JPS6325723B2 - - Google Patents
Info
- Publication number
- JPS6325723B2 JPS6325723B2 JP57049309A JP4930982A JPS6325723B2 JP S6325723 B2 JPS6325723 B2 JP S6325723B2 JP 57049309 A JP57049309 A JP 57049309A JP 4930982 A JP4930982 A JP 4930982A JP S6325723 B2 JPS6325723 B2 JP S6325723B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- dielectric
- electrode
- heat treatment
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 6
- 150000001879 copper Chemical class 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 238000007772 electroless plating Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZADPBFCGQRWHPN-UHFFFAOYSA-N boronic acid Chemical compound OBO ZADPBFCGQRWHPN-UHFFFAOYSA-N 0.000 description 1
- 238000009614 chemical analysis method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguides (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57049309A JPS58166806A (ja) | 1982-03-26 | 1982-03-26 | 高周波用誘電体セラミツク上に電極を形成する方法 |
| FR8304842A FR2523952B1 (fr) | 1982-03-26 | 1983-03-24 | Procede de formation d'une electrode sur une piece de ceramique dielectrique pour des applications en haute frequence |
| DE19833311046 DE3311046A1 (de) | 1982-03-26 | 1983-03-25 | Verfahren zur herstellung einer elektrode auf einem dielektrischen keramikmaterial fuer hochfrequenzanwendungen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57049309A JPS58166806A (ja) | 1982-03-26 | 1982-03-26 | 高周波用誘電体セラミツク上に電極を形成する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58166806A JPS58166806A (ja) | 1983-10-03 |
| JPS6325723B2 true JPS6325723B2 (US07122547-20061017-C00224.png) | 1988-05-26 |
Family
ID=12827343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57049309A Granted JPS58166806A (ja) | 1982-03-26 | 1982-03-26 | 高周波用誘電体セラミツク上に電極を形成する方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS58166806A (US07122547-20061017-C00224.png) |
| DE (1) | DE3311046A1 (US07122547-20061017-C00224.png) |
| FR (1) | FR2523952B1 (US07122547-20061017-C00224.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0362929U (US07122547-20061017-C00224.png) * | 1989-10-25 | 1991-06-19 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2705152B2 (ja) * | 1988-11-07 | 1998-01-26 | 松下電器産業株式会社 | 誘電体共振器の製造方法 |
| DE68920994T2 (de) * | 1988-11-07 | 1995-07-06 | Matsushita Electric Ind Co Ltd | Plattierungsanordnung für dielektrische Resonatoren. |
| JP2776023B2 (ja) * | 1990-10-25 | 1998-07-16 | 松下電器産業株式会社 | 誘電体共振器の製造方法 |
| JP2633387B2 (ja) * | 1990-11-20 | 1997-07-23 | 松下電器産業株式会社 | 誘電体共振器の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49117961A (US07122547-20061017-C00224.png) * | 1973-03-16 | 1974-11-11 | ||
| JPS50149541A (US07122547-20061017-C00224.png) * | 1974-05-24 | 1975-11-29 | ||
| JPS54108554A (en) * | 1978-02-13 | 1979-08-25 | Murata Manufacturing Co | Dielectric resonator |
| JPS5635497A (en) * | 1979-08-30 | 1981-04-08 | Murata Manufacturing Co | Method of improving adherence of copper film |
| JPS5635782A (en) * | 1979-08-29 | 1981-04-08 | Murata Mfg Co Ltd | Preventing method for oxidation of heat-treated copper film |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2448148A1 (de) * | 1974-09-16 | 1976-04-29 | Inst Metallurg Im 50 Letija Ss | Verfahren zur herstellung eines metallueberzuges auf erzeugnissen aus nichtmetallischen stoffen |
