JPS62222059A - スパツタリング方法 - Google Patents

スパツタリング方法

Info

Publication number
JPS62222059A
JPS62222059A JP4169986A JP4169986A JPS62222059A JP S62222059 A JPS62222059 A JP S62222059A JP 4169986 A JP4169986 A JP 4169986A JP 4169986 A JP4169986 A JP 4169986A JP S62222059 A JPS62222059 A JP S62222059A
Authority
JP
Japan
Prior art keywords
target
shield plate
sputtering
sputtered film
sputter target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4169986A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6328988B2 (enrdf_load_stackoverflow
Inventor
Masaharu Nogami
野上　雅春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4169986A priority Critical patent/JPS62222059A/ja
Publication of JPS62222059A publication Critical patent/JPS62222059A/ja
Publication of JPS6328988B2 publication Critical patent/JPS6328988B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP4169986A 1986-02-28 1986-02-28 スパツタリング方法 Granted JPS62222059A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4169986A JPS62222059A (ja) 1986-02-28 1986-02-28 スパツタリング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4169986A JPS62222059A (ja) 1986-02-28 1986-02-28 スパツタリング方法

Publications (2)

Publication Number Publication Date
JPS62222059A true JPS62222059A (ja) 1987-09-30
JPS6328988B2 JPS6328988B2 (enrdf_load_stackoverflow) 1988-06-10

Family

ID=12615663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4169986A Granted JPS62222059A (ja) 1986-02-28 1986-02-28 スパツタリング方法

Country Status (1)

Country Link
JP (1) JPS62222059A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09195035A (ja) * 1996-01-10 1997-07-29 Teijin Ltd 透明導電性フィルムの製造装置
JP2008025031A (ja) * 2006-07-21 2008-02-07 Applied Materials Inc マルチカソード設計用冷却暗部シールド
JP2013129871A (ja) * 2011-12-21 2013-07-04 Sumitomo Metal Mining Co Ltd マグネトロンスパッタリングカソード及びこれを備えたスパッタリング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60230979A (ja) * 1984-05-01 1985-11-16 Hitachi Ltd スパツタリング方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60230979A (ja) * 1984-05-01 1985-11-16 Hitachi Ltd スパツタリング方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09195035A (ja) * 1996-01-10 1997-07-29 Teijin Ltd 透明導電性フィルムの製造装置
JP2008025031A (ja) * 2006-07-21 2008-02-07 Applied Materials Inc マルチカソード設計用冷却暗部シールド
JP2013129871A (ja) * 2011-12-21 2013-07-04 Sumitomo Metal Mining Co Ltd マグネトロンスパッタリングカソード及びこれを備えたスパッタリング装置

Also Published As

Publication number Publication date
JPS6328988B2 (enrdf_load_stackoverflow) 1988-06-10

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