nitrogenizes, inhales hydrogen, weld seam
Metal grain is thick, requires to take protective measure during welding.Some research worker explore gas tungsten arc welding
(TIG), the technique such as welding (MIG) welding, laser welding, friction welding (FW), diffusion welding (DW) and soldering welding tungsten
Base powder alloy material.The power density of gas tungsten arc welding (TIG) and welding (MIG) is relatively
Low, in welding process, heat input is relatively big, and heat affected area width after welding, weld grain is thick, causes joint performance to be deteriorated.Laser
Directly welding tungstenio powder metallurgy, welding temperature is high, and considerably beyond the recrystallization temperature (1100 ± 5 DEG C) of tungsten, crystal grain is grown up
Quickly, the mechanical property of material substantially becomes fragile speed.Friction welding (FW) and diffusion welding (DW) are limited only by equipment, technique and joint form
Small parts and simple in construction parts can be welded.Use common money base and copper base solder soldering tungstenio powder metallurgy, due to tungsten
With silver, copper be formed without alloy, soldering effect is unsatisfactory, and the intensity of brazed seam is affected, and result of the test shows, soldered fitting
Shear strength is less than 200MPa.Welding processing technology moves towards practical important processing method as exploitation new material, has
Versatile and flexible, simple process；When manufacturing large-scale, complex components, machining, cast welding and forge welding method can be used, change
The least, it is simple for changing complexity, more gradually erection welding forms, and is only to shape one of optimum manufacturing process.Due to tungstenio powder
Alloy weldability is poor, can only be manufactured the parts of simple in construction by machining, largely constrain it at large scale structure
Complicated parts development application.
Summary of the invention
It is an object of the invention to provide a kind of polynary copper silver nickel niobium zirconium solder of soldering tungstenio powder metallurgy, it is achieved tungstenio powder
End alloy is reliably connected with steel with tungstenio powder metallurgy, tungstenio powder metallurgy.One of the present invention polynary copper silver nickel niobium
Zirconium solder, fusion temperature scope 800-900 DEG C, tungstenio powder metallurgy is had preferable wettability.
The above-mentioned purpose of the present invention is achieved in that a kind of polynary copper silver nickel niobium zirconium pricker of soldering tungstenio powder metallurgy
Material, using copper silver as the base alloy composition of solder, adds Ni, niobium and zr element and comes from different backgrounds and possess different abilities copper silver nickel niobium zirconium solder, solder
Alloying component (Wt/%) by mass percentage: copper (Cu): 60-80, silver (Ag): 10-30, nickel (Ni): 1-5, niobium (Nb): 1-
5, zirconium (Zr) 0.1-0.5.
Tungstenio powder metallurgy has the features such as high temperature resistant, antioxidation, anticorrosive, resistance to sudden heating, and especially excellent is anti-
High-temperature behavior, is the most all to utilize its high-temperature behavior to manufacture high temperature resistant parts, and therefore, tungstenio powder metallurgy closes with tungstenio powder
Gold, tungstenio powder metallurgy seldom use solder to be attached with steel.Tungsten interacts relatively under liquid and solid-state with copper, silver
Weak, use common money base and copper base solder poor to the wettability of tungstenio powder metallurgy, soldering joint strength is relatively low.Test table
Bright, the solder such as existing commercially available silver-base solder such as silver-bearing copper stannum, Ag-Cu-Zn, silver-bearing copper indium, Ag-Cu-Zn cadmium and silver-bearing copper titanium, soldered fitting room temperature
Shearing strength is generally less than 150-200MPa, and high temperature shearing strength is generally less than 100-130MPa (test temperature 400 DEG C).In order to
Improve the processing performance (wettability, cross flow and joint filling etc.) of solder, improve its physics, chemistry and mechanical property, the present invention
Described a kind of soldering tungstenio powder metallurgy, with polynary copper silver nickel niobium zirconium solder, takes addition polynary, trace alloying element
Method.The selection of alloying element is considered as following factor: (1) adjusts brazing filler metal alloy system fusion temperature scope and should be able to control
Between 800-1000 DEG C.In tungstenio powder metallurgy, the recrystallization temperature of tungsten is 1100 ± 5 DEG C, and the speed that crystal grain is grown up is very
Hurry up, brazing temperature is if it exceeds this temperature, and material substantially becomes fragile.Therefore, in the case of brazing member operating temperature allows, soldering
Temperature is tried not more than 1100 DEG C, and this just requires that the liquidus curve of solder not can exceed that 1000 DEG C.(2) manufacturability of solder is improved
The mechanical property of soldered fitting and can be improved.Experimental study find, if the alloying element of addition can be brazed material at liquid
Be mutually dissolved under state or solid-state or form compound, then solder in the liquid state can moistening mother metal, significantly improve soldered fitting
Mechanical property.(3) alloying element added should have the features such as fusing point height, calorific intensity height and corrosion resistance.
