JPS6328988B2 - - Google Patents

Info

Publication number
JPS6328988B2
JPS6328988B2 JP61041699A JP4169986A JPS6328988B2 JP S6328988 B2 JPS6328988 B2 JP S6328988B2 JP 61041699 A JP61041699 A JP 61041699A JP 4169986 A JP4169986 A JP 4169986A JP S6328988 B2 JPS6328988 B2 JP S6328988B2
Authority
JP
Japan
Prior art keywords
target
shield plate
substrate
sputter target
sputter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61041699A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62222059A (ja
Inventor
Masaharu Nogami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4169986A priority Critical patent/JPS62222059A/ja
Publication of JPS62222059A publication Critical patent/JPS62222059A/ja
Publication of JPS6328988B2 publication Critical patent/JPS6328988B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP4169986A 1986-02-28 1986-02-28 スパツタリング方法 Granted JPS62222059A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4169986A JPS62222059A (ja) 1986-02-28 1986-02-28 スパツタリング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4169986A JPS62222059A (ja) 1986-02-28 1986-02-28 スパツタリング方法

Publications (2)

Publication Number Publication Date
JPS62222059A JPS62222059A (ja) 1987-09-30
JPS6328988B2 true JPS6328988B2 (enrdf_load_stackoverflow) 1988-06-10

Family

ID=12615663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4169986A Granted JPS62222059A (ja) 1986-02-28 1986-02-28 スパツタリング方法

Country Status (1)

Country Link
JP (1) JPS62222059A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09195035A (ja) * 1996-01-10 1997-07-29 Teijin Ltd 透明導電性フィルムの製造装置
JP5265149B2 (ja) * 2006-07-21 2013-08-14 アプライド マテリアルズ インコーポレイテッド マルチカソード設計用冷却暗部シールド
JP5708472B2 (ja) * 2011-12-21 2015-04-30 住友金属鉱山株式会社 マグネトロンスパッタリングカソード及びこれを備えたスパッタリング装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60230979A (ja) * 1984-05-01 1985-11-16 Hitachi Ltd スパツタリング方法

Also Published As

Publication number Publication date
JPS62222059A (ja) 1987-09-30

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