JPS63246215A - 成型装置 - Google Patents

成型装置

Info

Publication number
JPS63246215A
JPS63246215A JP7993387A JP7993387A JPS63246215A JP S63246215 A JPS63246215 A JP S63246215A JP 7993387 A JP7993387 A JP 7993387A JP 7993387 A JP7993387 A JP 7993387A JP S63246215 A JPS63246215 A JP S63246215A
Authority
JP
Japan
Prior art keywords
frame
positioning
force
positioning pin
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7993387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523571B2 (cg-RX-API-DMAC7.html
Inventor
Makoto Shimanuki
嶋貫　誠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7993387A priority Critical patent/JPS63246215A/ja
Publication of JPS63246215A publication Critical patent/JPS63246215A/ja
Publication of JPH0523571B2 publication Critical patent/JPH0523571B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7993387A 1987-03-31 1987-03-31 成型装置 Granted JPS63246215A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7993387A JPS63246215A (ja) 1987-03-31 1987-03-31 成型装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7993387A JPS63246215A (ja) 1987-03-31 1987-03-31 成型装置

Publications (2)

Publication Number Publication Date
JPS63246215A true JPS63246215A (ja) 1988-10-13
JPH0523571B2 JPH0523571B2 (cg-RX-API-DMAC7.html) 1993-04-05

Family

ID=13704116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7993387A Granted JPS63246215A (ja) 1987-03-31 1987-03-31 成型装置

Country Status (1)

Country Link
JP (1) JPS63246215A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPH0523571B2 (cg-RX-API-DMAC7.html) 1993-04-05

Similar Documents

Publication Publication Date Title
JPS62122136A (ja) レジンモールド半導体の製造方法および装置
JP6320448B2 (ja) 樹脂封止装置および樹脂封止方法
US3672046A (en) The method of making an electrical component
JPS63246215A (ja) 成型装置
US5672550A (en) Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
JP2022081454A (ja) プラグを製造するための方法および射出成形金型
US3793709A (en) Process for making a plastic-encapsulated semiconductor device
US6682952B2 (en) Method of forming the resin sealed semiconductor device using the lead frame
JPH065645A (ja) 半導体素子の樹脂成形方法
JPH10109330A (ja) モールド装置およびゲート切断方法ならびに半導体集積回路装置の製造方法
JPS5821344A (ja) 樹脂ペレツト供給装置
JPH01138724A (ja) 半導体装置のモールド方法および装置
KR20010037252A (ko) 반도체패키지 제조용 금형
JPH0620578Y2 (ja) 半導体射出成型機
JP2781233B2 (ja) リードフレームのモールド・フォーミング方法及びモールド・フォーミング装置
EP0106475A1 (en) Apparatus and method for semiconductor device packaging
US6911719B1 (en) Lead frame for resin sealed semiconductor device
JPS5830740B2 (ja) 半導体装置を製造するための装置
JP3117829B2 (ja) フープ状リードフレームに対するモールド部成形装置
JP3372481B2 (ja) 金属薄板加工装置の位置決め装置及び位置決め方法
JPH06216174A (ja) 半導体装置のトランスファモールド方法
JPH0671685A (ja) 樹脂成形装置
JPH0722451A (ja) 半導体製造装置
JPH0994834A (ja) 樹脂成形装置およびそれを用いて製造した半導体集積回路装置
JPS63947B2 (cg-RX-API-DMAC7.html)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term