JPS63317275A - Gold alloy filler metal for brazing - Google Patents
Gold alloy filler metal for brazingInfo
- Publication number
- JPS63317275A JPS63317275A JP15169887A JP15169887A JPS63317275A JP S63317275 A JPS63317275 A JP S63317275A JP 15169887 A JP15169887 A JP 15169887A JP 15169887 A JP15169887 A JP 15169887A JP S63317275 A JPS63317275 A JP S63317275A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- gold
- occurrence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 21
- 239000000945 filler Substances 0.000 title abstract description 9
- 229910052751 metal Inorganic materials 0.000 title abstract description 9
- 239000002184 metal Substances 0.000 title abstract description 9
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 3
- 239000003353 gold alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 12
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 229910052748 manganese Inorganic materials 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910017398 Au—Ni Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、金ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in gold solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパンケ
ージ等におけるろう材用金ろう合金としては、金にニッ
ケルを１７〜２５重量％の範囲で添加した金−ニッケル
合金が主に用いられている。(Prior art and its problems) In general, gold brazing alloys for use in vacuum circuit breakers, electron tubes, thyristors, IC pancakes, etc. are mainly gold-nickel alloys in which 17 to 25% by weight of nickel is added to gold. It is used in
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう材部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the brazing metal or blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
金ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a gold solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の余ろう合金は、ニッケル１０〜２７重量％、ク
ロム、パラジウム、マンガンの少なくとも１種０．００
１〜１．０重量％、残部金より成るものである。(Means for Solving the Problems) The residual wax alloy of the present invention contains 10 to 27% by weight of nickel, 0.00% of at least one of chromium, palladium, and manganese.
It consists of 1 to 1.0% by weight, the balance being gold.
本発明の金ろう合金において、クロム、パラジウム、マ
ンガンの少なくとも１種を金−ニッケル合金に含有させ
る理由は、ろう付時溶融したろう材の表面張力を小さく
し、それによりろう付後のろう表面の荒れを小さくし、
凹凸の発生を抑制する為である。In the gold solder alloy of the present invention, the reason why at least one of chromium, palladium, and manganese is contained in the gold-nickel alloy is to reduce the surface tension of the solder metal melted during brazing, thereby reducing the surface tension of the solder material after brazing. reduce the roughness of
This is to suppress the occurrence of unevenness.
そしてそれの含有量を０．００１〜１．０重量％と限定
した理由は、０．００１重量％未満ではろう付後のろう
表面の荒れ及び凹凸の発生を抑制することができず、ま
た１、０重量％を超えると極端にろう流れが悪く、ろう
付強度に悪影響を及ぼすからである。The reason for limiting the content to 0.001 to 1.0% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing, and 1. This is because if it exceeds 0% by weight, the flow of the solder will be extremely poor and the brazing strength will be adversely affected.
次に本発明の金ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the gold brazing alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左横に示す実施例と従来例１〜２の金ろうを
水素雰囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍ
ｎをメタライズし、さらにその上にニッケルめっきを５
μ施し、その部分に鉄−ニッケル４２重量％から成るリ
ードフレームのろう付を行い、ろう付後のろう表面の凹
凸（溝）の個数及び凹凸（溝）の深さを測定したところ
下記の表の右欄に示すような結果を得た。(Example) The gold solders of Examples and Conventional Examples 1 and 2 shown on the left side of the table below were applied to Mo-M on alumina for IC packages in a hydrogen atmosphere.
metallize n and further nickel plating on top of it.
A lead frame made of 42% iron-nickel by weight was brazed to that part, and the number of unevenness (grooves) and the depth of the unevenness (grooves) on the soldering surface after brazing were measured, and the results are shown in the table below. The results shown in the right column were obtained.
（以下余白）
上記の表の右欄の数値で明らかなように本発明の余ろう
合金は、従来の余ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。(Left below) As is clear from the numbers in the right column of the table above, the residual filler alloy of the present invention has fewer unevenness (grooves) than conventional residual filler alloys, and also has fewer unevenness (grooves). The depth is shallow.
（発明の効果）
以上詳記した通り本発明による金ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少な（、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう打部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the gold brazing alloy according to the present invention has less roughness on the solder surface after brazing and less occurrence of unevenness (therefore, brazed parts can be cleaned with acid or plated). Even after treatment, the amount of cleaning liquid that enters into the unevenness of the wax surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the waxed part. There is.
Claims (1)
ガンの少なくとも１種０．００１〜１．０重量％、残部
金より成る金ろう合金。A gold brazing alloy consisting of 10 to 27% by weight of nickel, 0.001 to 1.0% by weight of at least one of chromium, palladium, and manganese, and the balance gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15169887A JPS63317275A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15169887A JPS63317275A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317275A true JPS63317275A (en) | 1988-12-26 |
Family
ID=15524308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15169887A Pending JPS63317275A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317275A (en) |
-
1987
- 1987-06-18 JP JP15169887A patent/JPS63317275A/en active Pending
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