| DE2533524C3 (de) * | 1975-07-26 | 1978-05-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung eines Belages aus Kupfer oder einer Kupferlegierung auf einem Trägerkörper |
| JPS607026B2 (ja) * | 1979-05-12 | 1985-02-21 | 株式会社村田製作所 | 銅被膜の熱処理法 |
| JPS5646086A (en) * | 1979-09-25 | 1981-04-27 | Tokuyama Soda Kk | Adiabatic window material |
| JPS56115486A (en) * | 1980-02-15 | 1981-09-10 | Matsushita Electric Works Ltd | Heat insulating structure for glass door |
| DE3038976C2 (de) * | 1980-10-15 | 1986-05-22 | Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto | Verfahren und Vorrichtung zur Verbesserung der Eigenschaften eines auf einen Keramikkörper aufgebrachten Kupferfilms |
-
1982
- 1982-03-26 JP JP57049309A patent/JPS58166806A/ja active Granted
-
1983
- 1983-03-24 FR FR8304842A patent/FR2523952B1/fr not_active Expired
- 1983-03-25 DE DE19833311046 patent/DE3311046A1/de active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49117961A (US07122547-20061017-C00224.png) * | 1973-03-16 | 1974-11-11 | ||
| JPS50149541A (US07122547-20061017-C00224.png) * | 1974-05-24 | 1975-11-29 | ||
| JPS54108554A (en) * | 1978-02-13 | 1979-08-25 | Murata Manufacturing Co | Dielectric resonator |
| JPS5635782A (en) * | 1979-08-29 | 1981-04-08 | Murata Mfg Co Ltd | Preventing method for oxidation of heat-treated copper film |
| JPS5635497A (en) * | 1979-08-30 | 1981-04-08 | Murata Manufacturing Co | Method of improving adherence of copper film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0362929U (US07122547-20061017-C00224.png) * | 1989-10-25 | 1991-06-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58166806A (ja) | 1983-10-03 |
| DE3311046A1 (de) | 1983-10-20 |
| FR2523952A1 (fr) | 1983-09-30 |
| DE3311046C2 (US07122547-20061017-C00224.png) | 1993-05-13 |
| FR2523952B1 (fr) | 1986-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61121501A (ja) | 誘電体共振器およびその製造方法 | |
| JPS6325723B2 (US07122547-20061017-C00224.png) | ||
| JP2021530871A (ja) | バリスタパッシベーション層及びその製造方法 | |
| JP2633387B2 (ja) | 誘電体共振器の製造方法 | |
| US5220482A (en) | Thin film capacitor | |
| JP2002232204A (ja) | 電子部品及びその製造方法 | |
| JP2778432B2 (ja) | 誘電体フィルタ | |
| JP3453853B2 (ja) | 誘電体の製造方法及びその方法で製造された同軸型誘電体共振器 | |
| JPS634332B2 (US07122547-20061017-C00224.png) | ||
| JPH04264801A (ja) | 同軸誘電体共振器 | |
| JP2620672B2 (ja) | 同軸誘電体共振器の製造方法 | |
| JPH0884009A (ja) | 同軸型誘電体共振器の製造方法 | |
| JPH1155007A (ja) | 誘電体フィルタおよびその製造方法 | |
| JP2001028474A (ja) | 電子部品及びその製造方法 | |
| JPH0223034B2 (US07122547-20061017-C00224.png) | ||
| Lu et al. | Dielectric properties of titanate based ceramic capacitors using electroless Ni as contact electrodes | |
| JPH0377306A (ja) | 電極形成方法 | |
| JPH0818328A (ja) | 小型アンテナの製造方法 | |
| JPS6317219B2 (US07122547-20061017-C00224.png) | ||
| JPH04344701A (ja) | 同軸誘電体共振器の製造方法 | |
| JP2776023B2 (ja) | 誘電体共振器の製造方法 | |
| CN112531306A (zh) | 介质陶瓷组件、介质陶瓷通信电子元器件及其制造方法 | |
| JPH03292005A (ja) | 誘電体共振器の製造方法 | |
| KR100278540B1 (ko) | 이동 통신기기의 고주파용 유전체 세라믹 레조네이터 표면처리방법 | |
| JP3207114B2 (ja) | 誘電体共振器 |