A kind of soldering tungstenio powder metallurgy of the present invention is alloy based on Cu, Ag with polynary copper silver nickel niobium zirconium solder
Composition, adds Ni, Nb and Zr element and comes from different backgrounds and possess different abilities copper silver nickel niobium zirconium solder.Ni, Nb and Zr fusing point is high, excellent corrosion resistance,
Can be mutually dissolved under liquid and solid-state with W or form compound.According to the alloy phase diagram of Cu Yu Ag, measure 28 (Wt/%) containing Cu,
Amount 72 (Wt/%), Cu Yu Ag containing Ag form binary eutectic, eutectic temperature 780 DEG C.Along with in Cu, Ag bianry alloy, the amount containing Cu increases
Adding, aluminium alloy liquidus temperature improves.When the amount containing Cu increases to 60 (Wt/%), aluminium alloy liquidus temperature reaches 905 DEG C；Measure containing Cu
When increasing to 80 (Wt/%), aluminium alloy liquidus temperature reaches 970 DEG C, if the amount containing Cu in solder is more than 80 (Wt/%), closes
Gold liquidus temperature is more than 1000 DEG C, and brazing temperature then will be more than 1100 DEG C, and result is that tungstenio powder metallurgy crystal grain is grown up, material
Material becomes fragile.Alloying component based on Cu, Ag, the amount containing Cu in solder should control at 60-80 (Wt/%).Conjunction according to W Yu Ni
Metallograph, W and Ni forms limit solid solution, and when 1000 DEG C, W maxima solubility in Ni is 12 (Wt/%), but under room temperature
W dissolubility in Ni is less, along with the increase of ni content in solder, the plasticity of solder and toughness reduce.According to Cu's Yu Ni
Alloy phase diagram, Cu and Ni forms unlimited solid solution, along with the increase of ni content in solder, also can make solder solid, liquid liquidus temperature
Improve.According to the alloy phase diagram of W Yu Nb, W Yu Nb forms unlimited solid solution, and tungsten is the efficient hardening element of Nb, but is as pricker
Containing the increase of Nb amount in material, the plasticity of tungstenio powder metallurgy soldered fitting/brittle transition temperature will rise, and crystal grain is the longest
Greatly.Zr is active element, adds Zr and can reduce solder liquid/gas surface tension and solder and tungstenio powder metallurgy solid-liquid in solder
Interfacial tension, is conducive to the affinity improving solder with tungstenio powder metallurgy, improves the solder wettability to tungstenio powder metallurgy.
According to the alloy phase diagram of W Yu Zr, under room temperature, W dissolubility in Zr is relatively low, forms β-Zr solid solution, measures more than 0.5 containing W
(Wt/%), then W is formed2Zr intermetallic compound；In contrast, under room temperature, Zr dissolubility in W is extremely low, along with in solder
Reducing containing the increase of Zr amount, the plasticity of solder and toughness, soldered fitting becomes fragile.A kind of soldering tungstenio powder metallurgy of the present invention is used
Polynary copper silver nickel niobium zirconium solder, according to the mechanism of action of various addition element, is considering the cost of solder, fusion temperature
On the basis of scope, processing performance, physics, chemistry and mechanical property, make a service test research to the alloying element added, control
Make the fusion temperature scope of polynary copper silver nickel niobium zirconium solder between 800-1000 DEG C, tungstenio powder metallurgy is had preferably
Wettability, determines that polynary copper silver nickel niobium zirconium brazing filler metal alloy composition, polynary copper silver nickel niobium zirconium brazing filler metal alloy composition press percent mass
Than meter (Wt/%): copper (Cu): 60-80, silver (Ag): 10-30, nickel (Ni): 1-5, niobium (Nb): 1-5, zirconium (Zr) 0.1-0.5.
