JPS6330792B2 - - Google Patents
Info
- Publication number
- JPS6330792B2 JPS6330792B2 JP57150554A JP15055482A JPS6330792B2 JP S6330792 B2 JPS6330792 B2 JP S6330792B2 JP 57150554 A JP57150554 A JP 57150554A JP 15055482 A JP15055482 A JP 15055482A JP S6330792 B2 JPS6330792 B2 JP S6330792B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- thickness
- organic film
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57150554A JPS5940595A (ja) | 1982-08-30 | 1982-08-30 | 回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57150554A JPS5940595A (ja) | 1982-08-30 | 1982-08-30 | 回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5940595A JPS5940595A (ja) | 1984-03-06 |
| JPS6330792B2 true JPS6330792B2 (OSRAM) | 1988-06-21 |
Family
ID=15499411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57150554A Granted JPS5940595A (ja) | 1982-08-30 | 1982-08-30 | 回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5940595A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03191231A (ja) * | 1989-12-20 | 1991-08-21 | Takenaka Komuten Co Ltd | 空気調和システム |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5432155A (en) * | 1977-08-15 | 1979-03-09 | Nec Corp | Thermo compression bonding apparatus |
| JPS5840728B2 (ja) * | 1978-08-23 | 1983-09-07 | 株式会社日立製作所 | 液晶表示装置 |
| JPS55140294A (en) * | 1979-04-20 | 1980-11-01 | Hitachi Ltd | Method of thermally connecting solderlessly flexible circuit board |
-
1982
- 1982-08-30 JP JP57150554A patent/JPS5940595A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03191231A (ja) * | 1989-12-20 | 1991-08-21 | Takenaka Komuten Co Ltd | 空気調和システム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5940595A (ja) | 1984-03-06 |
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