JPS63317295A - Palladium alloy filler metal for brazing - Google Patents
Palladium alloy filler metal for brazingInfo
- Publication number
- JPS63317295A JPS63317295A JP15169487A JP15169487A JPS63317295A JP S63317295 A JPS63317295 A JP S63317295A JP 15169487 A JP15169487 A JP 15169487A JP 15169487 A JP15169487 A JP 15169487A JP S63317295 A JPS63317295 A JP S63317295A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- amt
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 title abstract description 9
- 239000002184 metal Substances 0.000 title abstract description 9
- 239000000945 filler Substances 0.000 title abstract description 8
- 229910001252 Pd alloy Inorganic materials 0.000 title abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 12
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 10
- 239000000956 alloy Substances 0.000 claims abstract description 10
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 22
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 6
- 229910052748 manganese Inorganic materials 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 3
- 238000007788 roughening Methods 0.000 abstract 2
- 229910002528 Cu-Pd Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、パラジウムろう合金の改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in palladium braze alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター等におけるろ
う併用パラジウムろう合金としては、パラジウム−銀−
銅系のろう材が主に用いられている。(Prior art and its problems) In general, palladium-silver-
Copper-based brazing filler metals are mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう材部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the brazing metal or blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
パラジウムろう合金を提供せんとするものである。(Objective of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a palladium brazing alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明のパラジウムろう合金は、銅１５〜３５重量％、
パラジウム５〜２５重量％、クロム、マンガンの少なく
とも１種０．００１〜１．０重量％、残部銀より成るも
のである。(Means for solving the problems) The palladium brazing alloy of the present invention contains 15 to 35% by weight of copper,
It consists of 5-25% by weight of palladium, 0.001-1.0% by weight of at least one of chromium and manganese, and the balance silver.
本発明のパラジウムろう合金において、クロム、マンガ
ンの少なくとも１種を銀−銅−パラジウム合金に含有さ
せる理由は、ろう付時溶融したろう材の表面張力を小さ
くし、それによりろう付後のろう表面の荒れを小さくし
、凹凸の発生を抑制する為である。In the palladium brazing alloy of the present invention, the reason why at least one of chromium and manganese is contained in the silver-copper-palladium alloy is to reduce the surface tension of the melted brazing material during brazing, thereby reducing the surface tension of the brazing material after brazing. This is to reduce roughness and suppress the occurrence of unevenness.
そしてその含有量を０．００１〜１．０重量％と限定し
た理由は、ｏ、ｏｏｔ重量％未満ではろう付後のろう表
面の荒れ及び凹凸の発生を抑制することができず、また
１、０重量％を超えると極端にろう流れが悪く、ろう付
強度に悪影響を及ぼすからである。The reason for limiting the content to 0.001 to 1.0% by weight is that if it is less than o,oot% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing, and 1. This is because if it exceeds 0% by weight, the flow of the solder will be extremely poor and the brazing strength will be adversely affected.
次に本発明のパラジウムろう合金の効果を明瞭ならしめ
る為にその具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the palladium brazing alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左欄に示す実施例と従来例１〜２のパラジウ
ムろうを水素雰囲気中で、電子管用アルミナにＭ ｏ
−Ｍ ｎをメタライズし、さらにその上にニッケルめっ
きを５μ施し、その部分に鉄−ニッケル４２重量％から
成るリードフレームのろう付を行い、ろう付後のろう表
面の凹凸（溝）の個数及び凹凸（溝）の深さを測定した
ところ下記の表の右欄に示すような結果を得た。(Example) Palladium solders of Examples and Conventional Examples 1 and 2 shown in the left column of the table below were applied to alumina for electron tubes in a hydrogen atmosphere.
-Mn is metallized, further 5μ of nickel plating is applied thereto, and a lead frame made of 42% iron-nickel by weight is brazed to that part, and the number of unevenness (grooves) on the soldering surface after brazing and When the depth of the unevenness (grooves) was measured, the results shown in the right column of the table below were obtained.
（以下余白）
上記の表の右欄の数値で明らかなように本発明の銀ろう
合金は、従来のパラジウムろう合金に比較して凹凸（溝
）の発生数が少なく、また凹凸（溝）の深さが浅いもの
である。(Left below) As is clear from the numbers in the right column of the table above, the silver solder alloy of the present invention has fewer irregularities (grooves) than conventional palladium solder alloys, and also has fewer irregularities (grooves). The depth is shallow.
（発明の効果）
以上詳記した通り本発明によるパラジウムろう合金は、
ろう付後のろう表面の荒れが少なく、凹凸の発生も少な
く、従ってろう付を行った部品を酸洗浄したり、めっき
処理したりしてもろう表面の凹凸に浸入する洗浄液等の
量が少なく、その結果それらを除去後の残存量も少なく
、それだけろう打部の変色、腐蝕を抑制することができ
るという優れた効果がある。(Effects of the Invention) As detailed above, the palladium braze alloy according to the present invention has
The solder surface is less rough after brazing and there are fewer irregularities, so even if the brazed parts are acid-washed or plated, the amount of cleaning liquid that gets into the irregularities of the solder surface is small. As a result, the amount remaining after their removal is small, which has the excellent effect of suppressing discoloration and corrosion of the soldered parts.
Claims (1)
ム、マンガンの少なくとも１種０．００１〜１．０重量
％、残部銀より成るパラジウムろう合金。A palladium brazing alloy consisting of 15-35% by weight of copper, 5-25% by weight of palladium, 0.001-1.0% by weight of at least one of chromium and manganese, and the balance silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15169487A JPS63317295A (en) | 1987-06-18 | 1987-06-18 | Palladium alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15169487A JPS63317295A (en) | 1987-06-18 | 1987-06-18 | Palladium alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317295A true JPS63317295A (en) | 1988-12-26 |
Family
ID=15524222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15169487A Pending JPS63317295A (en) | 1987-06-18 | 1987-06-18 | Palladium alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112779431A (en) * | 2020-12-25 | 2021-05-11 | 有研亿金新材料有限公司 | Method for improving sputtering property of palladium, silver and copper |
-
1987
- 1987-06-18 JP JP15169487A patent/JPS63317295A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112779431A (en) * | 2020-12-25 | 2021-05-11 | 有研亿金新材料有限公司 | Method for improving sputtering property of palladium, silver and copper |
| CN112779431B (en) * | 2020-12-25 | 2022-04-05 | 有研亿金新材料有限公司 | Method for improving sputtering property of palladium, silver and copper |
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