JPS6326544B2 - - Google Patents

Info

Publication number
JPS6326544B2
JPS6326544B2 JP55031260A JP3126080A JPS6326544B2 JP S6326544 B2 JPS6326544 B2 JP S6326544B2 JP 55031260 A JP55031260 A JP 55031260A JP 3126080 A JP3126080 A JP 3126080A JP S6326544 B2 JPS6326544 B2 JP S6326544B2
Authority
JP
Japan
Prior art keywords
insulating film
wiring body
lower layer
film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55031260A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56126943A (en
Inventor
Hiroshi Tokunaga
Ryoji Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3126080A priority Critical patent/JPS56126943A/ja
Publication of JPS56126943A publication Critical patent/JPS56126943A/ja
Publication of JPS6326544B2 publication Critical patent/JPS6326544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP3126080A 1980-03-12 1980-03-12 Production of semiconductor device Granted JPS56126943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3126080A JPS56126943A (en) 1980-03-12 1980-03-12 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3126080A JPS56126943A (en) 1980-03-12 1980-03-12 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56126943A JPS56126943A (en) 1981-10-05
JPS6326544B2 true JPS6326544B2 (enrdf_load_stackoverflow) 1988-05-30

Family

ID=12326371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3126080A Granted JPS56126943A (en) 1980-03-12 1980-03-12 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56126943A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893261A (ja) * 1981-11-30 1983-06-02 Toshiba Corp 半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819129B2 (ja) * 1975-12-10 1983-04-16 株式会社東芝 ハンドウタイソウチノ セイゾウホウホウ

Also Published As

Publication number Publication date
JPS56126943A (en) 1981-10-05

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