Compared with prior art, the invention has the beneficial effects as follows:
A kind of soldering tungstenio powder metallurgy of the present invention is with polynary copper silver nickel niobium zirconium solder, and fusion temperature scope exists
Between 800-1000 DEG C, in the case of ensureing that brazing member operating temperature allows, improve fusion temperature and the soldering of solder as far as possible
The re-melting temperature of joint, it is ensured that the resistance to elevated temperatures of soldered fitting；Avoid again the crystal grain of tungsten in tungstenio powder metallurgy long simultaneously
Greatly.A kind of soldering tungstenio powder metallurgy of the present invention with polynary copper silver nickel niobium zirconium solder to tungstenio powder metallurgy wettability
Good, strong with the affinity of tungstenio powder metallurgy, soldered fitting shear strength is more than 200MPa.
Accompanying drawing explanation
Fig. 1 is that polynary copper silver nickel niobium zirconium solder is to tungstenio powder metallurgy wettability.
Fig. 2 is polynary copper silver nickel niobium zirconium solder brazing tungstenio powder metallurgy test specimen.
Note: owing to accompanying drawing can not have color, illustrate by gray scale.
Detailed description of the invention
The embodiment that is given by the following also combines accompanying drawing (Fig. 1 and 2) and is specifically described the inventive method further.
Fig. 1 is that polynary copper silver nickel niobium zirconium solder is to tungstenio powder metallurgy wettability.
Fig. 2 is polynary copper silver nickel niobium zirconium solder brazing tungstenio powder metallurgy test specimen, as seen from the figure, polynary copper silver nickel niobium zirconium pricker
Expect fabulous to tungstenio powder metallurgy wettability, moistening any surface finish, form good fillet.
A kind of soldering tungstenio powder metallurgy of the present invention with polynary copper silver nickel niobium zirconium solder, material therefor Cu, Ag,
Ni, Nb and Zr purity is 99.99%, determines brazing filler metal alloy by the result of study that makes a service test the alloying element added
Composition, brazing filler metal alloy composition (Wt/%) by mass percentage: copper (Cu): 60-80, silver (Ag): 10-30, nickel (Ni): 1-5,
Niobium (Nb): 1-5, zirconium (Zr) 0.1-0.5；Weigh Cu, Ag, Ni, Nb and Zr by EXPERIMENTAL DESIGN proportioning composition and put into ceramic crucible, then
It is placed in crucible in vacuum melting furnace to heat and melt and is prepared as polynary copper silver nickel niobium zirconium solder.Smelting temperature should control
1150-1200 DEG C of scope, temperature retention time 10 minutes, and fully alloying element is stirred.Smelt solder in aforementioned manners,
Composition is uniform, and solder total scaling loss coefficient is less than 0.1%.By national standard " GB/T 11364-2008 solder wetting test side
Method " and " GB/T 11363-2008 soldering joint strength test method " determines the wettability of solder and joint is anti-shearing by force
Degree.
A kind of soldering tungstenio powder metallurgy of the present invention with polynary copper silver nickel niobium zirconium solder, the technical specification reached:
(1) fusion temperature scope: 812-978 DEG C；(2) wettability is good: the wetting areas of tungstenio powder metallurgy is reached 130-
150mm2；(3) soldering tungstenio powder metallurgy joint bending stiffness is 235-245Mpa.
Cu, Ag, Ni, Nb and Zr metal that following all embodiments all use purity to be 99.99%, by the conjunction added
The gold element result of study that makes a service test determines brazing filler metal alloy composition, forms techniques below scheme, and brazing filler metal alloy composition presses matter
Amount percentages (Wt/%): copper (Cu): 60-80, silver (Ag): 10-30, nickel (Ni): 1-5, niobium (Nb): 1-5, zirconium (Zr) 0.1-
0.5；Weigh Cu, Ag, Ni, Nb and Zr by EXPERIMENTAL DESIGN proportioning composition and put into ceramic crucible, then crucible is placed in vacuum melting furnace
Middle heating fusing are prepared as polynary copper silver nickel niobium zirconium solder.Smelting temperature should control 1150-1200 DEG C of scope, during insulation
Between 10 minutes, and fully alloying element is stirred.
Embodiment see table 1:
More than 1 yuan of copper silver nickel niobium zirconium solder composition of table and the performance of soldering tungstenio powder metallurgy thereof
Claims (11)
1. a soldering tungstenio powder metallurgy is with polynary copper silver nickel niobium zirconium solder, it is characterised in that alloy based on Cu, Ag
Composition, adds Ni, Nb and Zr element and comes from different backgrounds and possess different abilities copper silver nickel niobium zirconium solder, and brazing filler metal alloy composition is by mass percentage
(Wt/%): copper (Cu): 60-80, silver (Ag): 10-30, nickel (Ni): 1-5, niobium (Nb): 1-5, zirconium (Zr) 0.1-0.5.
2. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:80, Ag:10, Ni:5, Nb:4.9, Zr:0.1.
3. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:75, Ag:20, Ni:2.8, Nb:2, Zr:0.2.
4. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:70, Ag:24, Ni:1, Nb:4.5, Zr:0.5.
5. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:65, Ag:28, Ni:4.9, Nb:2, Zr:0.1.
6. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:62, Ag:30, Ni:4.8, Nb:2.8, Zr:0.4.
7. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:80, Ag:15, Ni:2, Nb:2.7, Zr:0.3.
8. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:75, Ag:15, Ni:4.9, Nb:4.9, Zr:0.2.
9. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that pricker
Material alloying component (Wt/%) by mass percentage: Cu:70, Ag:24, Ni:2, Nb:3.5, Zr:0.5.
10. soldering tungstenio powder metallurgy as claimed in claim 1 a kind of is with polynary copper silver nickel niobium zirconium solder, it is characterised in that
Brazing filler metal alloy composition (Wt/%) by mass percentage: Cu:65, Ag:28, Ni:3, Nb:3.7, Zr:0.3.
11. soldering tungstenio powder metallurgies as claimed in claim 1 a kind of are with polynary copper silver nickel niobium zirconium solder, it is characterised in that
Brazing filler metal alloy composition (Wt/%) by mass percentage: Cu:60, Ag:30, Ni:4.8, Nb:5, Zr:0.2.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610564583.XA CN106077867B (en) | 2016-07-18 | 2016-07-18 | One kind soldering polynary copper silver nickel niobium zirconium solder of tungsten base powder alloy |
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| CN201610564583.XA CN106077867B (en) | 2016-07-18 | 2016-07-18 | One kind soldering polynary copper silver nickel niobium zirconium solder of tungsten base powder alloy |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151864A (en) * | 2020-01-16 | 2020-05-15 | 吉林大学 | Welding material and process for connecting tungsten-based powder alloy and low-expansion high-temperature alloy |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4009027A (en) * | 1974-11-21 | 1977-02-22 | Jury Vladimirovich Naidich | Alloy for metallization and brazing of abrasive materials |
| JPS63317288A (en) * | 1987-06-18 | 1988-12-26 | Tanaka Kikinzoku Kogyo Kk | Silver alloy filler metal for brazing |
| JPH0930870A (en) * | 1995-07-21 | 1997-02-04 | Toshiba Corp | Bonded material of ceramic metal and accelerating duct |
| CN102448663A (en) * | 2009-05-27 | 2012-05-09 | 京瓷株式会社 | Solder material, heat dissipation base using same, and electronic device |
| CN105127534A (en) * | 2015-09-18 | 2015-12-09 | 吉林大学 | Brazing connecting method for tungsten-based powder alloy die |
-
2016
- 2016-07-18 CN CN201610564583.XA patent/CN106077867B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4009027A (en) * | 1974-11-21 | 1977-02-22 | Jury Vladimirovich Naidich | Alloy for metallization and brazing of abrasive materials |
| JPS63317288A (en) * | 1987-06-18 | 1988-12-26 | Tanaka Kikinzoku Kogyo Kk | Silver alloy filler metal for brazing |
| JPH0930870A (en) * | 1995-07-21 | 1997-02-04 | Toshiba Corp | Bonded material of ceramic metal and accelerating duct |
| CN102448663A (en) * | 2009-05-27 | 2012-05-09 | 京瓷株式会社 | Solder material, heat dissipation base using same, and electronic device |
| CN105127534A (en) * | 2015-09-18 | 2015-12-09 | 吉林大学 | Brazing connecting method for tungsten-based powder alloy die |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151864A (en) * | 2020-01-16 | 2020-05-15 | 吉林大学 | Welding material and process for connecting tungsten-based powder alloy and low-expansion high-temperature alloy |
| CN111151864B (en) * | 2020-01-16 | 2021-03-12 | 吉林大学 | Welding material and process for connecting tungsten-based powder alloy and low-expansion high-temperature alloy |
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| CN106077867B (en) | 2018-05-04 |
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